公开(公告)号：US20200030614A1

公开(公告)日：2020-01-30

申请号：US16589752

申请日：2019-10-01

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Thomas Marzano ,  Marc Gregory Martino

IPC: A61N1/375 ,  A61N1/05 ,  H01G4/40 ,  H01G4/005 ,  A61N1/08 ,  H01R43/00 ,  C22C29/12 ,  H02G3/22 ,  H01G4/30 ,  B23K35/30 ,  H01G2/10 ,  H01G4/35 ,  H01R13/52 ,  H01G4/236 ,  B23K35/32 ,  H01R4/02 ,  H01R13/719 ,  B23K35/02

Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k.

公开(公告)号：US20190321628A1

公开(公告)日：2019-10-24

申请号：US16452785

申请日：2019-06-26

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  H05K1/18 ,  H01G4/35 ,  H05K9/00 ,  H03H1/00 ,  H01R13/7195 ,  H03H7/01 ,  H05K5/00 ,  H01G4/06 ,  A61N1/375 ,  A61N1/37 ,  H01G4/40

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active metallization that is electrically connected to the active electrode plates and a ground metallization that is electrically connected to the ground electrode plates of the capacitor. A ground electrical path extends from the ground metallization of the chip capacitor to the ferrule. A conductive ground pin is electrically and mechanically connected to the ferrule. The ground path comprises an internal ground plate disposed within the circuit board substrate. The internal ground plate is electrically connected to the ground metallization of the chip capacitor and to either the ferrule or the ground pin connected to the ferrule. An active electrical path extends between the active metallization of the chip capacitor and the lead wire.

公开(公告)号：US20190255319A1

公开(公告)日：2019-08-22

申请号：US16391801

申请日：2019-04-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz ,  Marc Gregory Martino

IPC: A61N1/08 ,  A61N1/375 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35

Abstract: A filtered feedthrough assembly for an active implantable medical device (AIMD) includes an insulator hermetically sealed to an opening of an electrically conductive ferrule. A ceramic reinforced metal composite of platinum and alumina (CRMC) material is disposed in an insulator via hole surrounding a substantially pure platinum fill. A capacitor disposed on the insulator device side has a capacitor dielectric with a dielectric constant k that is greater than 0 and less than 1000. Coming from the body fluid side to the device side of the AIMD, the capacitor is the first filter capacitor electrically connected to the substantially pure platinum fill. An active electrical connection electrically connects the substantially pure platinum fill to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and subsequently to the housing of the AIMD

公开(公告)号：US10350421B2

公开(公告)日：2019-07-16

申请号：US15943998

申请日：2018-04-03

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods

IPC: A61N1/00 ,  A61N1/375 ,  A61N1/378 ,  H01R13/52 ,  H01R4/58 ,  H01R13/26 ,  H03H1/00

Abstract: A feedthrough subassembly for an active implantable medical device includes a metallic ferrule having a conductive ferrule body, at least one surface disposed on a device side, and a ferrule opening passing through the at least one surface. An insulator body hermetically seals the ferrule opening of the conductive ferrule body by at least one of a first gold braze ceramic seal, a glass seal or a glass-ceramic seal. At least one hermetically sealed conductive pathway is disposed through the insulator body. At least one pocket formed in the at least one surface has a gold pocket pad disposed within. When the first gold braze ceramic seal is present, the first gold braze ceramic seal and the gold pocket pad are not physically touching one another.

公开(公告)号：US20190001123A1

公开(公告)日：2019-01-03

申请号：US16121716

申请日：2018-09-05

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz ,  Marc Gregory Martino

IPC: A61N1/08 ,  H01G4/005 ,  A61N1/37 ,  H01G4/35 ,  H01G4/30 ,  H01G4/12 ,  A61N1/375 ,  H03H1/00

Abstract: A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device.

公开(公告)号：US10124164B2

公开(公告)日：2018-11-13

申请号：US15651045

申请日：2017-07-17

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/375 ,  H01G4/40 ,  A61N1/08 ,  A61N1/37 ,  H01G4/35 ,  H01R13/7195 ,  H03H1/00 ,  H05K9/00 ,  H03H7/01 ,  H05K5/00 ,  H05K1/18 ,  H01G4/06

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises a conductive pin electrically and mechanically connected to the ferrule by a third gold braze. The ground path comprises an internal ground plate disposed within the circuit board substrate, and the internal ground plate is electrically connected to both the conductive pin and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US10046166B2

公开(公告)日：2018-08-14

申请号：US15164945

申请日：2016-05-26

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Christine A. Frysz

IPC: H01G4/35 ,  A61N1/375 ,  H01G4/12 ,  H01G4/40 ,  H05K1/11 ,  H05K1/09 ,  H05K5/06 ,  H05K1/03 ,  H05K3/40 ,  A61N1/05 ,  A61N1/08 ,  H01G2/10 ,  H01G4/005 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12 ,  C22C32/00

Abstract: A hermetically sealed feedthrough filter assembly is attachable to an active implantable medical device and includes an insulator substrate assembly and a feedthrough filter capacitor disposed on a device side. A conductive leadwire has a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD. The distal leadwire end is disposed at least partially through a first passageway of the feedthrough filter capacitor and is in contact with, adjacent to or near a device side conductive fill. A first electrically conductive material makes a three-way electrically connection that electrically connects the device side conductive fill to an internal metallization of the feedthrough filter capacitor and to the distal leadwire end. A second electrically conductive material electrically connects an external metallization of the feedthrough filter capacitor to a ferrule or an AIMD housing.

公开(公告)号：US10016596B2

公开(公告)日：2018-07-10

申请号：US15398098

申请日：2017-01-04

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz

IPC: A61N1/375 ,  A61N1/08 ,  A61N1/37 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/00 ,  H05K9/00 ,  H03H7/01 ,  H05K5/00 ,  H05K1/18 ,  H01G4/06

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K999/99 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises a conductive pin electrically and mechanically connected to the ferrule by a third gold braze. The ground path comprises an internal ground plate disposed within the circuit board substrate, and the internal ground plate is electrically connected to both the conductive pin and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US20180178017A1

公开(公告)日：2018-06-28

申请号：US15894239

申请日：2018-02-12

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: A61N1/375 ,  A61N1/05 ,  H01G2/10 ,  H01G4/35

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/372 ,  A61N1/375 ,  B22F2998/10 ,  C22C29/12 ,  H01G2/103 ,  H01G4/35 ,  H01R43/00 ,  Y10T156/1052 ,  B22F1/0059 ,  B22F3/10

Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

公开(公告)号：US20180178016A1

公开(公告)日：2018-06-28

申请号：US15844683

申请日：2017-12-18

Applicant: Greatbatch Ltd.

Inventor： Dominick J. Frustaci ,  Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods

IPC: A61N1/375 ,  H01G4/35 ,  H01R13/7195 ,  H01G2/22 ,  H05K1/02 ,  A61N1/05 ,  H01G2/10 ,  A61N1/08 ,  H01G4/40

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  H01G2/103 ,  H01G2/22 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H01R2201/12 ,  H05K1/0231 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10303

Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.