公开(公告)号：US07939434B2

公开(公告)日：2011-05-10

申请号：US12116017

申请日：2008-05-06

Applicant: Chih-Yuan Tseng ,  I Hsuan Peng ,  Yung-Hui Yeh ,  Jung-Jie Huang ,  Cheng-Ju Tsai

Inventor： Chih-Yuan Tseng ,  I Hsuan Peng ,  Yung-Hui Yeh ,  Jung-Jie Huang ,  Cheng-Ju Tsai

IPC: H01L21/20 ,  H01L21/26

CPC classification number: H01L29/66765 ,  C23C16/24 ,  C23C16/507

Abstract: A method of directly depositing a polysilicon film at a low temperature is disclosed. The method comprises providing a substrate and performing a sequential deposition process. The sequential deposition process comprises first and second deposition steps. In the first deposition step, a first bias voltage is applied to the substrate, and plasma chemical vapor deposition is utilized to form a first polysilicon sub-layer on the substrate. In the second deposition step, a second bias voltage is applied to the substrate, and plasma chemical vapor deposition is utilized to form a second polysilicon sub-layer on the first sub-layer. The first and second sub-layers constitute the polysilicon film, and the first bias voltage differs from the second bias voltage.

Abstract translation: 公开了一种在低温下直接沉积多晶硅膜的方法。 该方法包括提供衬底并执行顺序沉积工艺。 顺序沉积工艺包括第一和第二沉积步骤。 在第一沉积步骤中，向衬底施加第一偏置电压，并且利用等离子体化学气相沉积在衬底上形成第一多晶硅子层。 在第二沉积步骤中，向衬底施加第二偏置电压，并且利用等离子体化学气相沉积在第一子层上形成第二多晶硅子层。 第一和第二子层构成多晶硅膜，第一偏置电压与第二偏置电压不同。

公开(公告)号：USD624073S1

公开(公告)日：2010-09-21

申请号：US29351441

申请日：2009-12-05

Applicant: Po-Hsuan Peng ,  Yi-Chun Liao

Designer： Po-Hsuan Peng ,  Yi-Chun Liao

公开(公告)号：USD624067S1

公开(公告)日：2010-09-21

申请号：US29351438

申请日：2009-12-05

Applicant: Po-Hsuan Peng

Designer： Po-Hsuan Peng

公开(公告)号：US07572676B2

公开(公告)日：2009-08-11

申请号：US11790313

申请日：2007-04-25

Applicant: Fang-Jun Leu ,  Shou-Lung Chen ,  Ching-Wen Hsiao ,  Shan-Pu Yu ,  Jyh-Rong Lin ,  I-Hsuan Peng ,  Jian-Shu Wu ,  Hui-Mei Wu ,  Chien-Wei Chieh

Inventor： Fang-Jun Leu ,  Shou-Lung Chen ,  Ching-Wen Hsiao ,  Shan-Pu Yu ,  Jyh-Rong Lin ,  I-Hsuan Peng ,  Jian-Shu Wu ,  Hui-Mei Wu ,  Chien-Wei Chieh

IPC: H01L21/00

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.

Abstract translation: 本发明涉及图像传感器模块的封装结构和方法。 该方法包括：提供具有第一图案化导电层的透明基板; 在所述透明基板上承载具有感光有源区域的图像传感器集成电路芯片和至少一个无源芯片，其中所述光敏有源区域面向所述透明基板; 在透明基板上形成绝缘堆积膜; 并且在绝缘堆积膜中形成多个导电通孔，其中导电通孔的端部与透明基板的无源芯片或第一图案化导电层连接，而导电通孔的另一端暴露在表面上 的绝缘堆积膜。 包装方法能够缩小图像传感器模块的结构，简化了处理步骤。

公开(公告)号：US20090033501A1

公开(公告)日：2009-02-05

申请号：US12179528

申请日：2008-07-24

Applicant: Liang-Kuang Chen ,  Meng-Hsuan Peng

Inventor： Liang-Kuang Chen ,  Meng-Hsuan Peng

IPC: G08B23/00

CPC classification number: G08B21/06 ,  A61B5/18 ,  A61B5/7267

Abstract: An online monitoring method of driver state and a system using the same are provided. First a driver model is established, wherein the driver model generates a steering angle to control transportation means for riding according to the lateral position error of the riding transportation means. Next, a system identification processing is performed on the lateral position error and the steering angle of the riding transportation means to obtain a transfer function of the driver model. After that, an analysis processing is performed on the driver model transfer function to extract specific information therefrom, following by performing an assessment processing on the specific information and multiple statistics of raw data to generate the driver state assessment.

