公开(公告)号：US20030055212A1

公开(公告)日：2003-03-20

申请号：US10208083

申请日：2002-07-29

Inventor： Michael S. Freund ,  Eiichi Shoji

IPC: C08G073/00

CPC classification number: H01B1/128 ,  G01N21/78 ,  G01N21/80

Abstract: A method for preparing a wide range of substituted poly(aniline)s from a single precursor is described. The method uses a variety of reactions, including a boron activation/electrophilic displacement reaction resulting in ipso-substitution. The ability to tune the properties of poly(aniline) through the generation of new structures is useful in numerous fields ranging from polymer-based electronics to sensors.

Abstract translation: 描述了从单一前体制备宽范围的取代的聚（苯胺）的方法。 该方法使用各种反应，包括导致ipso替代的硼活化/亲电位移反应。 通过生成新结构来调节聚（苯胺）的性能的能力在从聚合物基电子学到传感器的众多领域中是有用的。

公开(公告)号：US20030050433A1

公开(公告)日：2003-03-13

申请号：US10278310

申请日：2002-10-23

Inventor： Pawan Kumar Agarwal ,  Hsien-Chang Wang ,  Yu Feng Wang ,  Jean M. J. Frechet ,  Shah A. Haque

IPC: C08G073/00

CPC classification number: C08G83/003 ,  C08F8/26 ,  C08F8/46 ,  C08F2810/30 ,  C08F2810/40 ,  C08G81/00 ,  C08G81/02 ,  C08G81/024 ,  C08G83/001 ,  C08F110/10

Abstract: Polyisobutylene (PIB) functionalized with terminal reactive unsaturation is disclosed. Carbocationically polymerized monohalogen-terminated PIB is dehydrohalogenated in a hydrocarbon solvent using an alkoxide of the formula RO-M wherein R is alkyl of at least 5 carbon atoms and M is alkali metal. The PIB obtained has terminal unsaturation which is 100% in the reactive nullexonull form which can be converted to succinic anhydride groups (PIB-SA) by the ene reaction with maleic anhydride. The PIB-SA is reactive with amine functional dendrimers to obtain a star-branched polymer having a dendrimer core and PIB branches joined by succinimide linkages. Blends of the star-branched polymer with polypropylene have improved energy absorption properties and controllable moisture/oxygen permeabilities useful in films.

Abstract translation: 公开了用末端反应性不饱和官能化的聚异丁烯（PIB）。 碳氢化合物封端的PIB在烃溶剂中使用式RO-M的醇盐脱卤化氢，其中R是至少5个碳原子的烷基，M是碱金属。 得到的PIB具有末端不饱和度，其反应性“外”形式为100％，可通过与马来酸酐的烯酯反应转化为琥珀酸酐基团（PIB-SA），PIB-SA与胺官能树枝状大分子反应以获得 具有树枝状聚合物核心和通过琥珀酰亚胺键连接的PIB分支的星形支化聚合物。星形支化聚合物与聚丙烯的共混物具有改善的能量吸收性能和可用于膜中的水分/氧气渗透性。

公开(公告)号：US20030027970A1

公开(公告)日：2003-02-06

申请号：US10186658

申请日：2002-07-01

Inventor： Roland Haasmann ,  Marcus Halik ,  Gunter Schmid ,  Andreas Walter

IPC: C08G073/00 ,  C08G073/06 ,  C08G079/02

CPC classification number: H01L51/0036 ,  C08G61/10 ,  H01B1/127 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/0077 ,  H01L51/0078

Abstract: The organic polymers of the invention have electrical semiconductor properties. The compounds have a backbone of phenylene groups to which side groups with semiconductor properties, or which impart semiconductor properties to the polymer, are bonded. The polymers are obtained by Bergmann cyclization from compounds that contain aromatic groups to which vicinal ethynyl groups are bonded. The polymers are suitable for the production of semiconductor components, such as organic transistors or diodes.

