公开(公告)号：US06531568B1

公开(公告)日：2003-03-11

申请号：US09762260

申请日：2001-04-09

申请人： Atsushi Shibuya ,  Tomomi Okumura ,  Hideaki Oikawa ,  Yoshihiro Sakata ,  Takashi Kuroki ,  Yuichi Okawa ,  Shoji Tamai

发明人： Atsushi Shibuya ,  Tomomi Okumura ,  Hideaki Oikawa ,  Yoshihiro Sakata ,  Takashi Kuroki ,  Yuichi Okawa ,  Shoji Tamai

IPC分类号： C08G7310

CPC分类号： C08G73/10 ,  C08G73/101

摘要： This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.

摘要翻译： 本发明提供了各种已知的热塑性聚酰亚胺骨架结构的含交联性基团的聚酰亚胺，其具有比已知结构的聚酰亚胺更好的耐热性，耐化学性和机械性能，而不损害优异的成型性或成型性，优异的滑动性，低水 吸收性能，优异的电性能，高热氧化稳定性和高耐辐射性，所有这些都是结构固有的。

公开(公告)号：US06458912B1

公开(公告)日：2002-10-01

申请号：US09674916

申请日：2001-02-05

申请人： Takashi Kuroki ,  Yoshihiro Sakata ,  Tomomi Okumura ,  Atsushi Shibuya ,  Yuichi Okawa ,  Hideaki Oikawa ,  Kayako Yanagihara ,  Yasunori Yoshida ,  Masaji Yoshimura ,  Hiroyasu Kido ,  Shoji Tamai

发明人： Takashi Kuroki ,  Yoshihiro Sakata ,  Tomomi Okumura ,  Atsushi Shibuya ,  Yuichi Okawa ,  Hideaki Oikawa ,  Kayako Yanagihara ,  Yasunori Yoshida ,  Masaji Yoshimura ,  Hiroyasu Kido ,  Shoji Tamai

IPC分类号： C08G7300

CPC分类号： C08G73/1042 ,  C08G73/101 ,  C08G73/105

摘要： A thermoplastic polyimide having good thermal stability, comprising a repeating unit represented by the chemical formula (1), a molecular terminal being composed of the chemical formula (2) and/or chemical formula (3), characterized in that: a melt viscosity ratio calculated by the numerical formula (1) and/or the numerical formula (3) is within a numerical range shown in the numerical formula (2) and/or the numerical formula (4) and 1,3-bis(4-aminophenoxy)benzene represented by the chemical formula (3) for production of the above polyimide, characterized in that the content of an azo compound is from 0.0 to 0.2%. The thermoplastic polyimide of the present invention has excellent characteristics {circle around (1)} to {circle around (4)} described below. {circle around (1)} It is superior in thermal stability on melting. That is, the degree of lowering of the fluidity on melting with a lapse of time is small and it is possible to apply to conventional melt molding. {circle around (2)} It has high heat resistance. {circle around (3)} It is superior in productivity. {circle around (4)} It is superior in dimensional accuracy.

摘要翻译： 一种具有良好热稳定性的热塑性聚酰亚胺，其包含由化学式（1）表示的重复单元，由化学式（2）和/或化学式（3）组成的分子末端，其特征在于：熔体粘度比 由式（1）和/或数值式（3）计算的数值在数值式（2）和/或数值式（4）和1,3-双（4-氨基苯氧基） 由化学式（3）表示的用于制备上述聚酰亚胺的苯，其特征在于偶氮化合物的含量为0.0-0.2％。 本发明的热塑性聚酰亚胺具有以下所述的{圆周（1）}〜{圆周（4）}的特性。 {circle around（1）}熔融时的热稳定性优异。 也就是说，随着时间的流逝，熔融流动性的降低程度小，可以适用于常规的熔融成型。 {circle around（2）}它具有很高的耐热性。 {circle around（3）}它的生产力优越。 {circle around（4）}尺寸精度优越。

公开(公告)号：US6103806A

公开(公告)日：2000-08-15

申请号：US216867

申请日：1998-12-21

申请人： Hiroyasu Kido ,  Masaji Yoshimura ,  Yasunori Yoshida ,  Kayako Yanagihara ,  Hideaki Oikawa ,  Shoji Tamai ,  Tomohito Koba

发明人： Hiroyasu Kido ,  Masaji Yoshimura ,  Yasunori Yoshida ,  Kayako Yanagihara ,  Hideaki Oikawa ,  Shoji Tamai ,  Tomohito Koba

