公开(公告)号：US12173718B2

公开(公告)日：2024-12-24

申请号：US18356549

申请日：2023-07-21

Applicant: LG Electronics Inc.

Inventor： Eunji Hwang ,  Byungjik Kim ,  Sunggi Kim ,  Jisu Hwang

IPC: F04D25/06 ,  F04D17/16 ,  F04D25/08 ,  F04D29/049 ,  F04D29/58

Abstract: A fan motor includes a heat dissipation fin. The heat dissipation fin includes an outer ring part, an inner ring part disposed inside the outer ring part, and a connection part connecting the outer ring part and the inner ring part. The inner ring part is elastically deformed to be inclined in parallel to a rotational shaft which is inclined when axial alignment between bearings is not made. Accordingly, the heat dissipation fin can reduce a temperature of the bearing while enclosing the bearing, and improve concentricity (axial alignment) of the bearing.

公开(公告)号：US12173441B2

公开(公告)日：2024-12-24

申请号：US17624705

申请日：2020-06-26

Applicant: LG Electronics Inc.

Inventor： Han Kim

IPC: D06F33/34 ,  D06F33/37 ,  D06F34/18 ,  D06F37/36 ,  D06F39/02 ,  D06F39/04 ,  D06F39/08 ,  D06F103/04 ,  D06F105/02 ,  D06F105/14 ,  D06F105/28 ,  D06F105/48

Abstract: A control method includes performing a first drum operation of supplying water by a first set amount together with a detergent into the tub and rotating the drum at a first drum rotation speed while water is supplied, operating the pump at a first pump rotation speed during the first drum operation, operating a heater to heat water in the tub, performing a second drum operation of rotating the drum at the first drum rotation speed during the operation of the heater, and operating the pump at a second pump rotation speed at least once during the second drum operation, stopping the operation of the heater, performing a third drum operation of rotating the drum at the first drum rotation speed, and operating the pump at the first pump rotation speed during the third drum operation.

公开(公告)号：US12172028B2

公开(公告)日：2024-12-24

申请号：US17285740

申请日：2019-05-29

Applicant: LG ELECTRONICS INC.

Inventor： Gueisam Lim ,  Sungho Hong ,  Sangwon Kim ,  Haeseok Eo ,  Dongwon Kim ,  Saejung Kim ,  Yongju Yang

IPC: A61N5/06 ,  A61N5/067 ,  F21V8/00

Abstract: According to an embodiment of the present disclosure, a light outputting device for scalp care includes a dome-shaped outer case defining an appearance, an inner case formed inside the outer case, and a plurality of light sources disposed in a space between the outer case and the inner case, wherein the plurality of light sources include a plurality of first laser light sources, and the optical outputting device includes a plurality of light guide mechanisms arranged corresponding to the plurality of first laser light sources to distribute laser light emitted from the first laser light sources apply the laser light toward the inner case.

公开(公告)号：US12171334B2

公开(公告)日：2024-12-24

申请号：US17802221

申请日：2021-02-25

Applicant: LG Electronics Inc.

Inventor： Wanhee Kim ,  Hanbyeol Yoon

IPC: A47B77/08 ,  E06B3/70 ,  F25D11/02 ,  F25D23/02 ,  F25D23/10

Abstract: Technology capable of replacing an external panel of a refrigerator is disclosed. A refrigerator door comprises a frame assembly disposed side by side on both sides to form an edge of the refrigerator door and having a hollow portion formed in a longitudinal direction, a front panel coupled to one side of the frame assembly to form a front surface of the refrigerator door, a rear panel coupled to the other side of the frame assembly to form a rear surface of the refrigerator door, and a reinforcing panel disposed between the front panel and the rear panel. The frame assembly or the reinforcing panel has coupling grooves formed to be concave rearward on one side facing the front panel, and the coupling grooves are formed on both sides and spaced apart in a vertical direction, and coupling protrusions, at least a portion of which is accommodated in and fixed to the coupling grooves, are formed on a rear surface of the front panel.

公开(公告)号：US20240422746A1

公开(公告)日：2024-12-19

申请号：US18706323

申请日：2022-11-30

Applicant: LG ELECTRONICS INC.

Inventor： Haewook PARK ,  Jiwon KANG ,  Kyuseok KIM

IPC: H04W72/0446 ,  H04B7/06 ,  H04L27/26 ,  H04W72/11

Abstract: Disclosed are a method and an apparatus for transmitting and receiving information about reception timing of radio signals in a wireless communication system. A method for transmitting information about reception timing of reference signals, according to one embodiment of the present disclosure, may comprise the steps of: receiving reference signals belonging to a plurality of reference signal groups from a base station, wherein the reference signals of each of the plurality of reference signal groups are related to different transmission configuration indication (TCI) states or different control resource set (CORESET) pool indices; and transmitting information about reception timing of the reference signals to the base station.