Abstract translation: 提供了驱动器状态的在线监视方法和使用其的系统。 首先建立驾驶员模型，其中驾驶员模型产生转向角以控制根据骑马运输装置的横向位置误差进行骑乘的运送装置。 接下来，对骑乘运输装置的横向位置误差和转向角执行系统识别处理，以获得驾驶员模型的传递函数。 之后，对驾驶员模型传递函数执行分析处理以从其中提取特定信息，然后通过对特定信息进行评估处理和原始数据的多个统计来生成驾驶员状态评估。

公开(公告)号：US20070254399A1

公开(公告)日：2007-11-01

申请号：US11380491

申请日：2006-04-27

Applicant: Min WANG ,  I-Hsuan PENG ,  Te-Chi WONG ,  Liang-Tang WANG ,  Chin-Jen HUANG

Inventor： Min WANG ,  I-Hsuan PENG ,  Te-Chi WONG ,  Liang-Tang WANG ,  Chin-Jen HUANG

IPC: H01L21/00 ,  H01L21/84

CPC classification number: H01L29/66757 ,  H01L29/78609 ,  H01L29/78678

Abstract: A method for manufacturing a thin film transistor (“TFT”) device includes providing a substrate, forming a patterned first metal layer on the substrate, forming an insulating layer over the patterned first metal layer, forming an amorphous silicon layer over the insulating layer, forming a first polycrystalline silicon layer over the amorphous silicon layer, forming a second polycrystalline silicon layer over the first polycrystalline silicon layer, doping the second polycrystalline silicon layer to form a doped polycrystalline silicon layer, patterning the amorphous silicon layer, first polycrystalline silicon layer and doped polycrystalline silicon layer to form an active region layer for the TFT device, and forming a patterned second metal layer over the active region layer.

Abstract translation: 一种制造薄膜晶体管（“TFT”）器件的方法包括提供衬底，在衬底上形成图案化的第一金属层，在图案化的第一金属层上形成绝缘层，在绝缘层上形成非晶硅层， 在所述非晶硅层上形成第一多晶硅层，在所述第一多晶硅层上形成第二多晶硅层，掺杂所述第二多晶硅层以形成掺杂多晶硅层，图案化所述非晶硅层，第一多晶硅层和 掺杂多晶硅层以形成TFT器件的有源区，并在有源区上形成图案化的第二金属层。

公开(公告)号：US20070195188A1

公开(公告)日：2007-08-23

申请号：US11790313

申请日：2007-04-25

Applicant: Fang-Jun Leu ,  Shou-Lung Chen ,  Ching-Wen Hsiao ,  Shan-Pu Yu ,  Jyh-Rong Lin ,  I-Hsuan Peng ,  Jian-Shu Wu ,  Hui-Mei Wu ,  Chien-Wei Chieh

Inventor： Fang-Jun Leu ,  Shou-Lung Chen ,  Ching-Wen Hsiao ,  Shan-Pu Yu ,  Jyh-Rong Lin ,  I-Hsuan Peng ,  Jian-Shu Wu ,  Hui-Mei Wu ,  Chien-Wei Chieh

IPC: H04N5/225

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

Abstract: This invention relates to a packaging structure and method of an image sensor module. The method comprises: providing a transparent substrate having a first patterned conductive layer; carrying an image sensor integrated circuit chip having a photosensitive active area and at least one passive chip on the transparent substrate, wherein the photosensitive active area faces the transparent substrate; forming an insulating build-up film over the transparent substrate; and forming a plurality of conductive vias in the insulating build-up film wherein the ends of the conductive vias are connected with the passive chip or the first patterned conductive layer of the transparent substrate while the other ends of the conductive vias are exposed on the surface of the insulating build-up film. The packaging method is capable of down-sizing the construction of the image sensor module and simplifying the processing steps.