IPC分类号： C08L79/08

CPC分类号： C08L79/08

摘要： A polyimide resin composition is disclosed herein which comprises 5 to 60% by weight of a polyimide [polyimide (1)] having a repeating unit represented by the chemical formula 1 and 40 to 95% by weight of a polyimide [polyimide (2)] having a repeating unit represented by the chemical formula 2. According to the present invention, there are provided a polymer alloy in which the advantages of the polyimide (1) and the polyimide (2) are utilized and the disadvantages of the polyimide (1) and the polyimide (2) are reduced; a polyimide resin composition from which crystalline molded articles can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds; and a polyimide resin composition from which molded articles having an excellent dimensional accuracy and flexural modulus can be obtained even by a usual molding cycle, for example, an injection molding cycle of about 30 to 60 seconds, for example, in the case that the molded articles are intended to be used at a high temperature of 230.degree. C. or more, for example, a temperature of 230 to 300.degree. C., or 230 to 250.degree. C.

摘要翻译： 本文公开了一种聚酰亚胺树脂组合物，其包含5至60重量％的具有由化学式1表示的重复单元的聚酰亚胺[聚酰亚胺（1）]和40至95重量％的聚酰亚胺[聚酰亚胺（2）] 具有由化学式2表示的重复单元。根据本发明，提供了使用聚酰亚胺（1）和聚酰亚胺（2）的优点的聚合物合金，并且聚酰亚胺（1） 并且聚酰亚胺（2）被还原; 聚酰亚胺树脂组合物，甚至可以通过通常的成型周期获得结晶模制品，例如约30至60秒的注塑周期; 以及聚酰亚胺树脂组合物，即使在通常的成型周期（例如，注射成型周期为约30〜60秒）下，也可以获得具有优异的尺寸精度和挠曲模量的成型制品，例如在成型 制品应在230℃或更高的高温下使用，例如温度为230-300℃，或230-250℃。

公开(公告)号：US5300620A

公开(公告)日：1994-04-05

申请号：US79753

申请日：1993-06-22

申请人： Hideaki Okikawa ,  Shoji Tamai ,  Katsuaki Iiyama ,  Saburo Kawashima ,  Akihiro Yamaguchi ,  Tadashi Asanuma

发明人： Hideaki Okikawa ,  Shoji Tamai ,  Katsuaki Iiyama ,  Saburo Kawashima ,  Akihiro Yamaguchi ,  Tadashi Asanuma

IPC分类号： C08G73/10 ,  C09J179/08 ,  H05K3/38 ,  C08G69/26 ,  C08L79/08

CPC分类号： C08G73/1071 ,  C08G73/1014 ,  C08G73/1017 ,  C09J179/08 ,  H05K3/386 ,  Y10S525/928

摘要： The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength. Consequently, the heat-resistant adhesive of the invention is very useful for the adhesion of structural and electronic materials and other industrial materials.

摘要翻译： 本发明的耐热粘合剂包括通过使用1,3-双（3-氨基苯氧基）苯作为芳族二胺组分和3,3'，4,4'-联苯四羧酸二酐3，3'，4,4'-联苯四羧酸二酐制备的聚酰胺酸和/或聚酰亚胺 ，3'，4,4'-二苯甲酮四羧酸二酐和/或3,3'，4,4'-二苯基醚四羧酸二酐作为四羧酸二酐，并进一步通过用二羧酸酐或单胺化合物封闭聚合物链端; 或者包含在良溶剂中含有聚酰亚胺的聚酰亚胺溶液。 本发明的粘合剂是能够在温和/温和的条件下粘合的耐热粘合剂。 聚酰亚胺溶液的粘合剂可以通过简单的方法提供所需的粘附性，例如施加到被粘物上并在加压下加热并显示出优异的粘合强度。 因此，本发明的耐热粘合剂对于结构和电子材料和其它工业材料的粘合是非常有用的。

公开(公告)号：US5276133A

公开(公告)日：1994-01-04

申请号：US894346

申请日：1992-06-04

申请人： Yuichi Okawa ,  Shoji Tamai ,  Akihiro Yamaguchi

发明人： Yuichi Okawa ,  Shoji Tamai ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08G69/26

CPC分类号： C08G73/10 ,  C08G73/1014

摘要： A favorably processable polyimide which has recurring structural units represented by the formula (I): ##STR1## wherein R is a tetravalent radical having from 2 to 27 carbon atoms and is selected from the group consisting of an aliphatic radical, alicyclic radical, monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected to each other with a direct bond or a bridge member, and is blocked at the polymer chain end with aromatic dicarboxylic anhydride represented by the formula (II): ##STR2## wherein X is a divalent radical selected from the group consisting of a monoaromatic radical having from 6 to 27 carbon atoms, condensed polyaromatic radical and noncondensed aromatic radical connected to each other with a direct bond or a bridge member.

