Abstract:
Acetylacetone and an aqueous nitric acid are included in a solution in which organic metal compounds of metals constituting a ferroelectric in an organic solvent thereby forming a ferroelectric film formation solution. The solution is applied to a substrate, followed by drying and baking to obtain a ferroelectric film. As a consequence, even when forming a ferroelectric film such as a PZT or PLZT film containing a II group element in the periodic table, a stable ferroelectric film formation solution which prevents neither crystallization nor gelation and is reduced in a change with time in the viscosity thereof can be obtained. A ferroelectric film which contains a II group element and has excellent ferroelectric properties can be thus produced with ease.
Abstract:
In a solution for forming electron-emitting regions of electron-emitting devices, the solution contains a metal carboxylate expressed by the following general formula (I), an organic solvent and/or , and water; (R(COO)k)mM (I) where k=numeral from 1 to 4 , m=a numeral from 1 to 4, and R=CnX2n+1−k R=CnX2n+2−k where X=a hydrogen or halogen (total number of hydrogen and halogen atoms is 2n+1) , n=an integer from 0 to 30, and M=a metal, wherein the organic solvent is a carboxylic ester having the same carboxylic group as R(COO)k expressed in the general formula (I). In a manufacture method of electron-emitting devices each provided between electrodes with a conductive film including an electron-emitting region, a process of forming the conductive film includes a step of coating and calcining the above solution. An image-forming apparatus is manufactured by using the electron-emitting devices. Variations in sheet resistance values of electron-emitting region-forming thin films and characteristics of the electron-emitting devices are reduced.
Abstract:
A tracking resistant electrical insulating material or article suitable for medium to high voltage applications comprising a silane-modified polyolefin, and a heat-shrinkable article prepared therefrom. Said material or article is preferably prepared by a process comprising: (a) reacting polyolefin with a silane in the presence of a free-radical initiator to form a silane-grafted polyolefin, or copolymerising a polyolefin with silane; (b) preparing a mixture of one or more silane-modified polyolefins prepared in (a) with optionally one or more non silane-modified polyolefins, antitrack ingredients, and a silanol condensation catalyst; (c) forming the insulating material or article by melt extruding or moulding said mixture; and (d) crosslinking the insulating material or article by exposing it to moisture, preferably at elevated temperature. The silane-modified, moisture-crosslinkable polyolefin provides the insulating material with high resistance to tracking even in the absence of conventional anti-tracking fillers.
Abstract:
A method and a device for applying a sealant to an IC having bumps, which can solve a cobwebbing problem when a dispense nozzle is raised after the sealant has been applied and implement a productivity improvement; specifically, a method and a device for applying a sealant to an IC having bumps, wherein a dispense nozzle (12) is raised in a first stage (E) at a low speed simultaneously with the stop of dispensing until the first stage (E) covers a specified height and then it is raised in a second stage (F) at a high seed. The above design, in which the dispense nozzle (12) is raised in the first stage (E) at a low speed after the application of the sealant (2) and the nozzle (12) is then raised at a high speed and in a short time in the second stage (F), can positively break off the sealant (2) without inducing cobwebbing and enhance productivity.
Abstract:
Nanometer-size wires having a cross-sectional dimension of less than 8 nm with controllable lengths and diameters are produced by infiltrating latent nuclear or ion tracks formed in trackable materials with atomic species. The trackable materials and atomic species are essentially insoluble in each other, thus the wires are formed by thermally driven, self-assembly of the atomic species during annealing, or re-crystallization, of the damage in the latent tracks. Unlike conventional ion track lithography, the inventive method does not require etching of the latent tracks.
Abstract:
An electronic circuit device comprises a resin composition including 90 to 100 weight percent of a curable epoxy-modified aromatic vinyl-conjugated diene block copolymer, optionally up to 10 weight percent of an epoxy resin, and an effective amount of an epoxy curative, the weight percent of the copolymer and epoxy resin being based on the weight of the epoxy bearing material exclusive of curative. The resin composition can be used as an electronic adhesive, covercoat, or encapsulant. The electronic circuit device exhibits superior heat and moisture insensitivity, including the absence of voiding and delamination of the cured resin compostion from its substrate under conditions of 85° C. and 85% relative humidity for 168 hours followed by a temperature of 220° C. for 10 to 40 seconds.
Abstract:
The present invention provides a method of manufacturing a nickel-silicide technology for polysilicon interconnects. Nickel 40 is deposited on polysilicon 30 using a electroless process. Using a rapid thermal anneal process, Ni 40 is transformed to NiSi at about 600° C. without any agglomeration. The method comprises forming a polysilicon layer 30 over a substrate 10. The surface 34 of the polysilicon layer is activated. Nickel 40 is selectively electroless deposited onto the surface of the polysilicon layer forming a Nickel layer over the polysilicon layer. The Ni layer 40 is rapidly thermally annealed forming a Nickel silicide layer 36 over the polysilicon layer 30. The rapid thermal anneal is performed at a temperature of about 600° C. for a time of about 40 sec. The Nickel silicide layer 36 preferably comprises NiSi 36B with a low resistivity.
Abstract:
A magnetooptical recording medium includes a first magnetic layer, a second magnetic layer whose Curie temperature is lower than that of the first magnetic laye, and a third magnetic layer, comprising a vertically-magnetizing film, whose Curie temperature is higher than that of the second magnetic layer. The first magnetic layer, the second magnetic layer and the third magnetic layer are in a state of exchange coupling with each other at a portion of a vertically-magnetizing film. A domain walls formed in the first magnetic layer moves when the temperature of the medium has been raised to at least the Curie temperature of the second magnetic layer.
Abstract:
A lapping control sensor for a MR head includes a multi-layered structure of a metallic layer, an insulation layer, a resister layer and a lead conductor layer, and being provided in parallel with the MR head which has a multi-layered structure of at least a lower shield layer, a shield gap insulation layer, a MR layer and a lead conductor layer is provided. The insulation layer of the lapping control sensor has a thickness larger than that of the shield gap insulation layer of the MR head. The thickness of the insulation layer of the sensor is 0.1 &mgr;m or more.
Abstract:
Fine powder out of adequate particle size range discharged in a manufacturing process of resin magnet compound comprising step 1 of mixing magnet powder such as neodymium-iron-boron system quenched alloy and an organic solvent solution of a thermal polymerizing resin in wet process, and step 2 of solvent removal-pulverizing-sorting into adequate particle size range is processed again in step 1 and step 2, and resin magnet compound within adequate particle size range is obtained again, and moreover the green matter obtained by strong compression of the resin magnet compound into a desired magnet shape is processed again at step 2 to obtain fine powder, which is processed again at step 1 and step 2, so that resin magnet compound within adequate particle size is obtained again.