公开(公告)号：US07048621B2

公开(公告)日：2006-05-23

申请号：US10975564

申请日：2004-10-27

申请人： Hung Chih Chen ,  Steven M. Zuniga

发明人： Hung Chih Chen ,  Steven M. Zuniga

IPC分类号： B24B41/06

CPC分类号： B24B37/005 ,  B24B37/30

摘要： A carrier bead for chemical mechanical polishing of a substrate. The carrier head includes a carrier base, a retaining ring, and a junction connecting the carrier base to the retaining ring. The junction is configured such that vertical movement of the retaining ring is substantially restrained relative to the carrier base. The junction is further configured such that the profile of a bottom surface of the retaining ring is substantially decoupled from flexing and/or expansion of carrier base.

摘要翻译： 用于基材的化学机械抛光的载体珠。 承载头包括载体基座，保持环和将载体基部连接到保持环的接合部。 接合部构造成使得保持环的垂直移动相对于载体基座基本上受到限制。 连接部被进一步构造成使得保持环的底部表面的轮廓与载体基体的弯曲和/或膨胀基本上脱离。

公开(公告)号：US07001256B2

公开(公告)日：2006-02-21

申请号：US11144245

申请日：2005-06-02

申请人： Steven M. Zuniga ,  Hung Chih Chen

发明人： Steven M. Zuniga ,  Hung Chih Chen

IPC分类号： B24B7/22

CPC分类号： B24B7/22 ,  B24B37/30

摘要： A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base to define a chamber. The flexible membrane has a core of a first material and an outer layer of a second material having a lower adhesion to the substrate than the first material. An exposed surface of the outer layer provides a mounting surface for the substrate.

公开(公告)号：US06913518B2

公开(公告)日：2005-07-05

申请号：US10430912

申请日：2003-05-06

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Thomas H. Osterheld ,  Sen-Hou Ko ,  Mohsen Salek

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Charles C. Garretson ,  Thomas H. Osterheld ,  Sen-Hou Ko ,  Mohsen Salek

IPC分类号： B24B37/16 ,  B24B41/047 ,  B24B7/22

CPC分类号： B24B37/16

摘要： A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.

公开(公告)号：US06645044B2

公开(公告)日：2003-11-11

申请号：US10121143

申请日：2002-04-10

申请人： Steven M. Zuniga

发明人： Steven M. Zuniga

IPC分类号： B24B4900

CPC分类号： B24B37/32 ,  B24B37/30 ,  B24B49/16

摘要： A method of chemical mechanical polishing uses a carrier head having a flexible membrane that applies a load to a substrate in a loading area with a controllable size. One pressurizable chamber in the carrier head controls the size of the loading area, and another chamber controls the pressure applied to the substrate in the loading area.

公开(公告)号：US06547641B2

公开(公告)日：2003-04-15

申请号：US10091700

申请日：2002-03-04

申请人： Steven M. Zuniga ,  Ming-Kuei Tseng

发明人： Steven M. Zuniga ,  Ming-Kuei Tseng

IPC分类号： B24B4900

CPC分类号： B24B37/30 ,  B24B37/0053 ,  B24B49/00 ,  H01L21/681

摘要： A carrier head for a chemical mechanical polishing system includes a flexible membrane with a substrate receiving surface, a sensor mechanism to determine if a substrate is properly attached to the carrier head, and means for preventing fluid that may be located between the substrate and the flexible membrane from interfering with the substrate detection mechanism.

公开(公告)号：US06540594B2

公开(公告)日：2003-04-01

申请号：US10071745

申请日：2002-02-08

申请人： Steven M. Zuniga ,  Manoocher Birang ,  Hung Chen ,  Sen-Hou Ko

发明人： Steven M. Zuniga ,  Manoocher Birang ,  Hung Chen ,  Sen-Hou Ko

IPC分类号： B24B500

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

公开(公告)号：US06511367B2

公开(公告)日：2003-01-28

申请号：US10059519

申请日：2002-01-28

申请人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

发明人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

IPC分类号： B24B500

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

公开(公告)号：US06431968B1

公开(公告)日：2002-08-13

申请号：US09296937

申请日：1999-04-22

申请人： Hung Chih Chen ,  Steven M. Zuniga

发明人： Hung Chih Chen ,  Steven M. Zuniga

IPC分类号： B24B4702

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A carrier head for a chemical mechanical polishing apparatus has a base, a first flexible membrane extending beneath the base to form a first pressurizable chamber, a support structure positioned in the first chamber, and a compressible film adjacent a bottom surface of the support structure. A lower surface of the first flexible membrane providing a mounting surface for a substrate. The compressible film has a plurality of apertures disposed in a pattern to establish a pressure distribution on a top surface of the first flexible membrane.

摘要翻译： 用于化学机械抛光装置的承载头具有底座，在基座下方延伸的第一柔性膜，以形成第一可加压室，位于第一室中的支撑结构以及邻近支撑结构的底表面的可压缩膜。 第一柔性膜的下表面提供用于基底的安装表面。 可压缩膜具有以图案设置的多个孔，以在第一柔性膜的顶表面上建立压力分布。

公开(公告)号：US06277009B1

公开(公告)日：2001-08-21

申请号：US09478943

申请日：2000-01-06

申请人： Hung Chen ,  Steven M. Zuniga

发明人： Hung Chen ,  Steven M. Zuniga

IPC分类号： B24B722

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head includes a compliant backing member with a plurality of cells which contact an upper surface of the flexible membrane to improve vacuum-chucking of the substrate.

摘要翻译： 用于化学机械抛光装置的载体头包括柔性膜，其下表面提供基板接收表面。 承载头包括具有多个单元的柔性背衬构件，所述多个单元接触柔性膜的上表面以改善基板的真空吸附。

公开(公告)号：US06251215B1

公开(公告)日：2001-06-26

申请号：US09090679

申请日：1998-06-03

申请人： Steven M. Zuniga ,  Thomas H. Osterheld ,  Lawrence M. Rosenberg

发明人： Steven M. Zuniga ,  Thomas H. Osterheld ,  Lawrence M. Rosenberg

IPC分类号： B24B500

CPC分类号： B24B41/06 ,  B24B37/30 ,  B24B37/32

摘要： A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.

摘要翻译： 用于化学机械抛光装置的承载头包括具有柔性下部和刚性上部的保持环。