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公开(公告)号：US20190384366A1
公开(公告)日：2019-12-19
申请号：US16537002
申请日：2019-08-09
发明人： Shui Fa TSAI
IPC分类号： G06F1/20
摘要： A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.
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公开(公告)号：US20190226770A1
公开(公告)日：2019-07-25
申请号：US16243263
申请日：2019-01-09
发明人： Jen-Chih CHENG
摘要： A vapor chamber has a first plate, a second plate, at least one ring structure, and a chamber. The first plate and the second plate have holes communicating with each other. The second plate has a cavity portion concaved away from the first plate. The ring structure is in the cavity portion and encloses the holes. The chamber is formed between the first plate and the second plate. A capillary structure layer and a working liquid are in the chamber. Therefore, even when either of the first and second plates is broken by heads of screws mounted through the holes, which are larger and oppress the margins of the holes, or even when either of the first and second plates is broken during forming of the holes via stamping or drilling, the chamber always remain sealed.
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公开(公告)号：US20190208665A1
公开(公告)日：2019-07-04
申请号：US16231761
申请日：2018-12-24
发明人： Shui-Fa TSAI
CPC分类号： H05K7/20272 , F28F3/02 , G06F1/20 , H05K7/20263 , H05K7/20409
摘要： A liquid cooling device is provided with a heat dissipating assembly and a pump assembly. The heat dissipating assembly has a plate and a cover. The plate has a connecting surface and a sinking surface opposite each other. The connecting surface has a connecting portion configured to attach to a heat source. The sinking surface has multiple fins corresponding to the connecting portion in location. The cover is mounted on the sinking surface. The pump assembly juxtaposes the heat dissipating assembly. A graphics card is also provided. The graphics card has a graphics card main body and the liquid cooling device. Therefore, functions of the conventional water block and the conventional pump are integrated in one liquid cooling device, which reducing an amount of connecting parts and the probability of leakage of the working fluid.
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公开(公告)号：US20190204025A1
公开(公告)日：2019-07-04
申请号：US16147970
申请日：2018-10-01
发明人： Chang-han Tsai
CPC分类号： F28F3/06 , F28F3/08 , F28F2275/08 , F28F2280/02
摘要： A combined heat sink has multiple dissipation fins serially mounted together. Each one of the dissipation fins has a body and two flanges. The body has at least one through hole formed through the body. The two flanges are respectively formed on one of two surfaces of the body, and have at least one connecting arm. Multiple protrusions protrude on the at least one connecting arm, and a width of the at least one through hole is smaller than a total width of the at least one connecting arm and the multiple protrusions. When the multiple dissipation fins are mounted together, the protrusions of the at least one connecting arm of each dissipation fin pass through the at least one through hole of an adjacent one of the dissipation fins, and abut an area near the at least one through hole to avoid separations of the dissipation fins.
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公开(公告)号：US10330392B2
公开(公告)日：2019-06-25
申请号：US16159398
申请日：2018-10-12
发明人： Lei-Lei Liu , Xiao-Min Zhang
摘要： A three-dimensional heat transfer device includes a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body; and a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body. The first capillary structure is connected to the second capillary structure by metallic bonding.
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公开(公告)号：US20190072113A1
公开(公告)日：2019-03-07
申请号：US16118712
申请日：2018-08-31
发明人： Fu-Lung Lin , Chien-Heng Lai , Shi-Man Xu
摘要： The disclosure provides a mount bracket which is configured for a fan. The mount bracket includes a button plate, a frame and a plurality of vibration-absorbing components. The button plate is mounted with a motor mount. The frame surrounds the button plate, and the frame has an inner lateral surface and an outer lateral surface. A plurality of fixing structures protrude from the outer lateral surface of the frame. The inner lateral surface of the frame and an outer lateral surface of the button plate form an annular gap therebetween. The vibration-absorbing components are spaced apart from each other and located in the annular gap, and the vibration-absorbing components are located between and connected to the outer lateral surface of the button plate and the inner lateral surface of the frame.
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公开(公告)号：US10198046B2
公开(公告)日：2019-02-05
申请号：US15283299
申请日：2016-10-01
发明人： Shui-Fa Tsai
IPC分类号： G06F1/20 , H05K7/20 , H01L23/473 , F04D13/14 , F04D1/00
摘要： A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening, and the connecting channel is communicated between the first outlet opening and the second inlet opening. The first impeller is pivotally arranged in the first rotor chamber, and an outer periphery of the first impeller is arranged corresponding to the first outlet opening. The second impeller is pivotally arranged in the second rotor chamber, and a center of the second impeller is arranged corresponding to the second inlet opening. Accordingly, the first impeller and the second impeller are serially arranged.
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公开(公告)号：US10178802B2
公开(公告)日：2019-01-08
申请号：US15268650
申请日：2016-09-19
发明人： Shih-Wei Huang , Chu-Yi Kuo , Chung-Yang Chen
摘要： A liquid supply device includes a casing, a cover, a plunger, a driving unit and a sensing unit. The casing has a liquid outlet. The cover is connected to the casing. A chamber is formed between the casing and the cover. The chamber communicates with the liquid outlet. The plunger is movably disposed in the chamber. The driving unit is disposed in the chamber and used for driving the plunger to move. The sensing unit is selectively disposed on one of the cover and the plunger. The sensing unit outputs a sensing signal according to a current position of the plunger.
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公开(公告)号：US20180352645A1
公开(公告)日：2018-12-06
申请号：US15908783
申请日：2018-02-28
发明人： Chun-Ching HO , Hsin-Hung CHEN
CPC分类号： H05K1/0203 , F28D9/0075 , F28D15/0233 , F28D15/0275 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H05K7/20336 , H05K7/2039 , H05K7/20509 , H05K7/20709
摘要： A heat dissipation device includes a heat dissipation piece, heat conduction plates, a rod piece and a switch. The heat conduction plates are connected to the heat dissipation piece and spaced apart from and arranged parallel to each other so as to define accommodating spaces. Each heat conduction plate has a free end away from the heat dissipation piece, and the free end has a through hole. The rod piece has a first end and a second end opposite to each other, the rod piece penetrates through the through holes, and the second end has a limitation portion. The switch has a cam portion pivoted to the first end. When the switch is pivoted with respect to the heat conduction plates, the cam portion drives the rod piece to move among the through holes, making the limitation portion to press against or be separated from the heat conduction plates.
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公开(公告)号：US10111362B2
公开(公告)日：2018-10-23
申请号：US14883619
申请日：2015-10-15
发明人： Shui-Fa Tsai
IPC分类号： F28F7/00 , H05K7/20 , H01L23/473
摘要： A liquid-cooling heat dissipation device includes: a flow guiding shell body (1) formed with a first flow channel (13), a second flow channel (14) and a third flow channel (15), wherein a heat dissipation space (16) is defined by the above-mentioned three flow channels (13, 14, 15); a primary pipe (2) disposed in the heat dissipation space (16) and extended from the first flow channel (13) towards the second flow channel (14), wherein the primary pipe (2) is communicated with the first flow channel (13); a plurality of secondary pipes (3) disposed in the heat dissipation space (16) and extended from the primary pipe (2) towards the third flow channel (15), wherein each of the secondary pipes (3) is respectively communicated with the primary pipe (2) and the third flow channel (15). Accordingly, advantages of lowering the flow resistance and increasing the heat dissipation performance can be achieved.
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