Abstract translation: 本发明的有机聚合物具有电半导体性质。 这些化合物具有与具有半导体性质或赋予聚合物半导体性质的侧基键合的亚苯基的主链。 聚合物通过Bergmann环化从含有邻位乙炔基的芳族基团的化合物获得。 聚合物适用于制造半导体元件，例如有机晶体管或二极管。

公开(公告)号：US20020147300A1

公开(公告)日：2002-10-10

申请号：US10014348

申请日：2001-12-14

Inventor： Hiroshi Matsumoto

IPC: C08G073/00

CPC classification number: B41N3/08

Abstract: A dampening water composition for a lithographic printing plate comprising polyvinylpyrrolidone and at least one compound selected from the group consisting of acetylene alcohol, acetylene glycol, n-butyl alcohol, isobutyl alcohol, secondary-butyl alcohol, tertiary-butyl alcohol, a compound of (CH3)3CnullOnull(nullCH2nullCH2nullOnull)pnullH wherein p represents an integer of from 1 to 3, 3-methoxy-3-methylbutanol, 3-methoxybutanol, a compound represented by the following formula (I) and a compound represented by the following formula (II). 1 (wherein R represents n-butyl, isobutyl, tertiary-butyl or secondary-butyl group, and n represents an integer of 1 or 2.) 2 (wherein m represents an integer of from 1 to 3.) Said dampening water composition is comfortable and safe in working atmosphere and is excellent in printing stability, which can replace a dampening water composition comprising isopropyl alcohol. Said dampening water also exhibits favorable and stable printing properties under the conditions of printing machine members which rotate at high speed, and stable printing properties to various ink compositions so as to obtain excellent printing matters.

Abstract translation: 一种用于平版印刷版的润版水组合物，其包含聚乙烯吡咯烷酮和至少一种选自乙炔醇，乙炔二醇，正丁醇，异丁醇，仲丁醇，叔丁醇，（叔丁醇）， CH3）3C-O - （ - CH2-CH2-O-）pH，其中p表示1至3的整数，3-甲氧基-3-甲基丁醇，3-甲氧基丁醇，由下式（I）表示的化合物和 由下式（II）表示的化合物。 （其中R表示正丁基，异丁基，叔丁基或仲丁基，n表示1或2的整数）（其中m表示1〜3的整数。）所述润版水组合物舒适， 工作氛围安全，印刷稳定性优异，能够代替含有异丙醇的润湿水组合物。 所述润版水在高速旋转的印刷机构件的条件下也具有良好且稳定的印刷性能，并且对各种油墨组合物具有稳定的印刷性能，以获得优异的印刷品。

公开(公告)号：US20020128424A1

公开(公告)日：2002-09-12

申请号：US09742860

申请日：2000-12-21

Inventor： Brian C. Auman ,  William R. Corcoran JR. ,  John R. Dodd ,  Mark A. Guidry ,  John D. Summers

IPC: C08G073/00

CPC classification number: C08G73/1017 ,  C08G73/101 ,  C08G73/1014 ,  C08G73/1042 ,  C08G73/1071

Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

公开(公告)号：US20020123537A1

公开(公告)日：2002-09-05

申请号：US09977824

申请日：2001-10-15

Inventor： Miguel A. Dones ,  Ramesh L. Narayan

IPC: C08G059/00 ,  C08J003/28 ,  C08G075/04 ,  C08G073/00

CPC classification number: C08L71/02 ,  C08G59/04 ,  C08G65/337 ,  C08G2650/06 ,  C08G2650/16 ,  C08K5/00 ,  C08L63/00 ,  C08L2205/05 ,  C09D7/63 ,  C08L2666/04 ,  C08L71/00

Abstract: Nonaqueous compositions comprising at least one product of the reaction between A) a linking agent of formula IR4(Y)3nullnull(I)Wherein each Y group is a halogen atom or one Y group is a halogen atom and two Y groups represent an epoxy oxygen atom, which is attached to two adjacent carbon atoms in the R4 group to form an epoxy group, and R4 is an alkanetriyl group containing from 3 to 10 carbon atoms; and B) a compound of formula IIR3(EO)n(PO)m(BO)pXnullnull(II)Wherein R3 is substituted or unsubstituted, saturated or unsaturated, organic oxy or thio group having from 1 to 36 carbon atoms or a primary or secondary amino group having from 1 to 36 carbon atoms; n is a number of from 0 to 50; m is a number of from 0 to 50; p is a number of from 0 to 50; and X is hydrogen, or X can be a mercapto group, an amino group, or a C1-C6 alkylamino group in place of a terminal nullOH group, provided that when X is mercapto, amino or a C1-C6 alkylamino, the sum of n, m, and p must be at least 1; and the mole ratio of I:II is from about 0.1:1 to about 5:1.

