摘要:
A novel trench-type decoupling capacitor structure and low-cost manufacturing process to create trench decoupling capacitors (decaps). In a unique aspect, the invention necessitates the addition of only a simplified trench to a base logic design.
摘要:
An eFuse, includes: a substrate and an insulating layer disposed on the substrate; a first layer including a single crystal or polycrystalline silicon disposed on the insulating layer; a second layer including a single crystal or polycrystalline silicon germanium disposed on the first layer, and a third layer including a silicide disposed on the second layer. The Ge has a final concentration in a range of approximately five percent to approximately twenty-five percent.
摘要:
An e-fuse structure and method has anode, a fuse link, and a cathode. The first end of the fuse link is connected to the anode and the second end of the fuse link opposite the first end is connected to the cathode. This structure also includes a first silicide layer on the anode and the fuse link and a second silicide layer, different than the first silicide layer, on the cathode. The difference between the first silicide layer and the second silicide layer causes an enhanced flux divergence region at the second end of the fuse link.
摘要:
The embodiments of the invention provide a device, method, etc. for a dual stress STI. A semiconductor device is provided having a substrate with a first transistor region and a second transistor region different than the first transistor region. The first transistor region comprises a PFET; and, the second transistor region comprises an NFET. Further, STI regions are provided in the substrate adjacent sides of and positioned between the first transistor region and the second transistor region, wherein the STI regions each comprise a compressive region, a compressive liner, a tensile region, and a tensile liner.
摘要:
A contiguous block of a stack of two heterogeneous semiconductor layers is formed over an insulator region such as shallow trench isolation. A portion of the contiguous block is exposed to an etch, while another portion is masked during the etch. The etch removes an upper semiconductor layer selective to a lower semiconductor layer in the exposed portion. The etch mask is removed and the entirety of the lower semiconductor layer within the exposed region is metallized. A first metal semiconductor alloy vertically abutting the insulator region is formed, while exposed surfaces of the stack of two heterogeneous semiconductor layers, which comprises the materials of the upper semiconductor layer, are concurrently metallized to form a second metal semiconductor alloy. An inflection point for current and, consequently, a region of flux divergence are formed at the boundary of the two metal semiconductor alloys.
摘要:
An electronically programmable fuse (e-fuse) is disclosed. In one embodiment, the e-fuse includes a cathode surrounded only by silicon dioxide; an anode; and a polysilicon-silicide programmable link coupling the anode and the cathode, wherein the anode and the polysilicon-silicide programmable link are surrounded by a low dielectric constant (low-k) material on a top and a side thereof.
摘要:
A semiconductor fuse structure comprises an anode connected to a first end of a fuse link, a cathode connected to a second end of the fuse link opposite the first end of the fuse link, a compressive (nitride) liner covering the anode, and a tensile (nitride) liner covering the cathode. The compressive liner and the tensile liner are positioned to cause a net stress gradient between the cathode and the anode, wherein the net stress gradient promotes electromigration from the cathode and the fuse link to the anode.
摘要:
Structures having an isolation structure including deuterium and a related method are disclosed. The deuterium is preferably substantially uniformly distributed, and has a concentration (based on total hydrogen atom content) greater than that found in naturally occurring hydrogen. One structure includes a substrate for a semiconductor device including an isolation structure within the substrate, the isolation structure including substantially uniformly distributed deuterium in a concentration (based on total hydrogen atom content) greater than that found in naturally occurring hydrogen. The substrate may include a semiconductor-on-insulator substrate. A method may include the steps of: providing an isolation structure in a substrate, the isolation structure including deuterium; and annealing to diffuse the deuterium into the substrate (prior to and/or after forming a gate dielectric). The structures and method provide a more efficient means for incorporating deuterium and reducing defects. In addition, the deuterium anneal can occur prior to gate dielectric formation during front-end-of-line processes, such that the anneal temperature can be high to improve deuterium incorporation with reduced anneal time.