摘要翻译： 具有由式（I）表示的重复结构单元的有利的可加工聚酰亚胺：（*化学结构*）（I）其中R是具有2至27个碳原子的四价基团，并且选自脂族基团 ，脂环族基团，单芳族基团，缩合多芳族基团和非缩合芳族基团，其与直接键合或桥连构件相互连接，并且在聚合物链端用由式（II）表示的芳族二羧酸酐封闭：（* CHEMICAL 结构*）（II）其中X是选自具有6至27个碳原子的单芳族基团的二价基团，缩合的多芳族基团和未缩合的芳香基团彼此直接连接或桥接成员。

公开(公告)号：US5470943A

公开(公告)日：1995-11-28

申请号：US360584

申请日：1994-12-21

申请人： Yoshihiro Sakata ,  Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Tsutomu Ishida ,  Mitsunori Matsuo ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

发明人： Yoshihiro Sakata ,  Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Tsutomu Ishida ,  Mitsunori Matsuo ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08G77/10 ,  C07D213/69 ,  C08G69/26

CPC分类号： C08G73/1039 ,  C08G73/1085

摘要： This invention relates to a novel fluorine-containing polyimide or polyimide copolymer being colorless and having transparency and very low dielectric characteristics, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member, a trifluoromethyl radical is situated at the 3- or the 4-position on a pyridine nucleus, and an imide nitrogen atom is connected at the 3- or the 4-position to an ether bond.The polyimide or polyimide copolymer has excellent heat resistance, outstanding melt-flow stability and greatly improved processability, and also is colorless and has high transparency and very low dielectric coefficient, and can be expected to be used as raw materials for electric.cndot.electronic appliances and optical instruments due to the above characteristics.

摘要翻译： 本发明涉及一种新颖的含氟聚酰亚胺或聚酰亚胺共聚物，其具有透明性和非常低的介电特性，并且具有用于聚酰亚胺的新型芳族二氨基化合物及其制备方法，该聚酰亚胺系树脂组合物含有聚酰亚胺 或聚酰亚胺共聚物和纤维增强剂，树脂组合物的制备方法，树脂组合物的注塑制品。 聚酰亚胺包含具有一个或多个下式的重复结构单元的必需结构单元：其中Ar是具有6至27个碳原子的四价基团，并且选自单芳族基团，缩合多芳族基团 具有芳族基团的自由基和非缩合多芳族基团彼此直接键合或桥接成员，三氟甲基位于吡啶核上的3-或4-位，酰亚胺氮原子连接在3 - 或4-位到醚键。 聚酰亚胺或聚酰亚胺共聚物具有优异的耐热性，优异的熔体流动稳定性和极好的加工性，并且是无色的，具有高透明度和非常低的介电系数，并且可以预期用作电气电子设备的原料 光学仪器由于上述特点。

公开(公告)号：US4994544A

公开(公告)日：1991-02-19

申请号：US431779

申请日：1989-11-06

申请人： Taizo Nagahiro ,  Masahiro Ohta ,  Shuichi Morikawa ,  Nubohito Koga ,  Shoji Tamai

发明人： Taizo Nagahiro ,  Masahiro Ohta ,  Shuichi Morikawa ,  Nubohito Koga ,  Shoji Tamai

IPC分类号： C08G73/10 ,  D01F6/74

CPC分类号： C08G73/1014 ,  C08G73/105 ,  D01F6/74

摘要： A process for the production of polyimide fibers and polyimide fibers obtained by the process. The process includes thermal or chemical imidation of a polyamic acid which has been obtained by reacting a specific diamine and a particular tetracarboxylic dianhydride in the presence of a dicarboxylic anhydride represented by the following formula: ##STR1## wherein Z represents a divalent group selected from the group consisting of monocyclic aromatic groups, fused polycyclic aromatic groups and non-fused polycyclic aromatic groups with aromatic rings bonded together directly or via a crosslinking member.

公开(公告)号：US5763537A

公开(公告)日：1998-06-09

申请号：US577517

申请日：1995-12-22

申请人： Tomomi Yoshimura ,  Wataru Yamashita ,  Shoji Tamai ,  Akihiro Yamaguchi

发明人： Tomomi Yoshimura ,  Wataru Yamashita ,  Shoji Tamai ,  Akihiro Yamaguchi

IPC分类号： C08K5/3417 ,  C08L67/00 ,  C08L79/08

CPC分类号： C08K5/3417

摘要： A is a polyimide based resin molding composition comprising 100 parts by weight of crystalline polyimide having recurring structural units of the formula (1): ##STR1## and 1.about.50 parts by weight of crystallization accelerators selected from bisimide compounds of specific structure, a mixture of bisimide compounds, and imide based oligomer. The composition remarkably accelerates the crystallization velocity of polyimide of the formula (1), crystallization can be completed within a greatly reduced cooling time after melt processing, and the crystallized polyimide resin has excellent properties.

