Lithography machine workpiece table and vertical position initialization method thereof

    公开(公告)号:US09760022B2

    公开(公告)日:2017-09-12

    申请号:US15122019

    申请日:2015-02-12

    IPC分类号: G03B27/58 G03F7/20

    摘要: A fine-motion module for use in a wafer stage of a photolithography tool includes: a base (201); a fine-motion plate (210); a plurality of vertical motors (203), fixed between the base and the fine-motion plate; a plurality of gravity compensators (202), each having one end fixed on the base and the other end configured to support the fine-motion plate; a plurality of absolute-position sensors (205, 211), configured to measure an absolute position of the fine-motion plate and to adjust pressures in the gravity compensators based on the obtained absolute-position measurements such that the absolute position of the fine-motion plate is changed to a predetermined initial vertical position; and a plurality of relative-position sensors (204, 207), configured to measure a relative position of the fine-motion plate to the base and to control the fine-motion plate based on the obtained relative-position measurements, thereby moving the fine-motion plate to a relative zero position.

    Chip bonding device
    43.
    发明授权

    公开(公告)号:US11081380B2

    公开(公告)日:2021-08-03

    申请号:US16489198

    申请日:2018-02-27

    摘要: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

    Photoetching apparatus and method
    44.
    发明授权

    公开(公告)号:US11042099B2

    公开(公告)日:2021-06-22

    申请号:US16494120

    申请日:2018-03-13

    IPC分类号: G03B27/42 G03F7/20 G03F9/00

    摘要: The lithography apparatus includes at least two exposure devices and one substrate device. The substrate device includes a substrate stage and a substrate supported by the substrate stage. The at least two exposure devices are disposed in symmetry to each other above the substrate with respect to a direction for scanning exposure and configured to simultaneously create two exposure fields onto the substrate to expose the portions of the substrate within the exposure fields.

    Shutter device, method of controlling same, photolithography machine, and method of controlling exposure dose thereof

    公开(公告)号:US10983415B2

    公开(公告)日:2021-04-20

    申请号:US16480639

    申请日:2018-01-25

    IPC分类号: G03B9/22 G03B9/62 H02K33/12

    摘要: A shutter device includes a light blocking unit and a voice coil motor. The voice coil motor includes a permanent magnet module, a guide track assembly and a coil assembly. The coil assembly is arranged on the guide track assembly, and the permanent magnet module is adapted to produce a magnetic field in the guide track assembly. The light blocking unit includes two shutter blades both connecting to the coil assembly. When energized, the coil assembly will produce a magnetic field having a direction same as or opposite to the direction of the magnetic field in the guide track assembly so that the coil assembly moves forward or backward along the guide track assembly to drive the two shutter blades to open or close. A method controls the shutter device. An exposure dose control method is used with a photolithography machine including the shutter device.

    Automatic optical inspection method

    公开(公告)号:US10937151B2

    公开(公告)日:2021-03-02

    申请号:US16050261

    申请日:2018-07-31

    摘要: An automatic optical inspection (AOI) method for inspecting defects on a surface of an object is provided. The method includes: providing at least two different illumination systems; acquiring, by at least one detector, at least two pieces of image information of the object, each piece of image information being acquired under illumination of a corresponding one of the illumination systems; obtaining at least two pieces of surface defect information of the object by analyzing the acquired at least two pieces of image information using a computer and storing at least one of the obtained at least two pieces of surface defect information by the computer; and combining, by the computer, all of the at least two pieces of surface defect information to de-duplicate the at least two pieces of surface defect information and obtain a piece of combined surface defect information.

    Coaxial mask alignment device, photolithography apparatus and alignment method

    公开(公告)号:US10901331B2

    公开(公告)日:2021-01-26

    申请号:US16090015

    申请日:2017-03-31

    发明人: Chengshuang Zhang

    IPC分类号: G03F9/00 G03F7/20

    摘要: A coaxial reticle alignment device, a lithography apparatus and alignment methods are disclosed. The coaxial reticle alignment device includes: illumination modules (A, B), each configured to provide an alignment light beam; a projection objective (8) under a reticle (5); a reference plate (9) on a workpiece stage (12), configured to carry a reference mark (10); and an image detection and processing module (11) under the reference plate (9). The reference mark (10) is located within a FOV of the image detection and processing module (11), and during movement of the workpiece stage (12), the image detection and processing module (11) receives the alignment light beam having passed sequentially through the reticle alignment mark (6, 7), the projection objective (8) and the reference mark (10), it captures images of the reticle alignment mark (6, 7) and the reference mark (10) which are processed to derive relative positional information between the reticle alignment mark (6, 7) and the reference mark (10) that enables the alignment of the reticle (5) with the workpiece stage (12). The coaxial reticle alignment device adopts dedicated separate illumination means, has a simple structure, allows easy operation and improves alignment efficiency.

    Measurement device and measurement method for thin film provided with transparent substrate

    公开(公告)号:US10823663B2

    公开(公告)日:2020-11-03

    申请号:US15576654

    申请日:2016-05-20

    发明人: Hao Liu Yuying Zhou

    摘要: A measurement device for measuring a thin film on a transparent substrate is disclosed which includes, disposed sequentially along the direction of light propagation, a light source (1), a collimator lens (2), a filter (3), a polarizer (4), a beam splitter (5) and an objective lens (7). To the beam splitter (5) are connected a planar array detector (11) and a processor (13). Light emitted by the light source (1) sequentially passes through the collimator lens (2), the filter (3), the polarizer (4), the beam splitter (5) and the objective lens (7) and thereby forms a measuring light incident on the thin film. The objective lens (7) and the beam splitter (5) gather light reflected from the thin film, and the planar array detector (11) and the processor (13) measure physical parameters of the thin film based on the gathered reflected light. The device further includes a stop configured to block interfering light reflected from the transparent substrate during the measurement.

    Light alignment control method and light alignment device

    公开(公告)号:US10788716B2

    公开(公告)日:2020-09-29

    申请号:US16314137

    申请日:2017-06-29

    IPC分类号: G02F1/1337 G02F1/13

    摘要: A photo-alignment control method and a photo-alignment apparatus are disclosed. In the photo-alignment control method, a yaw angle of a motion stage (130) relative to a polarizing illumination device (110) is detected to derive a weighted dynamic polarization angle deviation of a substrate (200), so that a rotational angle of a rotary table (120) for rotating a substrate (200) is controlled, thereby effectively improving a control accuracy of a polarization angle in the photo-alignment process and further to ensure an accuracy of an alignment angle formed in an alignment film.

    Bonding device
    50.
    发明授权

    公开(公告)号:US10780684B2

    公开(公告)日:2020-09-22

    申请号:US16097520

    申请日:2017-04-28

    发明人: Hui Fu Feixiang Shang

    摘要: A bonding device includes a flexible platen disposed between an upper platen assembly (9) and a transmission device and within a vacuum chamber (6). The flexible platen can expand to apply a downward pressure to the upper platen assembly (9) connected thereto. Under the effect of the pressure, the upper platen assembly (9) slowly moves downward until the upper platen assembly (9) itself and a lower platen assembly (7) respectively come into tight contact with objects to be bonded. After that, the flexible platen continues exerting the downward pressure on the upper platen assembly (9). In this way, the pressure applied by the upper platen assembly (9) to the objects to be bonded is uniform. Meanwhile, because of slow expansion of the flexible platen, the uniform pressure is applied slowly by the upper platen assembly (9).