公开(公告)号：USD1042373S1

公开(公告)日：2024-09-17

申请号：US29831295

申请日：2022-03-18

申请人： Applied Materials, Inc.

设计人： Sahiti Nallagonda ,  Jonathan Simmons ,  Xinwei Huang ,  Peter Muraoka ,  Andreas Schmid

摘要： FIG. 1 is a top, front, right isometric view of a sliding ring for an interlocking process kit for a substrate processing chamber, showing our new design.
FIG. 2 is a bottom, left, back isometric view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a front elevation view thereof.
FIG. 6 is a back elevation view thereof.
FIG. 7 is a right side elevation view thereof.
FIG. 8 is a left side elevation view thereof; and,
FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. 3.

公开(公告)号：US20240021458A1

公开(公告)日：2024-01-18

申请号：US18476223

申请日：2023-09-27

申请人： APPLIED MATERIALS, INC.

发明人： Nicholas Michael Bergantz ,  Andreas Schmid ,  Leon Volfovski ,  Sanggyum Kim ,  Damon Cox ,  Paul Wirth

IPC分类号： H01L21/68 ,  B25J11/00 ,  H01L21/687 ,  H01L21/67 ,  B25J9/16

CPC分类号： H01L21/681 ,  B25J11/0095 ,  H01L21/68707 ,  H01L21/67201 ,  H01L21/67259 ,  H01L21/67196 ,  B25J9/1692

摘要： A calibration object is transferred from a processing chamber to an aligner station by one or more robot arms. The calibration object has a first processing chamber orientation in the processing chamber and a second orientation at the aligner station. A first characteristic error value associated with a transfer path between the processing chamber and the aligner is determined based on the first processing chamber orientation and the second orientation of the calibration object at the aligner station. In response to detecting an object at the aligner station to be transferred to the processing chamber along the transfer path, the object is aligned by the aligner station to be placed in the processing chamber according to a target processing chamber orientation based on a target aligner orientation as adjusted by the first characteristic error value determined for the transfer path between the processing chamber and the aligner station.

公开(公告)号：US11721569B2

公开(公告)日：2023-08-08

申请号：US17352097

申请日：2021-06-18

申请人： Applied Materials, Inc.

发明人： Andrew Myles ,  Andreas Schmid ,  Phillip A. Criminale ,  Steven E. Babayan

IPC分类号： H01L21/67 ,  G01B11/27 ,  G01B9/02002 ,  G05B23/02 ,  H01L21/687

CPC分类号： H01L21/67259 ,  G01B9/02002 ,  G01B11/272 ,  G05B23/0205 ,  H01L21/68735

摘要： Examples disclosed herein are directed to a method and apparatus for determining a position of a ring within a process kit. In one example, a sensor assembly for a substrate processing chamber is provided. The sensor assembly includes a housing having a top surface, a bottom surface opposite the top surface, and a plurality of sidewalls connecting the top surface to the bottom surface. The housing also has a recess in the top surface, the recess forming an interior volume within the housing. The sensory assembly includes a bias member, and a contact member disposed on the bias member. The bias member and contact member are disposed within the recess. A sensor is configured to detect a displacement of the contact member. The displacement of the contact member corresponds to a relative position of an edge ring.

公开(公告)号：US11373893B2

公开(公告)日：2022-06-28

申请号：US16997300

申请日：2020-08-19

申请人： Applied Materials, Inc.

发明人： Yogananda Sarode Vishwanath ,  Steven E. Babayan ,  Stephen Donald Prouty ,  Alvaro Garcia De Gorordo ,  Andreas Schmid ,  Andrew Antoine Noujaim

IPC分类号： H01L21/683 ,  H01J37/32

摘要： Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a base channel disposed therein, and a facility plate having a facility channel disposed therein. The facility plate includes a plate portion and a wall portion. The plate portion is coupled to the ESC base assembly and the wall portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the wall portion of the facility plate, and the seal assembly.

公开(公告)号：US10964584B2

公开(公告)日：2021-03-30

申请号：US16417369

申请日：2019-05-20

申请人： Applied Materials, Inc.

发明人： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC分类号： H01L21/68 ,  H01L21/687 ,  H01L21/683 ,  H01L21/677

摘要： A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.

公开(公告)号：US20190244848A1

公开(公告)日：2019-08-08

申请号：US15890946

申请日：2018-02-07

申请人： Applied Materials, Inc.

发明人： Michael D. Willwerth ,  Roberto Cesar Cotlear ,  Andreas Schmid

IPC分类号： H01L21/683 ,  H01J37/32 ,  H01L23/467 ,  H01L23/473

CPC分类号： H01L21/6833 ,  H01L23/467 ,  H01L23/473 ,  Y10T279/23

摘要： An electrostatic chuck assembly with improved thermal uniformity and stability is disclosed herein. The electrostatic chuck assembly includes a puck having a chucking electrode disposed therein and a cooling base connected to the puck. The cooling base is formed a first material and includes a top surface, a first cooling channel, a second cooling channel configured to flow coolant therethrough independent of flow through the first cooling channel, and a first thermal spreading element aligned with the first cooling channel and disposed between the first cooling channel and the puck. The first thermal spreading element is formed from a second material that has a thermal conductivity higher than a thermal conductivity of the first material.

