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公开(公告)号：US12084373B2
公开(公告)日：2024-09-10
申请号：US17435539
申请日：2020-02-24
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Timothy Michael Gross , Jin Su Kim , Jesse Kohl , Hung Cheng Lu , Yu Xiao , Liying Zhang , Lu Zhang
CPC classification number: C03B17/02 , B32B17/06 , C03B17/064 , C03C3/091 , C03C3/093 , B32B2307/30
Abstract: Methods for manufacturing glass articles having a target effective coefficient of thermal expansion CTETeff averaged over a temperature range comprise selecting a glass core composition having an average core glass coefficient of thermal expansion CTEcore that is greater than the target effective CTETeff and a glass clad composition having an average clad glass coefficient of thermal expansion CTEclad that is less than the target effective CTETeff; and manufacturing a glass laminate comprising a glass core layer formed from the glass core composition and two or more glass cladding layers fused to the glass core layer, each of the two or more glass cladding layers formed from the glass clad composition such that a ratio of a thickness of the glass core layer to a total thickness of the two or more glass cladding layers is selected to produce the glass laminate having an effective coefficient of thermal expansion CTEeff that is within ±0.5 ppm/° C. of the target effective CTETeff.
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公开(公告)号：US12064938B2
公开(公告)日：2024-08-20
申请号：US17605103
申请日：2020-04-13
Applicant: CORNING INCORPORATED
Inventor： Jason Thomas Harris , Jin Su Kim , Peter Joseph Lezzi , Natesan Venkataraman
CPC classification number: B32B17/06 , C03B17/064 , C03B27/0413 , C03B27/0526 , C03C21/002 , C03C23/007 , B32B7/027 , B32B2307/50 , C03C2203/50
Abstract: A laminated glass article comprises a core layer comprising a core glass composition having an average core coefficient of thermal expansion (CTEcore) and a clad layer directly adjacent to the core layer and comprising a clad glass composition having an average clad coefficient of thermal expansion (CTEclad) that is less than the CTEcore such that the clad layer is in compression and the core layer is in tension. A compressive stress of the clad layer increases with increasing distance from the outer surface of the clad layer, transitions to a minimum tensile stress as a step-change at an interface region between the core layer and the clad layer, and a magnitude of the tensile stress increases continuously to a maximum tensile stress in the core layer. Other stress profiles, and methods of preparing laminated glass articles are also disclosed.
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公开(公告)号：US11912010B2
公开(公告)日：2024-02-27
申请号：US17437191
申请日：2020-02-25
Applicant: CORNING INCORPORATED
Inventor： Petr Gorelchenko , Jin Su Kim , Lu Zhang
CPC classification number: B32B7/028 , B32B17/06 , C03C3/091 , C03C3/097 , C03C4/18 , B32B2250/03 , B32B2307/308 , C03C21/002 , C03C2204/00
Abstract: A glass substrate comprises a glass clad layer fused to a glass core layer. The glass core layer comprises a core glass composition having an average core coefficient of thermal expansion (CTEcore) and the glass clad layer comprises a clad glass composition having an average clad coefficient of thermal expansion (CTEclad) that is less than the CTEcore. A maximum tensile stress in the glass core layer is less than 15 MPa.
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公开(公告)号：US11875993B2
公开(公告)日：2024-01-16
申请号：US17967354
申请日：2022-10-17
Applicant: CORNING INCORPORATED
Inventor： Jin Su Kim , Yu Xiao
CPC classification number: H01L21/02422 , C03B33/076
Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion αcore, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion αclad, where αclad>αcore; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.