公开(公告)号：US20240422615A1

公开(公告)日：2024-12-19

申请号：US18703890

申请日：2022-10-27

Applicant: LG Electronics Inc.

Inventor： Jaeho HWANG ,  Min SONG ,  Hakseong KIM ,  Hanbyul SEO

IPC: H04W28/02 ,  H04W4/40

Abstract: The present disclosure relates to a method and a device operating in a wireless communication system. The present disclosure relates to a method, and a device therefor, the method comprising the steps of: transmitting configuration information for direct device-to-device communication to a second device; and receiving a message including a header and a payload from the second device, wherein the header includes an extension flag field including a plurality of bits, and an extension data field corresponding to each of data types identified in the extension flag field, and the transmission period of a message related to the second device is adjusted on the basis of information about the quality of service (QOS) level of the second device included in the header.

公开(公告)号：US20240422401A1

公开(公告)日：2024-12-19

申请号：US18404650

申请日：2024-01-04

Applicant: LG ELECTRONICS INC.

Inventor： Dong Sung KIM

IPC: H04N21/485 ,  G06F3/0362 ,  G06F9/451 ,  H04N21/45

Abstract: An A/V (Audio/video) transmitting device including a compression chip configured to compress an A/V data; an RF transmission interface configured to transmit the compressed A/V data to an A/V receiving device, where the RF transmission interface includes a plurality of transmission antennas; and a processor configured to: obtain an installation direction of the A/V transmitting device, obtain a wireless quality state between the A/V transmitting device and the A/V receiving device, generate a guide for adjusting the direction of the plurality of transmission antennas based on the installation direction of the A/V transmitting device and the wireless quality state, and transmit the generated guide to the A/V receiving device.

公开(公告)号：US20240421496A1

公开(公告)日：2024-12-19

申请号：US18633090

申请日：2024-04-11

Applicant: LG ELECTRONICS INC.

Inventor： Yusuhk SUH ,  Dongik LEE ,  Seungmin WOO

IPC: H01Q21/06 ,  H01Q21/28

Abstract: An electronic device may include a display; and first and second antenna structures disposed around the display. The first antenna structure may include a first PCB, first and second array antennas, and a first wireless communication circuit. The second antenna structure may include a second PCB, third and fourth array antennas, and a second wireless communication circuit. The second and fourth array antennas may form a beam pattern in a first direction, which is a bottom direction. The first and third array antennas may form a beam pattern in a third direction, which is a front direction.

公开(公告)号：US20240421264A1

公开(公告)日：2024-12-19

申请号：US18706161

申请日：2021-11-01

Applicant: LG ELECTRONICS INC. ,  LG DISPLAY CO., LTD.

Inventor： Hongcheol LEE ,  Doohwan YANG ,  Youngdo KIM

IPC: H01L33/48 ,  H01L25/16 ,  H01L33/62

Abstract: A display device includes a substrate, a first assembly wiring and second assembly wiring on the substrate, a first insulating layer on the first and second assembly wirings, a barrier wall comprising a hole on the first insulating layer, a semiconductor light emitting device in the hole, and a connection part is configured to electrically connect a side of the semiconductor light emitting device and at least one assembly wiring of the first and second assembly wirings. A gap between an inner surface of the hole and an outer surface of the semiconductor light emitting device is 50% to 200% of a thickness of the semiconductor light emitting device.

公开(公告)号：US20240421133A1

公开(公告)日：2024-12-19

申请号：US18292714

申请日：2022-06-07

Applicant: LG ELECTRONICS INC.

Inventor： Daewoon HONG ,  Taehyun KIM ,  Dahye KIM ,  Jaesang MIN ,  Sangtae PARK

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

Abstract: The present invention relates to a light emitting element package manufacturing method and a display apparatus manufacturing method. According to an embodiment of the present invention, a light emitting element package manufacturing method may be provided, the method comprising the steps of: providing a substrate having, on one surface, a plurality of first pads and a plurality of second pads; arranging a plurality of light emitting elements on the substrate so that the light emitting elements are electrically connected to the plurality of second pads, respectively; arranging a plurality of joint parts on the one surface of the substrate so that the joint parts are electrically connected to the plurality of first pads, respectively; and sawing the substrate so as to form a light source that has at least one of the plurality of light emitting elements.