Abstract translation: 包含至少一种式A的连接剂与式（I）中的反应的至少一种产物，其中在线式> R4（Y）3（I） 其中，Y基为卤素原子，Y基为卤素原子，Y基为氧基，R2相邻的碳原子形成环氧基，R4为烷基三乙酰基 含有3至10个碳原子; 和B）式II的化合物，其中R3是（Ⅰ）化合物，其中R3是 具有1至36个碳原子的取代或未取代的饱和或不饱和的有机氧基或硫基或具有1至36个碳原子的伯或仲氨基; n为0〜50的数; m是从0到50的数字; p是从0到50的数字; 并且X是氢，或X可以是巯基，氨基或C1-C6烷基氨基代替末端-OH基团，条件是当X是巯基，氨基或C1-C6烷基氨基时，总和 n，m和p必须至少为1; 且I：II的摩尔比为约0.1:1至约5:1。

公开(公告)号：US20020120091A1

公开(公告)日：2002-08-29

申请号：US10075258

申请日：2002-02-15

Inventor： Lisa Scott

IPC: C08G073/00 ,  B32B027/00

CPC classification number: C08G73/1032 ,  C08G73/1042 ,  H05K1/0346 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A poly amic acid precursor containing a combination of tetrahydrofuran and N-methylpyrrolidinone as cosolvents is described. Utilizing the combination of tetrahydrofuran and N-methylpyrrolidinone allows for the removal of significant portions of the solvent during the formation of the polyimide. The removal of tetrahydrofuran and N-methylpyrrolidinone can be done without the use of preheating zones so as to allow for the large scale production of polyimide articles.

Abstract translation: 描述了包含四氢呋喃和N-甲基吡咯烷酮作为助溶剂的组合的聚酰胺酸前体。 利用四氢呋喃和N-甲基吡咯烷酮的组合​​，可以在形成聚酰亚胺期间除去大部分溶剂。 可以在不使用预热区域的情况下除去四氢呋喃和N-甲基吡咯烷酮，以便大量生产聚酰亚胺制品。

公开(公告)号：US20020120090A1

公开(公告)日：2002-08-29

申请号：US09848525

申请日：2001-05-03

Applicant: Industrial Technology Research Institute

Inventor： Kung-Lung Cheng ,  Shu-Chen Lin ,  Wen-Ling Lui ,  Chih-Hsiang Lin ,  Wei-Ling Lin ,  Woan-Shiow Tzeng

IPC: C08G073/00

CPC classification number: C08G73/10 ,  G02F1/133723 ,  G03F7/037 ,  G03F7/0387

Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): 1 wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430null C. and dielectric constant is about 2.7.

Abstract translation: 本发明提供具有下式（I）的脂环族聚酰亚胺：其中1和n为4-7的整数; m为0〜2的整数; p是1至8的整数; 多环脂肪族化合物R排斥C 1-8环烷基，环烯基，环炔基，降冰片烯基，十氢化萘基，金刚烷基或十六烷基。 该脂环族聚酰亚胺可以是透明膜，它们的热稳定性高于430℃，介电常数约为2.7。

公开(公告)号：US20020045054A1

公开(公告)日：2002-04-18

申请号：US09927647

申请日：2001-08-10

Inventor： Kenji Uhara ,  Naofumi Yasuda ,  Kouichi Sawasaki

IPC: C08G073/00 ,  B32B027/00

CPC classification number: C08J5/18 ,  C08G73/1042 ,  C08G73/1071 ,  C08J2379/08 ,  H05K1/0346 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/31725

Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4null-oxydianiline and 22 to 78 mol % of 3,4null-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract translation: 聚酰亚胺膜由均苯四酸二酐制备的无规共聚，嵌段共聚或互穿聚合物网状聚酰胺酸与22-78摩尔％的4,4'-氧二苯胺和22-78摩尔％的3,4' 氧基二苯胺，基于总二胺。 聚酰亚胺薄膜通过在其表面上提供金属互连作为柔性电路中的金属互连板基板，芯片级封装（CSP），球栅阵列（BGA）或带自动键合（TAB） 高弹性模量，低热膨胀系数，碱蚀刻性和成膜性之间的平衡。

公开(公告)号：US20020007041A1

公开(公告)日：2002-01-17

申请号：US09757457

申请日：2001-01-09

Inventor： George E. Zahr

IPC: C08G073/00

CPC classification number: C08G69/48 ,  D01F1/10 ,  D01F6/60 ,  Y10T428/29 ,  Y10T428/2913 ,  Y10T428/2967 ,  Y10T428/2969

Abstract: Polyamides including functional groups and methods of preparing such polyamides. The polyamides are useful, for example, to prepare filaments.

Abstract translation: 包括官能团的聚酰胺和制备这种聚酰胺的方法。 聚酰胺可用于例如制备长丝。