摘要:
A light-emitting semiconductor device (10) consecutively includes a sapphire substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN n+-layer (3) of high carrier (n-type) concentration, a Si-doped (Alx3Ga1-x3)y3In1-y3N n+-layer (4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped (Alx2Ga1-x2)y2In1-y2N emission layer (5), and a Mg-doped (Alx1Ga1-x1)y1In1-y1N p-layer (6). The AlN layer (2) has a 500 Å thickness. The GaN n+-layer (3) has about a 2.0 μm thickness and a 2×1018/cm3 electron concentration. The n+-layer (4) has about a 2.0 μm thickness and a 2×1018/cm3 electron concentration. The emission layer (5) has about a 0.5 μm thickness. The p-layer 6 has about a 1.0 μm thickness and a 2×1017/cm3 hole concentration. Nickel electrodes (7, 8) are connected to the p-layer (6) and n+-layer (4), respectively. A groove (9) electrically insulates the electrodes (7, 8). The composition ratio of Al, Ga, and In in each of the layers (4, 5, 6) is selected to meet the lattice constant of GaN in the n+-layer (3). The LED (10) is designed to improve luminous intensity and to obtain purer blue color.
摘要:
In a photomultiplier, focusing pieces of a focusing electrode are formed with sufficient height that the photocathode in the adjacent channels cannot be viewed from the first and second stage dynodes of each channel in order to prevent light reflected from the first and second stage dynodes from returning to the adjacent channels. This construction prevents the photocathode from emitting undesired electrons, thereby suppressing crosstalk. Further, by arranging condensing lenses on the outer surface of a light-receiving faceplate in correspondence with each channel, light is reliably condensed in each channel. Further, an oxide film formed over the surface of the focusing pieces prevents the reflection of light off the focusing pieces.
摘要:
A light-emitting semiconductor device (10) consecutively includes a sapphire substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN n+-layer (3) of high carrier (n-type) concentration, a Si-doped (Alx3Ga1-x3)y3In1-y3N n+-layer (4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped (Alx2Ga1-x2)y2In1-y2N emission layer (5), and a Mg-doped (Alx1Ga1-x1)y1In1-y1N p-layer (6). The AlN layer (2) has a 500 Å thickness. The GaN n+-layer (3) has about a 2.0 μm thickness and a 2×1018/cm3 electron concentration. The n+-layer (4) has about a 2.0 μm thickness and a 2×1018/cm3 electron concentration. The emission layer (5) has about a 0.5 μm thickness. The p-layer 6 has about a 1.0 μm thickness and a 2×1017/cm3 hole concentration. Nickel electrodes (7, 8) are connected to the p-layer (6) and n+-layer (4), respectively. A groove (9) electrically insulates the electrodes (7, 8). The composition ratio of Al, Ga, and In in each of the layers (4, 5, 6) is selected to meet the lattice constant of GaN in the n+-layer (3). The LED (10) is designed to improve luminous intensity and to obtain purer blue color.
