公开(公告)号：US20180311956A1

公开(公告)日：2018-11-01

申请号：US15772313

申请日：2016-02-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Garrett E Clark ,  Michael W. Cumbie ,  Mark H. MacKenzie

IPC: B41J2/14 ,  B41J2/045 ,  B41J2/21

CPC classification number: B41J2/14201 ,  B41J2/04528 ,  B41J2/04563 ,  B41J2/0458 ,  B41J2/04581 ,  B41J2/1408 ,  B41J2/14153 ,  B41J2/2146 ,  B41J2202/08 ,  B41J2202/20

Abstract: The present disclosure includes a description of an example printhead having multiple ejection dies. The ejection dies are coupled to a temperature sensor and send temperature signals to a controller. The printhead can also include a heater coupled to the ejection dies to apply heat to at least one ejection die.

公开(公告)号：US20180304624A1

公开(公告)日：2018-10-25

申请号：US16024302

申请日：2018-06-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Peter James Fricke ,  Michael W. Cumbie ,  Scott A. Linn

IPC: B41J2/045

CPC classification number: B41J2/04541 ,  B41J2/0452 ,  B41J2/04528 ,  B41J2/04543 ,  B41J2/04573 ,  B41J2/0458 ,  B41J2/04596 ,  B41J2/04598 ,  B41J2202/13 ,  B41J2202/21

Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.

公开(公告)号：US10081186B2

公开(公告)日：2018-09-25

申请号：US15646163

申请日：2017-07-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/045

CPC classification number: B41J2/1601 ,  B41J2/04523 ,  B41J2/14145 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1637 ,  B41J2/1639 ,  B41J2/1645 ,  B41J2202/19 ,  B41J2202/20

Abstract: In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

公开(公告)号：US10022962B1

公开(公告)日：2018-07-17

申请号：US15665560

申请日：2017-08-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Scott A. Linn ,  George H. Corrigan, III ,  Michael W. Cumbie

IPC: B41J2/045 ,  B41J2/14 ,  B41J2/21

Abstract: A fluidic die may include a number of actuators. The number of actuators form a number of primitives. The fluidic die may include a digital-to-analog converter (DAC) to drive a number of the delay circuits. The delay circuits delay a number of activation pulses that activate the actuators associated with the primitives to reduce peak power demands of the fluidic die. A number of delay circuits may be coupled to each primitive.

公开(公告)号：US20180154636A1

公开(公告)日：2018-06-07

申请号：US15890058

申请日：2018-02-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/155 ,  B41J2/16 ,  B41J2/14

CPC classification number: B41J2/155 ,  B41J2/14 ,  B41J2/1404 ,  B41J2/14129 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/145 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1637 ,  B41J25/34 ,  B41J2002/14419 ,  B41J2202/20

Abstract: In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow to the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.

公开(公告)号：US20180147841A1

公开(公告)日：2018-05-31

申请号：US15570827

申请日：2015-07-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Garrett E. Clark ,  Michael W. Cumbie ,  Mark H. MacKenzie ,  Jose Luis Valero

IPC: B41J2/045 ,  B41J2/14

CPC classification number: B41J2/04563 ,  B41J2/04508 ,  B41J2/0458 ,  B41J2/14153 ,  B41J2/155

Abstract: A temperature of one printing element is adjusted based upon a temperature of another of printing element.

公开(公告)号：US20180001636A1

公开(公告)日：2018-01-04

申请号：US15544999

申请日：2015-03-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Zhizhang Chen ,  James Elmer Abbott, JR. ,  Michael W. Cumbie ,  Roberto A. Pugliese

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14129 ,  B41J2/14024 ,  B41J2/1603 ,  B41J2/1642 ,  B41J2/1646

Abstract: In one example, a printhead structure includes an ejector element, a multi-layer insulator covering the ejector element, and an amorphous metal on the insulator.

公开(公告)号：US09731509B2

公开(公告)日：2017-08-15

申请号：US14770425

申请日：2013-07-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1637 ,  B41J2/14016 ,  B41J2/14201 ,  B41J2/1601 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1645 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20

Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding, and a fluid feed hole formed through the micro device. A fluid channel is fluidically coupled to the fluid feed hole and includes a first compression molded channel segment and a second material ablated channel segment.

公开(公告)号：US20170072693A1

公开(公告)日：2017-03-16

申请号：US15341851

申请日：2016-11-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/155

CPC classification number: B41J2/155 ,  B41J2/14 ,  B41J2/1404 ,  B41J2/14129 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/145 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1637 ,  B41J25/34 ,  B41J2002/14419 ,  B41J2202/20

Abstract: In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow o the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.

Abstract translation: 在一个示例中，流体喷射装置包括嵌入印刷电路板中的打印头芯片。 流体可以通过印刷电路板中的插入式流体供给槽并进入打印头芯片而流过打印头芯片。

公开(公告)号：US20170072690A1

公开(公告)日：2017-03-16

申请号：US15113520

申请日：2014-01-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua CHEN ,  Michael G. Groh ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2/1637 ,  B41J2002/14491

Abstract: The present disclosure includes a flexible carrier along with a system and a method including the flexible carrier.

Abstract translation: 本公开包括柔性载体以及包括柔性载体的系统和方法。