-
公开(公告)号：US20090019196A1
公开(公告)日：2009-01-15
申请号：US11774848
申请日：2007-07-09
IPC分类号： G06F3/00
CPC分类号： H04L47/625 , H04L47/50 , H04L47/522 , H04L49/90
摘要： The present disclosure provides a method for providing Quality of Service (QoS) processing of a plurality of data packets stored in a first memory. The method may include determining a queue of a plurality of queues causing an interrupt using contents of an interrupt status register, the queue comprising address of at least one data packet of the plurality of data packets. The method may further include performing a logical operation between the contents of the interrupt status register and an interrupt mask of a plurality of interrupt masks, the plurality of interrupt masks stored in a second memory. The method may also include processing the plurality of data packets based on the logical operation and incrementing an interrupt mask address pointer stored in a third memory, thereby pointing to another interrupt mask of the plurality of interrupt masks. Of course, many alternatives, variations and modifications are possible without departing from this embodiment.
摘要翻译： 本公开提供了一种用于提供存储在第一存储器中的多个数据分组的服务质量（QoS）处理的方法。 该方法可以包括使用中断状态寄存器的内容来确定导致中断的多个队列的队列，该队列包括多个数据分组中的至少一个数据分组的地址。 该方法还可以包括在中断状态寄存器的内容与存储在第二存储器中的多个中断屏蔽的中断屏蔽之间执行逻辑运算。 该方法还可以包括基于逻辑操作来处理多个数据分组，并且增加存储在第三存储器中的中断屏蔽地址指针，从而指向多个中断屏蔽的另一个中断屏蔽。 当然，在不脱离本实施例的情况下，可以进行许多替代，变化和修改。
-
42.发明申请公开(公告)号：US20080237310A1
公开(公告)日：2008-10-02
申请号：US11728534
申请日：2007-03-26
IPC分类号： B23K31/02
CPC分类号： H01L25/18 , H01L24/73 , H01L25/0657 , H01L2224/32145 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/73257 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2924/351 , H01L2924/00 , H01L2924/00012
摘要： Methods and apparatus to provide die backside connections are described. In one embodiment, the backside of a die is metallized and coupled to another die or a substrate. Other embodiments are also described.
摘要翻译： 描述提供模背侧连接的方法和装置。 在一个实施例中，管芯的背面被金属化并且耦合到另一个管芯或衬底。 还描述了其它实施例。
-
公开(公告)号：US07400033B1
公开(公告)日：2008-07-15
申请号：US11648143
申请日：2006-12-29
申请人： Bok Eng Cheah , Shanggar Periaman , Kooi Chi Ooi
发明人： Bok Eng Cheah , Shanggar Periaman , Kooi Chi Ooi
IPC分类号： H01L23/02
CPC分类号： G06F1/20 , G06F1/183 , H01L25/03 , H01L25/18 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： Methods and apparatus to provide an improved package on package (PoP) design are described. In one embodiment, a central processing unit (CPU) package substrate and an embedded package (which may include one or more heat removal channels) are molded. Other embodiments are also described.
摘要翻译： 描述了提供改进的封装（PoP）设计的方法和装置。 在一个实施例中，模制中央处理单元（CPU）封装基板和嵌入式封装（其可以包括一个或多个除热通道）。 还描述了其它实施例。
-
公开(公告)号：US20080157350A1
公开(公告)日：2008-07-03
申请号：US11648143
申请日：2006-12-29
申请人： Bok Eng Cheah , Shanggar Periaman , Kooi Chi Ooi
发明人： Bok Eng Cheah , Shanggar Periaman , Kooi Chi Ooi
CPC分类号： G06F1/20 , G06F1/183 , H01L25/03 , H01L25/18 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： Methods and apparatus to provide an improved package on package (PoP) design are described. In one embodiment, a central processing unit (CPU) package substrate and an embedded package (which may include one or more heat removal channels) are molded. Other embodiments are also described.
摘要翻译： 描述了提供改进的封装（PoP）设计的方法和装置。 在一个实施例中，模制中央处理单元（CPU）封装基板和嵌入式封装（其可以包括一个或多个除热通道）。 还描述了其它实施例。
-
-
-
搜索结果
44 条记录 (耗时 0.026 秒)