摘要翻译： A是一种聚酰亚胺基树脂模制组合物，其包含100重量份具有式（1）的重复结构单元的结晶聚酰亚胺：1分钟和50分钟的选自特定结构的双酰亚胺化合物的结晶促进剂 ，双酰亚胺化合物和基于酰亚胺的低聚物的混合物。 该组合物显着加速式（1）的聚酰亚胺的结晶速度，在熔融加工后的冷却时间内可以结晶化，结晶化聚酰亚胺树脂具有优异的性能。

公开(公告)号：US5508377A

公开(公告)日：1996-04-16

申请号：US357193

申请日：1994-12-13

申请人： Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Akihiro Yamaguchi

发明人： Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08L79/08 ,  C08G69/26

CPC分类号： C08G73/1085 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1053 ,  C08G73/1071 ,  C08L79/08

摘要： This invention relates to a novel polyimide or polyimide copolymer having excellent heat resistance and greatly improved processability, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein L is an oxygen atom, carbonyl, isopropylidene or hexafluoroisopropylidene, and X is ##STR2## and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member.The polyimide or polyimide copolymer is outstanding in melt-flow stability, and has greatly improved processability and excellent heat resistance. Consequently, the polyimide or polyimide copolymer can be applied to structural materials, and electic.cndot.electronic appliances.

摘要翻译： 本发明涉及耐热性优异且加工性极佳的新型聚酰亚胺或聚酰亚胺共聚物，具有用于聚酰亚胺的新型芳族二氨基化合物及其制备方法，包含聚酰亚胺或聚酰亚胺共聚物的聚酰亚胺系树脂组合物和 纤维增强材料，树脂组合物的制备方法，树脂组合物的注塑制品。 聚酰亚胺包括具有一个或多个下式的重复结构单元的必需结构单元：其中L是氧原子，羰基，异亚丙基或六氟异亚丙基，X是（5）和Ar 是具有6至27个碳原子的四价基团，并且选自具有芳族基团的单芳族基团，缩合多芳族基团和具有直接键合或桥连构件彼此连接的非缩合多芳族基团。 聚酰亚胺或聚酰亚胺共聚物在熔体流动稳定性方面是突出的，并且具有极大的改进的加工性和优异的耐热性。 因此，聚酰亚胺或聚酰亚胺共聚物可以应用于结构材料和电子电器。

公开(公告)号：US5484880A

公开(公告)日：1996-01-16

申请号：US354806

申请日：1994-12-13

申请人： Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Mitsunori Matsuo ,  Tsutomu Ishida ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

发明人： Wataru Yamashita ,  Yuichi Okawa ,  Shoji Tamai ,  Mitsunori Matsuo ,  Tsutomu Ishida ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

IPC分类号： C07C225/22 ,  C07B61/00 ,  C07C221/00 ,  C08G73/10 ,  C08L79/08 ,  C08G77/10 ,  C08G69/26

CPC分类号： C08G73/1071 ,  C08G73/1014 ,  C08G73/105 ,  C08G73/1064 ,  C08L79/08

摘要： The present invention relates to an amorphous polyimide or a polyimide copolymer having a requisite structural unit consisting of one or more recurring structural units represented by the formula (1): ##STR1## wherein X is a direct bond, oxygen atom or sulfur atom, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are individually a hydrogen atom or methyl, and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member.Polyimide and the polyimide copolymer of the invention has excellent heat resistance, is outstanding in melt-flow stability, has greatly improved processability, and can be applied to structural materials, and electric- electronic appliances.

摘要翻译： 本发明涉及具有必要结构单元的无定形聚酰亚胺或聚酰亚胺共聚物，所述结构单元由一个或多个由式（1）表示的重复结构单元：原子或硫原子组成，并且R 1，R 2，R 3和R 4分别为 氢原子或甲基，Ar是具有6至27个碳原子的四价基团，并且选自具有芳族基团的单芳族基团，缩合多芳族基团和具有直接键或桥键的彼此连接的非缩合多芳族基团 会员。 本发明的聚酰亚胺和聚酰亚胺共聚物具有优异的耐热性，熔体流动稳定性优异，加工性能大大提高，可应用于结构材料和电子电器。