公开(公告)号：US20210008832A1

公开(公告)日：2021-01-14

申请号：US17041876

申请日：2019-03-27

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Dean Michael Thelen

IPC: B32B7/027 ,  B32B17/06

Abstract: A laminated glass structure is provided that includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, the laminated glass structure is characterized by a transmission power of at least 75% and at least 55% for signals at 28 GHz and 60 GHz, respectively, as calculated in a Three-Layer Model.

公开(公告)号：US10253550B1

公开(公告)日：2019-04-09

申请号：US15336879

申请日：2016-10-28

Applicant: Corning Incorporated

Inventor： Jin Su Kim ,  Aize Li ,  Timothy James Orsley

IPC: E06B3/677 ,  E06B3/673 ,  E06B3/66 ,  E06B3/663 ,  C03C15/00 ,  B44C1/22 ,  C03C27/10

Abstract: A vacuum insulated glass unit includes a first and a second glass pane and a pane bonding layer. The first and second glass panes each include a vacuum chamber side opposite an outer side. The vacuum chamber side of the first glass pane includes an etched interior surface, a glass pane periphery having a periphery surface, and a plurality of glass spacers each having an end surface. The pane bonding layer is positioned between and engaged with the periphery surface of the glass pane periphery of the first glass pane and the second glass pane and couples the first glass pane to the second glass pane. Each end surface of the plurality of glass spacers and the periphery surface of the glass pane periphery are offset from the etched interior surface such that a vacuum chamber is disposed between the first and the second glass panes.

公开(公告)号：US12043575B2

公开(公告)日：2024-07-23

申请号：US18201303

申请日：2023-05-24

Applicant: CORNING INCORPORATED

Inventor： Douglas Clippinger Allan ,  Vladislav Yuryevich Golyatin ,  Petr Gorelchenko ,  Jason Thomas Harris ,  Jin Su Kim ,  Peter Joseph Lezzi ,  Rostislav Vatchev Roussev ,  Natesan Venkataraman

IPC: C03C21/00 ,  B32B17/06 ,  C03C27/02 ,  C03C27/06

CPC classification number: C03C27/06 ,  B32B17/06 ,  C03C21/002 ,  B32B2307/558

Abstract: A laminated glass article comprises a core layer comprising a core glass composition, and a cladding layer directly adjacent to the core layer and comprising a clad glass composition. A stress of the cladding layer increases with increasing distance from an outer surface of the cladding layer from a compressive stress to a tensile stress, transitions to a compressive stress as a step-change at an interface region between the core layer and the cladding layer, and increases with increasing distance from the interface region to a center of the core layer from the compressive stress to a tensile stress.

公开(公告)号：US12032216B2

公开(公告)日：2024-07-09

申请号：US17044707

申请日：2019-04-03

Applicant: CORNING INCORPORATED

Inventor： Lars Martin Otfried Brusberg ,  Jin Su Kim ,  Aramais Robert Zakharian

IPC: G02B6/42 ,  C03C3/04 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: G02B6/4281 ,  C03C3/04 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/0011

Abstract: Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).

公开(公告)号：US20230295038A1

公开(公告)日：2023-09-21

申请号：US18201303

申请日：2023-05-24

Applicant: CORNING INCORPORATED

Inventor： Douglas Clippinger Allan ,  Vladislav Yuryevich Golyatin ,  Petr Gorelchenko ,  Jason Thomas Harris ,  Jin Su Kim ,  Peter Joseph Lezzi ,  Rostislav Vatchev Roussev ,  Natesan Venkataraman

IPC: C03C27/06 ,  B32B17/06 ,  C03C21/00

CPC classification number: C03C27/06 ,  B32B17/06 ,  C03C21/002 ,  B32B2307/558

Abstract: A laminated glass article comprises a core layer comprising a core glass composition, and a cladding layer directly adjacent to the core layer and comprising a clad glass composition. A stress of the cladding layer increases with increasing distance from an outer surface of the cladding layer from a compressive stress to a tensile stress, transitions to a compressive stress as a step-change at an interface region between the core layer and the cladding layer, and increases with increasing distance from the interface region to a center of the core layer from the compressive stress to a tensile stress.