公开(公告)号：USD1042374S1

公开(公告)日：2024-09-17

申请号：US29831299

申请日：2022-03-18

申请人： Applied Materials, Inc.

设计人： Sahiti Nallagonda ,  Jonathan Simmons ,  Xinwei Huang ,  Peter Muraoka ,  Andreas Schmid

摘要： FIG. 1 is a top, front, right isometric view of a support pipe for an interlocking process kit for a substrate processing chamber, showing our new design.
FIG. 2 is a bottom, left, back isometric view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a front elevation view thereof.
FIG. 6 is a back elevation view thereof.
FIG. 7 is a right side elevation view thereof.
FIG. 8 is a left side elevation view thereof; and,
FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. 3.
The dashed lines in FIGS. 1-9 represent unclaimed environment and form no part of the claimed design.

公开(公告)号：US12009236B2

公开(公告)日：2024-06-11

申请号：US16391262

申请日：2019-04-22

申请人： Applied Materials, Inc.

发明人： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard M. Tedeschi ,  Daniel Sang Byun ,  Philip Allan Kraus ,  Phillip A. Criminale ,  Changhun Lee ,  Rajinder Dhindsa ,  Andreas Schmid ,  Denis M. Koosau

IPC分类号： H01L21/67 ,  H01J37/32 ,  H01L21/66 ,  H03K17/955

CPC分类号： H01L21/67259 ,  H01J37/32477 ,  H01J37/3288 ,  H01L22/12 ,  H03K17/955 ,  H01J2237/022

摘要： The present disclosure generally relates to a method and apparatus for determining a metric related to erosion of a ring assembly used in an etching within a plasma processing chamber. In one example, the apparatus is configured to obtain a metric indicative of erosion on an edge ring disposed on a substrate support assembly in a plasma processing chamber. A sensor obtains the metric for the edge ring. The metric correlates to the quantity of erosion in the edge ring. In another example, the ring sensor may be arranged outside of a periphery of a substrate support assembly. The metric may be acquired by the ring sensor through a plasma screen.

公开(公告)号：US11823937B2

公开(公告)日：2023-11-21

申请号：US16990839

申请日：2020-08-11

申请人： APPLIED MATERIALS, INC.

发明人： Nicholas Michael Bergantz ,  Andreas Schmid ,  Leon Volfovski ,  Sanggyum Kim ,  Damon Cox ,  Paul Wirth

IPC分类号： H01L21/68 ,  B25J11/00 ,  H01L21/687 ,  H01L21/67 ,  B25J9/16

CPC分类号： H01L21/681 ,  B25J9/1692 ,  B25J11/0095 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67259 ,  H01L21/68707

摘要： A calibration object is retrieved, by a first robot arm of a transfer chamber, from a processing chamber connected to the transfer chamber and placed in a load lock connected to the transfer chamber. The calibration object is retrieved from the load lock by a second robot arm of a factory interface connected to the load lock and placed at an aligner station housed in or connected to the factory interface. The calibration object has a first orientation at the aligner station. A difference is determined between the first orientation and an initial target orientation at the aligner station. A first characteristic error value associated with the processing chamber is determined based on the determined difference. The first characteristic error value is recorded in a storage medium. The aligner station is to use the first characteristic error value for alignment of objects to be placed in the processing chamber.

公开(公告)号：US11668553B2

公开(公告)日：2023-06-06

申请号：US17161271

申请日：2021-01-28

申请人： Applied Materials, Inc.

发明人： Sathyendra Ghantasala ,  Leonid Dorf ,  Evgeny Kamenetskiy ,  Peter Muraoka ,  Denis M. Koosau ,  Rajinder Dhindsa ,  Andreas Schmid

IPC分类号： G01B7/06 ,  H01L21/67 ,  H01J37/32 ,  H01L21/687

CPC分类号： G01B7/08 ,  H01J37/32642 ,  H01L21/67069 ,  H01L21/68721 ,  H01J2237/24564

摘要： Disclosed herein is a method and apparatus for controlling surface characteristics by measuring capacitance of a process kit ring. The method includes interfacing a ring with a jig assembly for measuring capacitance in at least a first location of the ring. The ring has that includes a top surface, a bottom surface, and an inner surface opposite an outer surface. At least the bottom surface has an external coating placed thereon. The method further includes contacting a measuring device to the first location on the outer surface proximate the bottom surface. The measuring device contacts an opening in the external coating to the body. The measuring device contacts a first conductive member that is electrically coupled to the ring. A capacitance is measured on the measuring device. The capacitance across the top surface is measured.