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公开(公告)号:US20170072690A1
公开(公告)日:2017-03-16
申请号:US15113520
申请日:2014-01-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua CHEN , Michael G. Groh , Michael W. Cumbie
CPC classification number: B41J2/1433 , B41J2/1601 , B41J2/1623 , B41J2/1637 , B41J2002/14491
Abstract: The present disclosure includes a flexible carrier along with a system and a method including the flexible carrier.
Abstract translation: 本公开包括柔性载体以及包括柔性载体的系统和方法。
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公开(公告)号:US12134274B2
公开(公告)日:2024-11-05
申请号:US18454771
申请日:2023-08-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Michael G. Groh
Abstract: An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.
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公开(公告)号:US11148942B2
公开(公告)日:2021-10-19
申请号:US15761192
申请日:2015-11-05
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Devin A. Mourey , Michael G. Groh
Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.
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公开(公告)号:US11807523B2
公开(公告)日:2023-11-07
申请号:US17482309
申请日:2021-09-22
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Devin A. Mourey , Michael G. Groh
CPC classification number: B81C99/008 , B01L3/0268 , B41J2/155 , B41J2/1603 , B41J2/1637 , B81C1/00309 , B41J2202/19 , B41J2202/20 , B41J2202/21 , B81B2201/052 , B81B2201/058 , B81B2203/0315 , B81B2203/0338 , B81C2201/0188 , B81C2203/0154
Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.
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公开(公告)号:US20220184949A1
公开(公告)日:2022-06-16
申请号:US17414216
申请日:2019-09-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael G. Groh
IPC: B41J2/14
Abstract: A fluid ejection head may include a fluid ejection face through which fluid ejection orifices extend. A coating is selectively coated over first portions of the fluid ejection face. Second portions of the fluid ejection face omit the coating.
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公开(公告)号:US20220143978A1
公开(公告)日:2022-05-12
申请号:US17417875
申请日:2019-07-30
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael G. Groh , Bo Song
Abstract: Aspects of the present disclosure are directed to forming a layer of material on a print head. As may be implemented in a manner consistent with examples herein, a layer of material from a transfer film is pressed against a surface of a print head, in which the surface defines fluid nozzle openings that extend from the surface into the print head. Portions of the material pressed onto the surface are therein adhered to the surface and caused to wrap over edges of the surface extending around the openings The transfer film is removed along with a thickness of the material pressed into contact with the surface that remains adhered to the transfer film, as well as some or all of other regions of the material over the openings The remaining layer of the material on the surface is thus formed with a uniform thickness.
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公开(公告)号:US20220126577A1
公开(公告)日:2022-04-28
申请号:US17312743
申请日:2019-06-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Michael G. Groh
Abstract: An example fluidic device may comprise a fluidic die, a unitary molded structure, and a fluidic fan-out structure—The unitary molded structure may comprise thermo-electric traces and fluidic channels and may be coupled to the fluidic die. A first dimension of the fluidic channels is between ten μm to two hundred μm, or less. The fluidic fan-out structure may also be coupled to the molded structure. The fluidic die, the molded structure, and the fluidic fan-out structure may be arranged such that a first fluidic channel of the fluidic channels is in fluid communication with an aperture of the fluidic die at a first extremity and to a fluidic fan-out fluid channel through hole of the fluidic fan-out structure at a second extremity.
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公开(公告)号:US20240192599A1
公开(公告)日:2024-06-13
申请号:US18554774
申请日:2021-04-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Bo Song , Chien-Hua Chen , Michael G. Groh
CPC classification number: G03F7/0757 , B41J2/1606 , B41J2/1631 , B41J2/1645 , C08L83/06 , G03F7/0035 , G03F7/0385 , G03F7/162 , G03F7/168 , G03F7/2002 , G03F7/2022
Abstract: A photo-definable hydrophobic composition (“composition”) is presented. The composition can include from about 0.01 wt % to about 20 wt % of a polyether modified siloxane and from about 80 wt % to about 99.99 wt % of a polymeric photoresist. The polymeric photoresist can be selected from an epoxy-based photoresist, a bisbenzocyclobutene-based photoresist, a polyimide-based photoresist, a polybenzoxazole-based photoresist, a polyimide-polybenzoxazole-based photoresist, an admixture, or a combination thereof.
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公开(公告)号:US11691423B2
公开(公告)日:2023-07-04
申请号:US17417875
申请日:2019-07-30
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael G. Groh , Bo Song
CPC classification number: B41J2/1606 , B41J2/1433 , B41J2002/14475
Abstract: Aspects of the present disclosure are directed to forming a layer of material on a print head. As may be implemented in a manner consistent with examples herein, a layer of material from a transfer film is pressed against a surface of a print head, in which the surface defines fluid nozzle openings that extend from the surface into the print head. Portions of the material pressed onto the surface are therein adhered to the surface and caused to wrap over edges of the surface extending around the openings. The transfer film is removed along with a thickness of the material pressed into contact with the surface that remains adhered to the transfer film, as well as some or all of other regions of the material over the openings. The remaining layer of the material on the surface is thus formed with a uniform thickness.
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公开(公告)号:US20230143672A1
公开(公告)日:2023-05-11
申请号:US17912873
申请日:2020-04-10
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Michael G. Groh
IPC: B01L3/00
CPC classification number: B01L3/502707 , B01L3/502715
Abstract: A molded microfluidic substrate includes a molding compound layer. The molded microfluidic substrate includes a microfluidic channel. The microfluidic channel of the molded microfluidic substrate is formed within the molding compound layer of the molded microfluidic substrate. The microfluidic channel of the molded microfluidic substrate corresponds to a sacrificial metal bond wire.
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