公开(公告)号：US11508575B2

公开(公告)日：2022-11-22

申请号：US16916385

申请日：2020-06-30

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Yu Xiao

IPC: H01L21/02 ,  C03B33/07

Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion αcore, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion αclad, where αclad>αcore; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.

公开(公告)号：US20220274871A1

公开(公告)日：2022-09-01

申请号：US17632086

申请日：2020-07-31

Applicant: CORNING INCORPORATED

Inventor： Douglas Clippinger Allan ,  Vladislav Yuryevich Golyatin ,  Petr Gorelchenko ,  Jason Thomas Harris ,  Jin Su Kim ,  Peter Joseph Lezzi ,  Rostislav Vatchev Roussev ,  Natesan Venkataraman

IPC: C03C27/06 ,  C03C21/00 ,  B32B17/06

Abstract: A laminated glass article comprises a core layer comprising a core glass composition, and a cladding layer directly adjacent to the core layer and comprising a clad glass composition. A stress of the cladding layer increases with increasing distance from an outer surface of the cladding layer from a compressive stress to a tensile stress, transitions to a compressive stress as a step-change at an interface region between the core layer and the cladding layer, and increases with increasing distance from the interface region to a center of the core layer from the compressive stress to a tensile stress.

公开(公告)号：US20210069710A1

公开(公告)日：2021-03-11

申请号：US17049676

申请日：2019-04-23

Applicant: CORNING INCORPORATED

Inventor： Ye Fang ,  Jin Su Kim ,  Aize Li

IPC: B01L3/00

Abstract: A method for manufacturing a microfluidic device (100) includes depositing a bonding layer (106) on a surface of a second glass layer (104a) of a glass substrate having a first glass layer (102) and the second glass layer (104a) fused to the first glass layer (102), such that a masked region of the surface is covered by the bonding layer, and an exposed region of the surface is uncovered by the bonding layer; removing a portion of the second glass layer corresponding to the exposed region of the surface to form a flow channel (112) in the glass substrate; and bonding a cover (108) to the glass substrate with the bonding layer (106).

公开(公告)号：US20210043528A1

公开(公告)日：2021-02-11

申请号：US17044713

申请日：2019-04-03

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Scott Christopher Pollard

IPC: H01L23/15 ,  H01L23/00 ,  H01L23/538 ,  H01L23/36 ,  H05K1/02 ,  H05K1/03 ,  H01L21/50 ,  H01L23/66

Abstract: An electronic package assembly includes a glass substrate including an upper glass cladding layer, a lower glass cladding layer, a glass core layer coupled to the upper glass cladding layer and the lower glass cladding layer, where the upper glass cladding layer and the lower glass cladding layer have a higher etch rate in an etchant than the glass core layer, a first cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, and a second cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, a microprocessor positioned within the first cavity, and a micro-electronic component positioned within the second cavity.

公开(公告)号：US10457595B2

公开(公告)日：2019-10-29

申请号：US15522198

申请日：2015-10-29

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Leonard Charles Dabich, II ,  David Alan Deneka ,  Jin Su Kim ,  Shari Elizabeth Koval ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: B32B17/00 ,  B32B17/06 ,  B32B7/04 ,  C03C23/00 ,  C03C17/02 ,  C03C17/23 ,  C03C27/06 ,  H01L51/52 ,  C03C3/14 ,  C03C3/247 ,  C03C17/06 ,  C03C27/04 ,  C03C27/10 ,  C01G19/02 ,  C03C3/16 ,  C03C3/23 ,  C03C15/00

Abstract: A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σtensile stress location)/(σinterface laser weld)) 10 MPa or >1 MPa where σtensile stress location is the stress present in the first substrate and σinterface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.