摘要翻译:发光半导体器件(10)连续地包括蓝宝石衬底(1),AlN缓冲层(2),高载体的硅(Si)掺杂GaN n + +层(3) (n型)浓度,Si掺杂(Al x3 Ga 1-x 3)y 3在1-y 3中, 具有高载流子(n型)浓度的氮(Zn)和Si掺杂(Al 2 x 2 Ga 2) 1-x2 sub> Y2在1-y2 N发射层(5)中,以及Mg掺杂(Al x1 Ga) 在1-y1 N p层(6)中。 AlN层(2)的厚度为500埃。 GaN n + +层(3)具有约2.0μm厚度和2×10 18 / cm 3电子浓度。 n + +层(4)具有约2.0μm厚度和2×10 18 / cm 3电子浓度。 发射层(5)的厚度约为0.5μm。 p层6具有约1.0μm厚度和2×10 17 / cm 3孔浓度。 镍电极(7,8)分别连接到p层(6)和n + +层(4)。 一个凹槽(9)使电极(7,8)电绝缘。 选择各层(4,5,6)中的Al,Ga和In的组成比以满足n +层(3)中的GaN的晶格常数。 LED(10)被设计为提高发光强度并获得更纯的蓝色。
摘要:
A light-emitting semiconductor device (10) consecutively includes a sapphire substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN n+-layer (3) of high carrier (n-type) concentration, a Si-doped (Alx3Ga1-x3)y3In1-y3N n+-layer (4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped (Alx2Ga1-x2)y2In1-y2N emission layer (5), and a Mg-doped (Alx1Ga1-x1)y1In1-y1N p-layer (6). The AlN layer (2) has a 500 Å thickness. The GaN n+-layer (3) has about a 2.0 μm thickness and a 2×1018/cm3 electron concentration. The n+-layer (4) has about a 2.0 μm thickness and a 2×1018/cm3 electron concentration. The emission layer (5) has about a 0.5 μm thickness. The p-layer 6 has about a 1.0 μm thickness and a 2×1017/cm3 hole concentration. Nickel electrodes (7, 8) are connected to the p-layer (6) and n+-layer (4), respectively. A groove (9) electrically insulates the electrodes (7, 8). The composition ratio of Al, Ga, and In in each of the layers (4, 5, 6) is selected to meet the lattice constant of GaN in the n+-layer (3). The LED (10) is designed to improve luminous intensity and to obtain purer blue color.
摘要翻译:发光半导体器件(10)连续地包括蓝宝石衬底(1),AlN缓冲层(2),高载体的硅(Si)掺杂GaN n + +层(3) (n型)浓度,Si掺杂(Al x3 Ga 1-x 3)y 3在1-y 3中, 具有高载流子(n型)浓度的氮(Zn)和Si掺杂(Al 2 x 2 Ga 2) 1-x2 sub> Y2在1-y2 N发射层(5)中,以及Mg掺杂(Al x1 Ga) 在1-y1 N p层(6)中。 AlN层(2)的厚度为500埃。 GaN n + +(3)具有约2.0μm厚度和2×10 18 / cm 3电子浓度。 n + +层(4)具有约2.0μm厚度和2×10 18 / cm 3电子浓度。 发射层(5)的厚度约为0.5μm。 p层6具有约1.0μm厚度和2×10 17 / cm 3孔浓度。 镍电极(7,8)分别连接到p层(6)和n + +层(4)。 一个凹槽(9)使电极(7,8)电绝缘。 选择各层(4,5,6)中的Al,Ga和In的组成比以满足n +层(3)中的GaN的晶格常数。 LED(10)被设计为提高发光强度并获得更纯的蓝色。
摘要:
Disclosed herein are (1) a light-emitting semiconductor device that uses a gallium nitride compound semiconductor (AlxGa1−xN) in which the n-layer of n-type gallium nitride compound semiconductor (AlxGa1−xN) is of double-layer structure including an n-layer of low carrier concentration and an n+-layer of high carrier concentration, the former being adjacent to the i-layer of insulating gallium nitride compound semiconductor (AlxGa1−xN); (2) a light-emitting semiconductor device of similar structure as above in which the i-layer is of double-layer structure including an iL-layer of low impurity concentration containing p-type impurities in comparatively low concentration and an iH-layer of high impurity concentration containing p-type impurities in comparatively high concentration, the former being adjacent to the n-layer; (3) a light-emitting semiconductor device having both of the above-mentioned features and (4) a method of producing a layer of an n-type gallium nitride compound semiconductor (AlxGa1−xN) having a controlled conductivity from an organometallic compound by vapor phase epitaxy, by feeding a silicon-containing gas and other raw material gases together at a controlled mixing ratio.
