-
公开(公告)号：US20210351063A1
公开(公告)日：2021-11-11
申请号：US17365612
申请日：2021-07-01
Applicant: Applied Materials, Inc.
Inventor： Yogananda Sarode Vishwanath , Steven E. Babayan , Stephen Prouty , Andreas Schmid
IPC: H01L21/687 , C23C16/458 , H01J37/32 , H01L21/677 , H01L21/683
Abstract: Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.
-
公开(公告)号：US10770269B2
公开(公告)日：2020-09-08
申请号：US15677929
申请日：2017-08-15
Applicant: Applied Materials, Inc.
Inventor： Andrew Nguyen , Bradley Howard , Shahid Rauf , Ajit Balakrishna , Tom K. Choi , Kenneth S. Collins , Anand Kumar , Michael D. Willwerth , Yogananda Sarode Vishwanath
Abstract: Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.
-
公开(公告)号：US09761416B2
公开(公告)日：2017-09-12
申请号：US14200077
申请日：2014-03-07
Applicant: Applied Materials, Inc.
Inventor： Andrew Nguyen , Bradley Howard , Shahid Rauf , Ajit Balakrishna , Tom K. Cho , Kenneth S. Collins , Anand Kumar , Michael D. Willwerth , Yogananda Sarode Vishwanath
CPC classification number: H01J37/32495 , B01D45/08 , B29C66/71 , B32B1/02 , H01J37/32449 , H01J37/32477 , H01J37/32871 , Y10T428/13
Abstract: Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.
-
公开(公告)号：US20150170879A1
公开(公告)日：2015-06-18
申请号：US14108683
申请日：2013-12-17
Applicant: Applied Materials, Inc.
Inventor： Andrew Nguyen , Kartik Ramaswamy , Srinivas Nemani , Bradley Howard , Yogananda Sarode Vishwanath
IPC: H01J37/32
CPC classification number: H01J37/32091 , H01J37/32449 , H01J37/32477
Abstract: An exemplary semiconductor processing system may include a high-frequency electrical source that has an outlet plug. The system may include a processing chamber having a top plate, and an inlet assembly coupled with the top plate. The inlet assembly may include an electrode defining an aperture at a first end and configured to receive the outlet plug. The aperture may be characterized at the first end by a first diameter, and a second end of the aperture opposite the first end may be characterized by a second diameter less than the first diameter. The inlet assembly may further include an inlet insulator coupled with the top plate and configured to electrically insulate the top plate from the electrode.
Abstract translation: 示例性的半导体处理系统可以包括具有出口插头的高频电源。 该系统可以包括具有顶板的处理室和与顶板联接的入口组件。 入口组件可以包括在第一端限定孔并且被配置为接收出口塞的电极。 孔可以在第一端被表征为第一直径，并且与第一端相对的孔的第二端的特征在于小于第一直径的第二直径。 入口组件还可包括与顶板耦合的入口绝缘体并且构造成使顶板与电极电绝缘。
-
-
-
Search Results
44
records
(took 0.012 seconds)
