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公开(公告)号：US11681103B2
公开(公告)日：2023-06-20
申请号：US16883969
申请日：2020-05-26
CPC分类号： G02B6/29338 , G02B6/136 , G02B6/12
摘要： Embodiments of the present disclosure provide etch-variation tolerant optical coupling components and processes for making the same. An etch-variation tolerant geometry is determined for at least one waveguide of an optical coupling component (e.g., a directional coupler). The geometry is optimized such that each fabricated instance of an optical component design with the etch-variation tolerant geometry has substantially the same coupling ratio at any etch depth between a shallow etch depth and a deep etch depth.
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公开(公告)号：US20230185024A1
公开(公告)日：2023-06-15
申请号：US18165098
申请日：2023-02-06
发明人： Chan-Hong CHERN , Min-Hsiang HSU
CPC分类号： G02B6/136 , G02B6/1225 , G02B2006/12176
摘要： A photonic structure is provided. The photonic structure includes a semiconductor substrate, and an oxide structure embedded in the semiconductor substrate, and an optical coupling region directly above the buried oxide layer. A side surface of the oxide structure is exposed from an edge of the semiconductor substrate. The optical coupling region is tapered to a terminus of the optical coupling region at the edge of the semiconductor substrate.
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公开(公告)号：US20230148361A1
公开(公告)日：2023-05-11
申请号：US17969709
申请日：2022-10-20
发明人： Mathew John MITCHELL , Lukas CHROSTOWSKI , Becky LIN , Kashif Masud AWAN , Shangxuan YU , Donald WITT , Seyediman TAGHAVI
IPC分类号： H01S5/0237 , G02B6/136
CPC分类号： H01S5/0237 , G02B6/136 , G02B2006/12121
摘要： Systems and methods for fabricating a semiconductor chip with an integrated laser diode (or other optical component). An example method may comprise fabricating a recess shaped to receive the optical component. The method may also comprise metallizing at least one surface of the recess. The method may also comprise coupling the optical component to the at least one metallized surface of the recess. The component may comprise a laser diode comprising a p-type semiconductor and an n-type semiconductor. The n-type semiconductor may be electrically coupled to the at least one metallized surface of the recess. The method may also comprise optically coupling an optical output of the laser diode (or other optical component) to an optical input of a photonic interface of the chip with a photonic wire bond and/or at least one polymer lens.
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公开(公告)号：US11635569B2
公开(公告)日：2023-04-25
申请号：US17473699
申请日：2021-09-13
发明人： Mario Paniccia , Avi Feshali
摘要： Disclosed herein are configurations and methods to produce very low loss waveguide structures, which can be single-layer or multi-layer. These waveguide structures can be used as a sensing component of a small-footprint integrated optical gyroscope. By using pure fused silica substrates as both top and bottom cladding around a SiN waveguide core, the propagation loss can be well below 0.1 db/meter. Low-loss waveguide-based gyro coils may be patterned in the shape of a spiral (circular or rectangular or any other shape), that may be distributed among one or more of vertical planes to increase the length of the optical path while avoiding the increased loss caused by intersecting waveguides in the state-of-the-art designs. Low-loss adiabatic tapers may be used for a coil formed in a single layer where an output waveguide crosses the turns of the spiraling coil.
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公开(公告)号：US11609378B2
公开(公告)日：2023-03-21
申请号：US17649520
申请日：2022-01-31
发明人： Frédéric Boeuf , Luca Maggi
摘要： A photonic integrated circuit chip includes vertical grating couplers defined in a first layer. Second insulating layers overlie the vertical grating coupler and an interconnection structure with metal levels is embedded in the second insulating layers. A cavity extends in depth through the second insulating layers all the way to an intermediate level between the couplers and the metal level closest to the couplers. The cavity has lateral dimensions such that the cavity is capable of receiving a block for holding an array of optical fibers intended to be optically coupled to the couplers.
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公开(公告)号：US20230084190A1
公开(公告)日：2023-03-16
申请号：US17884895
申请日：2022-08-10
发明人： Tatsuya ITO , Takeshi MATSUMOTO
摘要： An optical integrated device includes a substrate and a waveguide that has a hollow structure. The waveguide includes a first waveguide and a second waveguide that is optically coupled to the first waveguide and that has a smaller relative refractive index difference than that of the first waveguide and converts a mode diameter to a mode diameter of an optical fiber in accordance with travelling of light. The optical integrated device includes a dent portion that is formed in the vicinity of the dicing line on the substrate such that the width of the output end surface is smaller than the core width of the optical fiber that is optically coupled to the output end surface in the state in which the dicing end surface of the substrate protrudes farther than the output end surface of the second waveguide in the axial direction of the optical waveguide.
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公开(公告)号：US11604313B2
公开(公告)日：2023-03-14
申请号：US17364588
申请日：2021-06-30
申请人： Yukinori Ikegawa , Dayu Zhou , Koji Shimazawa , Yoshitaka Sasaki , Hiroyuki Ito , Yoji Nomura
发明人： Yukinori Ikegawa , Dayu Zhou , Koji Shimazawa , Yoshitaka Sasaki , Hiroyuki Ito , Yoji Nomura
摘要： A waveguide includes a core and a cladding. The core has an inlet on which light is incident. The core includes a front portion and a rear portion located between the front portion and the inlet. The front portion and the rear portion each have a thickness that is a dimension in a first direction and a width that is a dimension in a second direction. The first direction is orthogonal to a propagation direction of the light. The second direction is orthogonal to the propagation direction of the light and the first direction. The thickness of the front portion decreases with increasing distance from the inlet.
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公开(公告)号：US11585978B2
公开(公告)日：2023-02-21
申请号：US17317003
申请日：2021-05-11
摘要： The wavelength response of an arrayed waveguide grating can be tuned, in accordance with various embodiments, using a beam sweeper including one or more heaters to shift a lateral position of light focused by the beam sweeper at an interface of the beam sweeper with an input free propagation region of the arrayed waveguide grating.
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公开(公告)号：US11585977B2
公开(公告)日：2023-02-21
申请号：US16914156
申请日：2020-06-26
发明人： Damien Lambert
IPC分类号： H01S5/02 , G02B6/12 , H01S5/02326 , G02B6/122 , G02B6/136 , H01S5/026 , H01S5/028 , H01S5/22 , H01S5/30 , H01S5/343 , H01S5/40 , H04B10/50 , H04J14/02
摘要： A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.
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40.发明授权公开(公告)号：US11579362B2
公开(公告)日：2023-02-14
申请号：US17463815
申请日：2021-09-01
发明人： Xianming Chen , Lei Feng , Benxia Huang , Wenshi Wang , Lina Jiang
摘要： A cavity substrate may have a directional optoelectronic transmission channel. The cavity substrate includes a support frame, a first dielectric layer on a first surface of the support frame, and a second dielectric layer on a second surface of the support frame. The support frame, the first dielectric layer and the second dielectric layer constitute a closed cavity having an opening on one side in the length direction of the substrate, a first circuit layer is arranged on the inner surface of the first dielectric layer facing the cavity, an electrode connected with an optical communication device is arranged on the first circuit layer, the electrode is electrically conducted with the first circuit layer, a second circuit layer is arranged on the outer surfaces of the first dielectric layer and the second dielectric layer, and the first circuit layer and the second circuit layer are communicated through a via column.
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