公开(公告)号：US20050250011A1

公开(公告)日：2005-11-10

申请号：US11116882

申请日：2005-04-27

申请人： Porter Mitchell ,  Xiaomei Xi ,  Linda Zhong ,  Bin Zou

发明人： Porter Mitchell ,  Xiaomei Xi ,  Linda Zhong ,  Bin Zou

IPC分类号： B05D3/02 ,  B05D5/12 ,  H01G9/00 ,  H01G9/155 ,  H01M4/02 ,  H01M4/04 ,  H01M4/1391 ,  H01M4/1393 ,  H01M4/50 ,  H01M4/58 ,  H01M4/583 ,  H01M4/587 ,  H01M4/62 ,  H01M4/88 ,  H01M6/16 ,  H01M10/052 ,  H01M10/36

CPC分类号： H01M4/621 ,  H01G9/058 ,  H01G9/155 ,  H01G11/42 ,  H01M4/02 ,  H01M4/0404 ,  H01M4/0409 ,  H01M4/0416 ,  H01M4/0435 ,  H01M4/1391 ,  H01M4/1393 ,  H01M4/50 ,  H01M4/58 ,  H01M4/583 ,  H01M4/587 ,  H01M4/62 ,  H01M4/622 ,  H01M4/8668 ,  H01M4/886 ,  H01M4/8896 ,  H01M4/9083 ,  H01M4/926 ,  H01M10/052 ,  Y02E60/13

摘要： A dry process-based particle packaging method and system is disclosed where a matrix of dry fibrillized binder is formed so as to support one or more type of particle. Reliable and inexpensive products, including films, sheets, electrodes, batteries, capacitors, fuel cells, and/or medical devices can be thus manufactured.

摘要翻译： 公开了一种基于干工艺的颗粒包装方法和系统，其中形成了干原纤化粘合剂的基质以便支撑一种或多种类型的颗粒。 因此可以制造可靠且廉价的产品，包括膜，片，电极，电池，电容器，燃料电池和/或医疗装置。

公开(公告)号：US06630203B2

公开(公告)日：2003-10-07

申请号：US09883012

申请日：2001-06-15

申请人： Robert J. Bahn ,  Fred A. Blum ,  Herbert J. Neuhaus ,  Bin Zou

发明人： Robert J. Bahn ,  Fred A. Blum ,  Herbert J. Neuhaus ,  Bin Zou

IPC分类号： B05D310

CPC分类号： H01L24/10 ,  G06K19/0775 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15747 ,  H05K3/4007 ,  Y10T428/12451 ,  Y10T428/12486 ,  H01L2924/00

摘要： The present invention provides a unique method for the electroless co-deposition of metal and hard particles on an electrical contact surface to provide electrical, thermal, and mechanical connections between the particle enhanced contact surface and an opposing contact surface, and to enhance the thermal and electrical conductivity between the contact surfaces and their corresponding substrates. The innovative method is able to uniformly deposit metal and particles of any shape, and with a wide range of density and sizes, on contact surfaces, and can be adjusted to provide any desired surface area coverage in desirable deposition patterns. The co-deposited contact surface can, for example, be easily joined to another surface of any type by nonconductive adhesive, resulting in a connection that is mechanically robust, chemically inert, and inherently electrically conductive.