Abstract:
A three-dimensional stacked semiconductor integrated circuit including a plurality of stacked chips. The semiconductor integrated circuit is configured to simultaneously select the plurality of chips in response to an external command and an address, and to activate one of memory banks which are aligned on the same line in a vertical direction, among a plurality of memory banks included in the plurality of chips.
Abstract:
A semiconductor integrated circuit includes a sense amplifier for sensing input data and a sense amplifier controller for blocking a signal path between the sense amplifier and a memory cell when a test mode signal is activated.
Abstract:
A semiconductor apparatus includes a reference voltage generation unit, a comparison voltage generation unit, and a calibration unit. The reference voltage generation unit is disposed in a reference die and configured to generate a reference voltage. The comparison voltage generation unit is disposed in a die stacked on the reference die and configured to generate a comparison voltage in response to a calibration control signal. The calibration unit is configured to compare a level of the reference voltage with a level of the comparison voltage and generate the calibration control signal.
Abstract:
A data line termination circuit includes a swing-width sensing unit configured to sense a swing width of a voltage of a data line and output a sensed signal, and a variable termination unit configured to adjust a termination resistance value of the data line in response to the sensed signal. The swing-width sensing unit can sense if the swing width is less than or greater than a predetermined swing width, and the swing width of the voltage of the data line can be reduced or increased to maintain the voltage of the data line within a predetermined range.
Abstract:
An internal voltage generating circuit of a semiconductor memory apparatus includes a control signal generating unit configured to enable one of a plurality of control signals in response to a calibration code; and a signal variable voltage distributing unit configured to determine a distribution ratio in response to one enabled control signal of the plurality of control signals and generate an internal voltage by distributing an external voltage at the determined distribution ratio.
Abstract:
A data line termination circuit includes a swing-width sensing unit configured to sense a swing width of a voltage of a data line and output a sensed signal, and a variable termination unit configured to adjust a termination resistance value of the data line in response to the sensed signal. The swing-width sensing unit can sense if the swing width is less than or greater than a predetermined swing width, and the swing width of the voltage of the data line can be reduced or increased to maintain the voltage of the data line within a predetermined range.
Abstract:
Semiconductor device with a controllable decoupling capacitor includes a decoupling capacitor connected between a power voltage terminal and a ground terminal and a switching unit configured to enable/disable the decoupling capacitor in response to a control signal. According to another aspect, a semiconductor device with a controllable decoupling capacitor includes multiple circuits, decoupling capacitors being connected in parallel to each of the circuits and switching units being configured to enable/disable the decoupling capacitors in response to control signals.
Abstract:
A plurality of first drivers outputs a plurality of data based on first control signals. A second driving unit generates a second control signal synchronized with data output cycles of the first drivers using the first control signals. An amplitude correcting unit corrects an amplitude of the second control signal using at least the first control signals.
Abstract:
A memory device minimizes the skew between an external clock and a DQS (or DQ) after the locking state by regulating a delay ratio of a replica delay model to compensate errors of process, temperature or voltage change. The memory device comprises: an input clock buffer for buffering an externally inputted external clock to generate an internal clock; a DLL for delaying the internal clock to synchronize a phase of the external clock with that of a DQS; an output clock buffer for buffering an output clock outputted from the DLL; and an output control unit for generating the DQS using a clock outputted from the output clock buffer. Here, the DLL comprises a replica delay model for modeling delay factors of the input clock buffer and other delay factors until the output clock outputted from the delay line is outputted to the outside of a chip, and for regulating a delay ratio in response to a plurality of control signals inputted externally in a test mode.
Abstract:
A column repair circuit of a semiconductor memory is disclosed, in which a column repair efficiency is increased in a row flexible redundancy structure. A repair circuit for a memory divided into arrays and arranged by row lines and column lines crossing each other, the circuit includes a plurality of column fuse boxes for outputting a redundant column enable signal for repairing a defective line, and an array address inverter corresponding to one of the column fuse boxes for inverting a self-pair signal input thereto and a corresponding array address input thereto, the self-pair signal indicating whether a row repair is performed in a corresponding array or in another array, and for selectively outputting the inverted array address according to the self-pair signal.