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公开(公告)号：US20220149004A1
公开(公告)日：2022-05-12
申请号：US17435574
申请日：2020-02-24
Applicant: CORNING INCORPORATED
Inventor： Jin Su Kim , Yu Xiao
Abstract: A wafer- or panel-level encapsulated package comprises a glass substrate comprising a glass cladding layer (105) fused to a glass core layer (110), the glass substrate comprising a cavity (425), wherein the glass cladding layer has a higher etch rate in an etchant than the glass core layer. The wafer- or panel-level encapsulated package further comprises a microelectronic component (700) disposed in the cavity, and an encapsulant (702) sealed to the glass substrate such that the microelectronic component is encapsulated within the cavity. Methods for forming the wafer- or panel-level encapsulated package, including etching a cavity into a glass substrate, depositing a microelectronic component into the cavity, and sealing an encapsulant to the glass substrate such that the microelectronic component is encapsulated within the cavity are also provided.
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Patent Agency Ranking
公开(公告)号：US11296038B2
公开(公告)日：2022-04-05
申请号：US17043567
申请日：2019-04-03
Applicant: CORNING INCORPORATED
Inventor： Jin Su Kim , Dean Michael Thelen
IPC: H01L21/00 , H01L23/552 , H01L21/48
Abstract: Structured glass articles include a glass substrate including a glass cladding layer fused to a glass core layer, a cavity formed in the glass substrate, and a shielding layer disposed within the cavity. In some embodiments, a passivation layer is disposed within the cavity such that the shielding layer is between the passivation layer and the glass substrate. A method for forming a glass fan-out includes depositing a shielding layer within a cavity in a glass substrate. The glass substrate includes a glass cladding layer fused to a glass core layer. A silicon chip may be deposited within the cavity. In some embodiments, the method also includes depositing a passivation layer within the cavity such that the shielding layer is between the passivation layer and the glass substrate.
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公开(公告)号：US11267221B2
公开(公告)日：2022-03-08
申请号：US17041876
申请日：2019-03-27
Applicant: CORNING INCORPORATED
Inventor： Jin Su Kim , Dean Michael Thelen
Abstract: A laminated glass structure is provided that includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, the laminated glass structure is characterized by a transmission power of at least 75% and at least 55% for signals at 28 GHz and 60 GHz, respectively, as calculated in a Three-Layer Model.
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公开(公告)号：US20200235020A1
公开(公告)日：2020-07-23
申请号：US16633368
申请日：2018-07-24
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun Ro Yoon
IPC: H01L23/13 , C03C15/00 , B32B17/06 , C03C3/087 , C03C3/091 , C03C3/093 , C03C3/097 , H01L23/15 , H01L23/498 , B81B1/00 , H01L21/48
Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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公开(公告)号：US20240400434A1
公开(公告)日：2024-12-05
申请号：US18800607
申请日：2024-08-12
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Timothy Michael Gross , Jin Su Kim , Jesse Kohl , HungCheng Lu , Yu Xiao , Liying Zhang , Lu Zhang
Abstract: Methods for manufacturing glass articles having a target effective coefficient of thermal expansion CTETeff averaged over a temperature range comprise selecting a glass core composition having an average core glass coefficient of thermal expansion CTEcore that is greater than the target effective CTETeff and a glass clad composition having an average clad glass coefficient of thermal expansion CTEclad that is less than the target effective CTETeff; and manufacturing a glass laminate comprising a glass core layer formed from the glass core composition and two or more glass cladding layers fused to the glass core layer, each of the two or more glass cladding layers formed from the glass clad composition such that a ratio of a thickness of the glass core layer to a total thickness of the two or more glass cladding layers is selected to produce the glass laminate having an effective coefficient of thermal expansion CTEeff that is within ±0.5 ppm/° C. of the target effective CTETeff.
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10.发明公开公开(公告)号：US20240319458A1
公开(公告)日：2024-09-26
申请号：US18736771
申请日：2024-06-07
Applicant: CORNING INCORPORATED
Inventor： Lars Martin Otfried Brusberg , Jin Su Kim , Aramais Robert Zakharian
CPC classification number: G02B6/4281 , C03C3/04 , H05K1/0274 , H05K1/0306 , H05K3/0011
Abstract: Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.
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