公开(公告)号：US07256412B2

公开(公告)日：2007-08-14

申请号：US11516344

申请日：2006-09-05

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/88

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

公开(公告)号：US20070001132A1

公开(公告)日：2007-01-04

申请号：US11516344

申请日：2006-09-05

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/86

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。 在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

公开(公告)号：US20120062890A1

公开(公告)日：2012-03-15

申请号：US13298079

申请日：2011-11-16

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N15/02

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。 在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

公开(公告)号：US20060091332A1

公开(公告)日：2006-05-04

申请号：US11302847

申请日：2005-12-13

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/86

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

公开(公告)号：US06797975B2

公开(公告)日：2004-09-28

申请号：US09931997

申请日：2001-08-17

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N2188

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

摘要翻译： 通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。 在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

公开(公告)号：US07115892B2

公开(公告)日：2006-10-03

申请号：US11302847

申请日：2005-12-13

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/88

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

公开(公告)号：US20120312104A1

公开(公告)日：2012-12-13

申请号：US13593171

申请日：2012-08-23

申请人： Akira HAMAMATSU ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

发明人： Akira HAMAMATSU ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

IPC分类号： G01N21/88

CPC分类号： G06T7/001 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8861 ,  G01N2021/8867 ,  G06T7/97 ,  G06T2207/10152 ,  G06T2207/30148

摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

摘要翻译： 在多个检查条件下对样本进行检查的检查方法和装置以及在多个检查条件下检查样本而获得的检查数据和对应于检查日期样本的位置信息 具有相应的检查条件。 多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的 获得。 对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

公开(公告)号：US07332359B2

公开(公告)日：2008-02-19

申请号：US10082593

申请日：2002-02-22

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama

IPC分类号： H01L31/26

CPC分类号： H01L21/67271 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/95615

摘要： Techniques for inspecting semiconductor devices. An inspection condition using chip matrix data and chip size data is set. The intricate circuit patterns of at least one semiconductor device is inspected with the inspection condition. In an embodiment of the present invention, inspection uses images formed by the irradiation of white light, a laser light, or an electron beam. Data obtained from the inspection is used to generate a revised inspection condition. Semiconductor devices are inspected using the revised inspection condition.

摘要翻译： 检查半导体器件的技术。 设置使用芯片矩阵数据和芯片尺寸数据的检查条件。 在检查条件下检查至少一个半导体器件的复杂电路图案。 在本发明的实施例中，检查使用通过照射白光，激光或电子束形成的图像。 使用从检查获得的数据来生成修订的检查条件。 使用修订的检查条件检查半导体器件。

公开(公告)号：US08559000B2

公开(公告)日：2013-10-15

申请号：US13593171

申请日：2012-08-23

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

IPC分类号： G01N21/00 ,  G06K9/00

CPC分类号： G06T7/001 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8861 ,  G01N2021/8867 ,  G06T7/97 ,  G06T2207/10152 ,  G06T2207/30148

摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

摘要翻译： 在多个检查条件下对样本进行检查的检查方法和装置以及在多个检查条件下检查样本而获得的检查数据和对应于检查日期样本的位置信息 具有相应的检查条件。 多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的 获得。 对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

公开(公告)号：US08040503B2

公开(公告)日：2011-10-18

申请号：US12652427

申请日：2010-01-05

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Kenji Oka ,  Takanori Ninomiya ,  Maki Tanaka ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Yoshio Morishige

IPC分类号： G01N21/00 ,  G06K9/00

CPC分类号： G06T7/001 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8861 ,  G01N2021/8867 ,  G06T7/97 ,  G06T2207/10152 ,  G06T2207/30148

摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

摘要翻译： 在多个检查条件下对样本进行检查的检查方法和装置以及在多个检查条件下检查样本而获得的检查数据和对应于检查日期样本的位置信息 具有相应的检查条件。 多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的 获得。 对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。