Generic Packet Header Insertion and Removal

    公开(公告)号:US20220377014A1

    公开(公告)日:2022-11-24

    申请号:US17874352

    申请日:2022-07-27

    Abstract: A communication apparatus includes a host interface, connected to a peripheral component bus so as to communicate with a CPU and a memory of a host computer. A network interface is connected to a network. Packet processing circuitry is configured to receive from a first interface a data packet including a set of one or more headers that include header fields having respective values, to identify, responsively to at least one of the header fields, a corresponding entry in a header modification table that specifies a header modification operation, to modify the set of headers in accordance with the header modification operation, to check whether the entry specifies an additional header modification operation, to output the modified set of headers if the entry does not specify an additional header modification operation, and, if the entry specifies an additional header modification operation, to feed-back the modified set of headers.

    Universal replaceable fan unit for datacenters

    公开(公告)号:US11497136B2

    公开(公告)日:2022-11-08

    申请号:US16502686

    申请日:2019-07-03

    Abstract: A universal replaceable fan unit and method of reversing an airflow direction of a universal replaceable fan unit is provided. The universal replaceable fan unit includes a fan assembly designed to create an airflow from an intake end to an output end. The universal replaceable fan unit also includes a fan mounting that receives and secures the fan assembly in an operable position. The fan mounting includes a frame member and a securing member. The fan mounting is designed to allow the fan assembly to be moved between a first position defining a first airflow direction and a second position defining a second airflow direction. The first airflow direction is opposite the second airflow direction. The universal replaceable fan unit further includes an electrical connector removably attached to the fan assembly. The electrical connector allows electricity to be provided to the fan assembly for operation.

    DYNAMICALLY RESERVED RESOURCE ALLOCATION

    公开(公告)号:US20220350506A1

    公开(公告)日:2022-11-03

    申请号:US17244579

    申请日:2021-04-29

    Abstract: Devices, methods, and systems are provided. In one example, a device is described to include a bandwidth-constrained resource and a controller that dynamically allocates a proportional consumption of storage to the bandwidth-constrained resource thereby enabling the bandwidth-constrained resource to provide bandwidth to a consuming entity. The controller may allocate the proportional consumption of the storage to the bandwidth-constrained resource based on a current state of the bandwidth-constrained resource.

    Dual polarization unit for coherent transceiver or receiver

    公开(公告)号:US11456805B2

    公开(公告)日:2022-09-27

    申请号:US17438143

    申请日:2019-05-08

    Abstract: A passive dual polarization unit and coherent transceiver and/or receiver including one or more passive dual polarization units are provided. An example passive dual polarization unit includes a polarization splitter configured to split an input signal into a TE mode and TM mode signals; TE/TM splitters each designed to split the TE/TM mode signals into first TE/TM signals and second TE/TM signals; a first TE signal polarization rotation component for receiving the first TE signal and providing a third TM signal having the same magnitude and time dependence as the first TE signal; a first TM signal polarization rotation component for receiving the first TM signal and providing a third TE signal having the same magnitude and time dependence as the first TM signal; and TE/TM couplers that couple the second TE/TM signals and the third TE/TM signals to generate output TE/TM signals.

    BALL GRID ARRAY PATTERN FOR AN INTEGRATED CIRCUIT

    公开(公告)号:US20220293500A1

    公开(公告)日:2022-09-15

    申请号:US17199025

    申请日:2021-03-11

    Abstract: Embodiments are disclosed for providing a ball grid array pattern for an integrated circuit. An example integrated circuit apparatus includes an integrated circuit and a ball grid array. The integrated circuit includes at least a package substrate and a silicon chip. The ball grid array is disposed on the package substrate of the integrated circuit. The ball grid array includes a first set of solder balls that is configured to provide electrical connections for communication channels and a second set of the solder balls associated with an electrical ground. The first set of solder balls includes a first subset of solder balls configured in a first orientation and a second subset of solder balls configured in a second orientation. Furthermore, at least one solder ball from the second set of the solder balls is disposed between the first subset of solder balls and the second subset of solder balls.

    DYNAMIC BANDWIDTH CONNECTIONS
    450.
    发明申请

    公开(公告)号:US20220283973A1

    公开(公告)日:2022-09-08

    申请号:US17636484

    申请日:2019-08-21

    Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide a dynamic data interconnect and networking cable configuration. The dynamic data interconnect includes a substrate, transmitters supported on the substrate configured to generate signals, and receivers supported on the substrate configured to receive signals. The dynamic data interconnect further includes a number of connection pads that receive data cables attached thereto and a number of transmission lanes that operably couple the transmitters and receivers to the connection pads. The dynamic data interconnect further includes transmission circuitry in communication with each of the transmitters and receivers such that, in an operational configuration, the transmission circuitry determines a transmission state of the dynamic data interconnect and selectively disables operation of at least a portion of the transmitters or at least a portion of the receivers.

Patent Agency Ranking