Substrate retainer
    2.
    发明授权
    Substrate retainer 有权
    基板保持架

    公开(公告)号:US08298047B2

    公开(公告)日:2012-10-30

    申请号:US12987709

    申请日:2011-01-10

    IPC分类号: B24B5/35

    CPC分类号: B24B37/32 B24B37/28

    摘要: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.

    摘要翻译: 保持器用于抛光衬底的装置。 衬底具有上表面和下表面以及侧面,基本上圆形的周边。 该装置具有抛光垫,该抛光垫具有用于接触和抛光基底的下表面的上抛光表面。 保持器具有向内的保持面,用于在衬底的抛光期间接合和保持衬底以防止横向移动。 保持面在沿着周边的基本上一个单独的离散圆周位置处接合基底周边。

    Substrate Retainer
    3.
    发明申请
    Substrate Retainer 有权
    基板保持器

    公开(公告)号:US20110104990A1

    公开(公告)日:2011-05-05

    申请号:US12987709

    申请日:2011-01-10

    IPC分类号: B24B1/00 B24B41/06

    CPC分类号: B24B37/32 B24B37/28

    摘要: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.

    摘要翻译: 保持器用于抛光衬底的装置。 衬底具有上表面和下表面以及侧面,基本上圆形的周边。 该装置具有抛光垫,该抛光垫具有用于接触和抛光基底的下表面的上抛光表面。 保持器具有向内的保持面,用于在衬底的抛光期间接合和保持衬底以防止横向移动。 保持面在沿着周边的基本上一个单独的离散圆周位置处接合基底周边。

    Substrate retainer
    4.
    发明授权
    Substrate retainer 有权
    基板保持架

    公开(公告)号:US07459057B2

    公开(公告)日:2008-12-02

    申请号:US10199738

    申请日:2002-07-18

    IPC分类号: C23F1/02 B28B1/00 B32B13/00

    CPC分类号: B24B37/32 B24B37/28

    摘要: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.

    摘要翻译: 保持器用于抛光衬底的装置。 衬底具有上表面和下表面以及侧面,基本上圆形的周边。 该装置具有抛光垫,该抛光垫具有用于接触和抛光基底的下表面的上抛光表面。 保持器具有向内的保持面,用于在衬底的抛光期间接合和保持衬底以防止横向移动。 保持面在沿着周边的基本上一个单独的离散圆周位置处接合基底周边。

    FAST SUBSTRATE LOADING ON POLISHING HEAD WITHOUT MEMBRANE INFLATION STEP
    6.
    发明申请
    FAST SUBSTRATE LOADING ON POLISHING HEAD WITHOUT MEMBRANE INFLATION STEP 有权
    快速底板装载在无膜渗透步骤的抛光头上

    公开(公告)号:US20070289124A1

    公开(公告)日:2007-12-20

    申请号:US11757069

    申请日:2007-06-01

    IPC分类号: H05K13/04

    摘要: The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.

    摘要翻译: 本发明涉及一种用于改善和加速基板加载过程的装置和方法。 一个实施例提供了用于真空吸附衬底的方法。 该方法包括将配置用于安装衬底的柔性膜的中心室排出,移动衬底,使得衬底的背面与柔性膜完全接触,并且抽真空中心室以将衬底的背面真空吸附到 柔性膜。

    Carrier head with multiple chambers
    7.
    发明授权
    Carrier head with multiple chambers 有权
    具有多个腔室的承载头

    公开(公告)号:US07207871B1

    公开(公告)日:2007-04-24

    申请号:US11245867

    申请日:2005-10-06

    IPC分类号: B24B5/00

    CPC分类号: B24B37/30 B24B49/16

    摘要: A system for chemical mechanical polishing having a carrier head with pressurizeable chambers that can be configured into pressure zones is described. The system includes a carrier head with a membrane for contacting a substrate during polishing. Pressurizeable chambers behind the membrane are in communication with pressure inputs. The pressure inputs can each supply a different pressure to the pressurizeable chambers. Some of the pressurizeable chambers can be in communication with more than one pressure input. Zones of pressure can be arranged, where each zone includes one or more pressurizeable chambers. The zones can be configurable by altering the pressurizeable chambers that make up each zone.

    摘要翻译: 描述了一种用于化学机械抛光的系统,该系统具有可被构造成压力区的具有可加压室的载体头。 该系统包括具有用于在抛光期间接触基底的膜的载体头部。 膜后面的可加压室与压力输入连通。 压力输入可以为可加压室提供不同的压力。 一些可加压室可以与多于一个的压力输入连通。 可以布置压力区域,其中每个区域包括一个或多个可加压室。 这些区域可以通过改变构成每个区域的可加压室来配置。

    Retaining ring deflection control
    8.
    发明授权
    Retaining ring deflection control 有权
    挡环偏转控制

    公开(公告)号:US07048621B2

    公开(公告)日:2006-05-23

    申请号:US10975564

    申请日:2004-10-27

    IPC分类号: B24B41/06

    CPC分类号: B24B37/005 B24B37/30

    摘要: A carrier bead for chemical mechanical polishing of a substrate. The carrier head includes a carrier base, a retaining ring, and a junction connecting the carrier base to the retaining ring. The junction is configured such that vertical movement of the retaining ring is substantially restrained relative to the carrier base. The junction is further configured such that the profile of a bottom surface of the retaining ring is substantially decoupled from flexing and/or expansion of carrier base.

    摘要翻译: 用于基材的化学机械抛光的载体珠。 承载头包括载体基座,保持环和将载体基部连接到保持环的接合部。 接合部构造成使得保持环的垂直移动相对于载体基座基本上受到限制。 连接部被进一步构造成使得保持环的底部表面的轮廓与载体基体的弯曲和/或膨胀基本上脱离。

    Carrier head with a non-stick membrane

    公开(公告)号:US07001256B2

    公开(公告)日:2006-02-21

    申请号:US11144245

    申请日:2005-06-02

    IPC分类号: B24B7/22

    CPC分类号: B24B7/22 B24B37/30

    摘要: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base to define a chamber. The flexible membrane has a core of a first material and an outer layer of a second material having a lower adhesion to the substrate than the first material. An exposed surface of the outer layer provides a mounting surface for the substrate.