摘要翻译:这里公开的是(1)使用其中n型氮化镓化合物半导体(Al x Ga 1-x N)的n层是双层结构的氮化镓化合物半导体(Al x Ga 1-x N)的发光半导体器件,包括 低载流子浓度的n层和高载流子浓度的n +层,前者与绝缘氮化镓化合物半导体(Al x Ga 1-x N)的i层相邻; (2)具有上述类似结构的发光半导体器件,其中i层是双层结构,其包括含有较低浓度的p型杂质的低杂质浓度的iL层和iH层 含有较高浓度的p型杂质的高杂质浓度,前者与n层相邻; (3)具有上述特征的发光半导体器件和(4)由有机金属化合物具有受控导电性的n型氮化镓系化合物半导体(Al x Ga 1-x N)的层的制造方法, 通过以受控的混合比将含硅气体和其它原料气体一起供给到气相外延。
摘要:
Disclosed herein are (1) a light-emitting semiconductor device that uses a gallium nitride compound semiconductor (AlXGa1-xN) in which the n-layer of n-type gallium nitride compound semiconductor (AlxGa1-XN) is of double-layer structure including an n-layer of low carrier concentration and an n+-layer of high carrier concentration, the former being adjacent to the i-layer of insulating gallium nitride compound semiconductor (AlxGa1-xN); (2) a light-emitting semiconductor device of similar structure as above in which the i-layer is of double-layer structure including an iL-layer of low impurity concentration containing p-type impurities in comparatively low concentration and an iH-layer of high impurity concentration containing p-type impurities in comparatively high concentration, the former being adjacent to the n-layer; (3) a light-emitting semiconductor device having both of the above-mentioned features and (4) a method of producing a layer of an n-type gallium nitride compound semiconductor (AlxGa1-xN) having a controlled conductivity from an organometallic compound by vapor phase epitaxy, by feeding a silicon-containing gas and other raw material gases together at a controlled mixing ratio.
摘要翻译:本文公开了(1)一种使用其中n型氮化镓化合物半导体(Al x Ga 1-X N)的n层是双层结构的氮化镓化合物半导体(Al x Ga 1-x N)的发光半导体器件,包括 低载流子浓度的n层和高载流子浓度的n +层,前者与绝缘的氮化镓化合物半导体(Al x Ga 1-x N)的i层相邻; (2)具有上述类似结构的发光半导体器件,其中i层是双层结构,其包括含有较低浓度的p型杂质的低杂质浓度的iL层和iH层 含有较高浓度的p型杂质的高杂质浓度,前者与n层相邻; (3)具有上述特征的发光半导体器件和(4)由有机金属化合物具有受控导电性的n型氮化镓系化合物半导体(Al x Ga 1-x N)的层的制造方法, 通过以受控的混合比将含硅气体和其它原料气体一起供给到气相外延。
摘要:
Disclosed herein are (1) a light-emitting semiconductor device that uses a gallium nitride compound semiconductor (AlxGa1−xN) in which the n-layer of n-type gallium nitride compound semiconductor (AlxGa1−xN) is of double-layer structure including an n-layer of low carrier concentration and an n+-layer of high carrier concentration, the former being adjacent to the i-layer of insulating gallium nitride compound semiconductor (AlxGa1−xN); (2) a light-emitting semiconductor device of similar structure as above in which the i-layer is of double-layer structure including an iL-layer of low impurity concentration containing p-type impurities in comparatively low concentration and an iH-layer of high impurity concentration containing p-type impurities in comparatively high concentration, the former being adjacent to the n-layer; (3) a light-emitting semiconductor device having both of the above-mentioned features and (4) a method of producing a layer of an n-type gallium nitride compound semiconductor (AlxGa1−xN) having a controlled conductivity from an organometallic compound by vapor phase epitaxy, by feeding a silicon-containing gas and other raw material gases together at a controlled mixing ratio.
