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41.
公开(公告)号:US09236397B2
公开(公告)日:2016-01-12
申请号:US14172365
申请日:2014-02-04
Applicant: GLOBALFOUNDRIES INC.
Inventor: Judson R. Holt , Jinghong Li , Sanjay Mehta , Alexander Reznicek , Dominic J. Schepis
IPC: H01L27/12 , H01L27/088 , H01L21/8234 , H01L29/16 , H01L21/84 , H01L29/66 , H01L21/02 , H01L21/265
CPC classification number: H01L27/1211 , H01L21/02247 , H01L21/02252 , H01L21/02255 , H01L21/02329 , H01L21/0234 , H01L21/26506 , H01L21/31155 , H01L21/823431 , H01L21/845 , H01L27/0886 , H01L29/16 , H01L29/66545 , H01L29/6656 , H01L29/66795
Abstract: A composite spacer structure is formed on vertical sidewalls of a gate structure that is formed straddling a semiconductor fin. In one embodiment, the composite spacer structure includes an inner low-k dielectric material portion and an outer nitride material portion.
Abstract translation: 在跨越半导体鳍片的栅极结构的垂直侧壁上形成复合间隔物结构。 在一个实施例中,复合间隔物结构包括内部低k电介质材料部分和外部氮化物材料部分。
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公开(公告)号:US20130175547A1
公开(公告)日:2013-07-11
申请号:US13783526
申请日:2013-03-04
Inventor: Kevin K. Chan , Abhishek Dube , Eric C. Harley , Judson R. Holt , Viorel C. Ontalus , Kathryn T. Schonenberg , Matthew W. Stoker , Keith H. Tabakman , Linda R. Black
IPC: H01L29/78
CPC classification number: H01L29/7848 , H01L21/26586 , H01L21/823412 , H01L21/823425 , H01L21/823481 , H01L21/823807 , H01L21/823814 , H01L21/84 , H01L29/66628 , H01L29/66772 , H01L29/78618 , H01L29/78684
Abstract: A method for forming a field effect transistor device includes forming a gate stack portion on a substrate, forming a spacer portion on the gates stack portion and a portion of the substrate, removing an exposed portion of the substrate, epitaxially growing a first silicon material on the exposed portion of the substrate, removing a portion of the epitaxially grown first silicon material to expose a second portion of the substrate, and epitaxially growing a second silicon material on the exposed second portion of the substrate and the first silicon material.
Abstract translation: 一种用于形成场效应晶体管器件的方法,包括:在衬底上形成栅极叠层部分,在栅堆叠部分和衬底的一部分上形成间隔部分,去除衬底的暴露部分,将第一硅材料外延生长 衬底的暴露部分,去除外延生长的第一硅材料的一部分以暴露衬底的第二部分,以及在衬底的暴露的第二部分和第一硅材料上外延生长第二硅材料。
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