Abstract translation: 本发明涉及图像传感器模块的封装结构和方法。 该方法包括：提供具有第一图案化导电层的透明基板; 在所述透明基板上承载具有感光有源区域的图像传感器集成电路芯片和至少一个无源芯片，其中所述光敏有源区域面向所述透明基板; 在透明基板上形成绝缘堆积膜; 并且在绝缘堆积膜中形成多个导电通孔，其中导电通孔的端部与透明基板的无源芯片或第一图案化导电层连接，而导电通孔的另一端暴露在表面上 的绝缘堆积膜。 包装方法能够缩小图像传感器模块的结构，简化了处理步骤。

公开(公告)号：US20060220212A1

公开(公告)日：2006-10-05

申请号：US11446106

申请日：2006-06-05

Applicant: Shou-Lung Chen ,  Fang-Jun Leu ,  I-Hsuan Peng ,  Shan-Pu Yu

Inventor： Shou-Lung Chen ,  Fang-Jun Leu ,  I-Hsuan Peng ,  Shan-Pu Yu

IPC: H01L23/02

CPC classification number: H01L25/0657 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2224/05599

Abstract: A stacked package for electronic elements is provided, a plurality of stud bumps are formed on a substrate by means of a stud bump process to align with a plurality of vias of one provided electronic element. The stud bumps respectively pass through the vias and electrically connect the electronic element. Furthermore, additional electronic elements are stacked on the carrier according to a similar way to form a stacked electronic package.

Abstract translation: 提供了一种用于电子元件的堆叠封装件，通过柱形凸起工艺在基板上形成多个柱形突起，以与一个所提供的电子元件的多个通孔对准。 螺柱凸块分别穿过通孔并电连接电子元件。 此外，附加的电子元件根据类似的方式堆叠在载体上以形成堆叠的电子封装。

公开(公告)号：US06619940B1

公开(公告)日：2003-09-16

申请号：US09849365

申请日：2001-05-07

Applicant: Min-Wen Wang ,  Liteh Hu ,  Hsin Hung Lin ,  Hsuan Peng ,  Ming-Chang Deng

Inventor： Min-Wen Wang ,  Liteh Hu ,  Hsin Hung Lin ,  Hsuan Peng ,  Ming-Chang Deng

IPC: B29C4564

CPC classification number: B29C45/64 ,  B29C2045/645

Abstract: A device for clamping electromagnetically molds of the injection molding machine comprises a stand on which a fixed board and a guiding mechanism are mounted. A movable board is slidably mounted on the guiding mechanism to slide back and forth in relation to the fixed board. The fixed board is provided with a male mold mounted thereon. The movable board is provided with a female mold mounted thereon. The sliding motion of the movable board toward the fixed board brings about the mold opening action, the mold closing action, and the mold locking action. The movable board and the fixed board are provided with a magnetic force generating mechanism for effecting attraction or repulsion between the movable board and the fixed board. The attraction serves to effect the mold closing action and the mold locking action. The repulsion serves to effect the mold opening action.

Abstract translation: 用于夹持注射成型机的电磁模的装置包括固定板和引导机构安装在该支架上的支架。 可移动板可滑动地安装在引导机构上以相对于固定板来回滑动。 固定板上装有阳模， 可动板设置有安装在其上的阴模。 可动板朝向固定板的滑动运动导致开模动作，闭模动作和模具锁定动作。 可动板和固定板设置有用于在可动板和固定板之间进行吸引或排斥的磁力产生机构。 该吸引力用于实现闭合动作和模具锁定动作。 排斥用于实现开模动作。

公开(公告)号：US06540494B2

公开(公告)日：2003-04-01

申请号：US09852795

申请日：2001-05-11

Applicant: Hsin-Hung Lin ,  Min-Wen Wang ,  Hsuan Peng ,  Li-Teh Hu ,  Yong-Zhen Chung ,  Ming-Chang Deng

Inventor： Hsin-Hung Lin ,  Min-Wen Wang ,  Hsuan Peng ,  Li-Teh Hu ,  Yong-Zhen Chung ,  Ming-Chang Deng

IPC: B29C4564

CPC classification number: B29C45/64 ,  B29C45/66 ,  B29C2045/645 ,  Y10S425/033 ,  Y10T74/18992

Abstract: An electromagnetic driving device for a mold clamping system is disclosed, which has a stationary plate fixedly mounted on a lathe bed; a mold guiding mechanism mounted parallel on the lathe bed; a movable plate slidably arranged on the mold guiding mechanism, facing the stationary plate, for generating a relative slide to the stationary plate; and a movable plate driving mechanism for driving the movable plate on the mold guiding mechanism. The electromagnetic driving device utilizes magnetic force to drive the linkage, movable plate etc. to perform open-mold movement, close-mold movement, and mold-locking movement.