公开(公告)号：US20110186886A1

公开(公告)日：2011-08-04

申请号：US12868107

申请日：2010-08-25

Applicant: Gen WATARI ,  Satoshi SHIMIZU ,  Hiroaki OSHIO ,  Tatsuo TONEDACHI ,  Kazuhisa IWASHITA ,  Tetsuro KOMATSU ,  Teruo TAKEUCHI

Inventor： Gen WATARI ,  Satoshi SHIMIZU ,  Hiroaki OSHIO ,  Tatsuo TONEDACHI ,  Kazuhisa IWASHITA ,  Tetsuro KOMATSU ,  Teruo TAKEUCHI

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/48 ,  H01L24/97 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.

Abstract translation: 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一引线框架和第二引线框架由金属材料制成，并且彼此分开设置。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 树脂体由肖氏D硬度为25以上的树脂材料制成。 此外，树脂体覆盖第一和第二引线框架和LED芯片。 并且，树脂体的外观是LED封装的外观。

公开(公告)号：USD624033S1

公开(公告)日：2010-09-21

申请号：US29355734

申请日：2010-02-12

Applicant: Teruo Takeuchi ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Satoshi Shimizu

Designer： Teruo Takeuchi ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Satoshi Shimizu

公开(公告)号：USD624032S1

公开(公告)日：2010-09-21

申请号：US29355538

申请日：2010-02-09

Applicant: Teruo Takeuchi ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Satoshi Shimizu

Designer： Teruo Takeuchi ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Satoshi Shimizu

公开(公告)号：US5871851A

公开(公告)日：1999-02-16

申请号：US920174

申请日：1997-08-25

Applicant: Keisuke Fukumizu ,  Hiroaki Kato ,  Teruo Takeuchi ,  Takahide Shimazu ,  Yasuo Sato ,  Tatsuo Amaike ,  Ryoichi Yoshihara ,  Takeshi Harada

Inventor： Keisuke Fukumizu ,  Hiroaki Kato ,  Teruo Takeuchi ,  Takahide Shimazu ,  Yasuo Sato ,  Tatsuo Amaike ,  Ryoichi Yoshihara ,  Takeshi Harada

IPC: C21D8/02 ,  C21D8/12 ,  H01J29/06 ,  B32B15/18

CPC classification number: H01J29/06 ,  C21D8/0236 ,  C21D8/1277 ,  C21D8/0278 ,  C21D8/1233 ,  Y10T428/12854 ,  Y10T428/12937

Abstract: A 0.1 to 0.5 mm-thick plated steel sheet having high coercive force and magnetic flux density is provided by hot rolling a slab comprising by weight carbon: 0.01 to 0.09%, silicon: not more than 1.0%, phosphorus: not more than 0.3%, manganese: not more than 1.5%, sulfur: not more than 0.04%, aluminum: not more than 1.0%, and nitrogen: not more than 0.01% with the balance consisting of iron and unavoidable impurities, cold rolling the hot rolled sheet, annealing the cold rolled sheet to prepare a steel sheet having an average grain diameter of 3 to 15 .mu.m, temper rolling the steel sheet with a reduction ratio of not more than 3%, and plating the temper rolled sheet with chromium or nickel. This enables the provision of a magnetic shielding material having no significant drift and very good electron beam landing properties.

Abstract translation: 通过热轧含有重量百分比为0.01〜0.09％的硅，不超过1.0％的磷，不超过0.3％的平板，提供具有高矫顽力和磁通密度的0.1〜0.5mm厚的镀覆钢板， ，锰：不大于1.5％，硫：不大于0.04％，铝：不大于1.0％，氮：不大于0.01％，余量由铁和不可避免的杂质组成，冷轧热轧板， 对冷轧板进行退火，制备平均粒径为3〜15μm的钢板，以3％以下的压下率对钢板进行回火处理，并对铬或镍进行镀层。 这使得能够提供没有显着漂移的磁屏蔽材料和非常好的电子束着陆性能。

公开(公告)号：US5305948A

公开(公告)日：1994-04-26

申请号：US67599

申请日：1993-05-27

Applicant: Yoshio Yoshikawa ,  Yoshiaki Inoue ,  Teruo Takeuchi ,  Kazuo Fujinami

Inventor： Yoshio Yoshikawa ,  Yoshiaki Inoue ,  Teruo Takeuchi ,  Kazuo Fujinami

IPC: B23K1/20 ,  B23K35/36 ,  H05K3/34 ,  B23K35/363 ,  B23K35/38 ,  H01L21/50 ,  H01L21/54

CPC classification number: B23K1/203 ,  B23K35/3612 ,  B23K35/3616 ,  H05K3/3489 ,  Y10T29/49146

Abstract: The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.

Abstract translation: 通过在包含金属的部件的金属表面（作为焊料粘合的部分）上施加包含卤素化合物的比例为0.2％以下的卤素的后通量进行焊接， 一个不透气的容器与防锈剂包一起以密封的方式。 本发明的方法以非常简单的方式以低成本，通过将包含金属的构件保持在其中不存在氧，水分或腐蚀性物质的还原气氛中，并以 该还原气体与包括金属构件的材料共存，并且使用含有少量卤素的助熔剂容易实现焊料的良好的接合性能。 因此，在焊接后不需要通过有机卤素系溶剂去除焊剂，可以简化清洗工序，降低成本。