摘要翻译:这里公开的是(1)使用其中n型氮化镓化合物半导体(Al x Ga 1-x N)的n层是双层结构的氮化镓化合物半导体(Al x Ga 1-x N)的发光半导体器件,包括 低载流子浓度的n层和高载流子浓度的n +层,前者与绝缘的氮化镓化合物半导体(Al x Ga 1-x N)的i层相邻; (2)具有上述类似结构的发光半导体器件,其中i层是双层结构,其包括含有较低浓度的p型杂质的低杂质浓度的iL层和iH层 含有较高浓度的p型杂质的高杂质浓度,前者与n层相邻; (3)具有上述特征的发光半导体器件和(4)由有机金属化合物具有受控导电性的n型氮化镓系化合物半导体(Al x Ga 1-x N)的层的制造方法, 通过以受控的混合比将含硅气体和其它原料气体一起供给到气相外延。
摘要:
A semiconductor device having an n-type layer of gallium nitride that is doped with silicon and has a resistively ranging from 3×10−1 &OHgr;cm to 8×10−3 &OHgr;cm or a carrier concentration ranging from 6×1016/cm3 to 3×1018/cm3.
摘要翻译:一种半导体器件,其具有掺杂硅的n型氮化镓层,其电阻范围为3×10 -1Ω〜8×10 -3Ω/ cm或载流子浓度为6×10 16 / cm 3〜3×10 18 / cm 3。
摘要:
Disclosed is a light-emitting semiconductor device which comprises an N-layer of N-type nitrogen-Group III compound semiconductor satisfying the formula Al.sub.x Ga.sub.y In.sub.1-x-y N, inclusive of x=0, y=0 and x=y=0, a P-layer of P-type nitrogen-Group III compound semiconductor satisfying the formula Al.sub.x Ga.sub.y In.sub.1-x-y N, inclusive of x=0, y=0 and x=y=0 and a Zn doped semi-insulating I-layer of nitrogen-Group III compound semiconductor satisfying the formula Al.sub.x Ga.sub.y In.sub.1-x-y N, inclusive of x=0, y=0 and x=y=0. The semi-insulating I-layer has a 20 to 3000 .ANG. thickness and can emit light in the range of 485 to 490 nm. By employing the I-layer, the light-emitting diode as a whole can emit light in the range of 450 to 480 nm.
摘要翻译:公开了一种发光半导体器件,其包括满足式Al x Ga y In 1-x-y N的N型N型氮 - III族化合物半导体的N层,包括x = 0,y = 0和x = y = 0,a 满足公式Al x Ga y In 1-x-y N的P型氮 - III族化合物半导体的P层,包括x = 0,y = 0和x = y = 0,以及Zn掺杂的半绝缘I层, 满足公式Al x Ga y In 1-x-y N的III族化合物半导体,包括x = 0,y = 0和x = y = 0。 半绝缘I层的厚度为20至3000,可以发射485至490nm的光。 通过采用I层,发光二极管整体可发射450〜480nm的光。
摘要:
A light-emitting semiconductor device using a gallium nitride compound semiconductor (Al.sub.x Ga.sub.1-x N) having an i.sub.L -layer of insulating gallium nitride compound semiconductor (Al.sub.x Ga.sub.1-x N, inclusive of x=0) containing a low concentration of p-type impurities. An i.sub.H -layer of insulating gallium nitride compound semiconductor (Al.sub.x Ga.sub.1-x N, inclusive of x=0) containing a high concentration of p-type impurities is adjacent to the i.sub.L -layer. An n-layer of n-type gallium nitride compound semiconductor (Al.sub.x Ga.sub.1-x N, inclusive of x=0) of low carrier concentration is adjacent to the i.sub.L -layer. An n.sup.+ -layer of n-type gallium nitride compound semiconductor (Al.sub.x Ga.sub.1-x N, inclusive of x=0) of high carrier concentration doped with n-type impurities is adjacent to the n-layer.
摘要翻译:使用具有含有低浓度p型杂质的绝缘氮化镓化合物半导体(Al x Ga 1-x N,包括x = 0)的iL层的氮化镓系化合物半导体(Al x Ga 1-x N)的发光半导体装置。 含有高浓度p型杂质的绝缘氮化镓化合物半导体(Al x Ga 1-x N,包括x = 0)的iH层与iL层相邻。 低载流子浓度的n型氮化镓化合物半导体(Al x Ga 1-x N,包括x = 0)的n层与iL层相邻。 n型氮化镓化合物半导体(Al x Ga 1-x N,包括x = 0)的n +层与n型杂质掺杂的高载流子浓度相邻。