公开(公告)号：US10998879B2

公开(公告)日：2021-05-04

申请号：US16550673

申请日：2019-08-26

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H03H9/08 ,  H03H9/05 ,  H03H9/54 ,  H03H9/70 ,  H03H3/02 ,  H01L23/367 ,  H01L23/498 ,  H01L23/552 ,  H01L23/00 ,  H01L25/16 ,  H01L27/20 ,  H01L23/66

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM). The RF FEM may include an integrated die with an active portion and an acoustic wave resonator (AWR) portion adjacent to the active portion. The RF FEM may further include a lid coupled with the die. The lid may at least partially overlap the AWR portion at a surface of the die. Other embodiments may be described or claimed.

公开(公告)号：US10992017B2

公开(公告)日：2021-04-27

申请号：US16192293

申请日：2018-11-15

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Gilbert W. Dewey ,  Hyung-Jin Lee

IPC: H01P5/08 ,  H01P3/16 ,  H01P1/208 ,  H01L23/66 ,  H01L25/065 ,  H01P5/107 ,  H01L23/00

Abstract: Embodiments may relate to a dielectric waveguide that includes a substrate and a waveguide material disposed within the substrate. The dielectric waveguide may further include a waveguide launcher electromagnetically and physically coupled with the waveguide material, wherein the waveguide launcher is exposed at a side of the dielectric substrate. Other embodiments may be described or claimed.

公开(公告)号：US10992016B2

公开(公告)日：2021-04-27

申请号：US16466629

申请日：2017-01-05

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Sasha Oster ,  Georgios Dogiamis ,  Johanna Swan

IPC: H01P5/08 ,  H01P1/207 ,  H01P3/12

Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 μm and 1,000 μm.

公开(公告)号：US20210091443A1

公开(公告)日：2021-03-25

申请号：US16577478

申请日：2019-09-20

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Feras Eid ,  Johanna M. Swan

IPC: H01P1/203 ,  H01P1/20 ,  H01P7/10 ,  H01P11/00 ,  H01P7/06

Abstract: Embodiments may relate to an assembly that includes a first package substrate with a first electromagnetic cavity. The assembly may further include a second package substrate with a second electromagnetic cavity that is adjacent to the first electromagnetic cavity. The first and second electromagnetic cavities may form a millimeter wave (mmWave) resonant cavity of a mmWave filter. Other embodiments may be described or claimed.

公开(公告)号：US10951248B1

公开(公告)日：2021-03-16

申请号：US16725494

申请日：2019-12-23

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Feras Eid ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H04B1/00 ,  H04B1/04 ,  H03H7/38

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM) with a first filter and a second filter. The RF FEM may include a termination inductor coupled to ground, and a switch that is to selectively couple the first filter and the second filter to the termination inductor. Other embodiments may be described or claimed.

公开(公告)号：US20210043573A1

公开(公告)日：2021-02-11

申请号：US16533215

申请日：2019-08-06

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H01L23/538 ,  H01L23/498 ,  H01L27/20 ,  H01L25/18 ,  H01L23/00 ,  H01L41/053 ,  H03H9/205 ,  H01L23/14 ,  H01L23/66 ,  H01L23/31 ,  H01L23/38 ,  H01L35/32 ,  H01L23/427 ,  H03H9/05 ,  H03H9/02

Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

公开(公告)号：US20200303327A1

公开(公告)日：2020-09-24

申请号：US16394514

申请日：2019-04-25

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Georgios Dogiamis ,  Johanna M. Swan ,  Aleksandar Aleksov ,  Telesphor Kamgaing ,  Henning Braunisch

IPC: H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L25/00

Abstract: Embodiments may relate to a microelectronic package that includes a substrate signal path and a waveguide. The package may further include dies that are communicatively coupled with one another by the substrate signal path and the waveguide. The substrate signal path may carry a signal with a frequency that is different than the frequency of a signal that is to be carried by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US20200296823A1

公开(公告)日：2020-09-17

申请号：US16399024

申请日：2019-04-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Johanna M. Swan ,  Georgios Dogiamis ,  Henning Braunisch ,  Adel A. Elsherbini ,  Aleksandar Aleksov

IPC: H05K1/02 ,  H01L23/66 ,  H01P5/08

Abstract: Embodiments may relate to an electronic module for use in an electronic device. The electronic module may include a printed circuit board (PCB) with a first die and a second die. A waveguide channel may be communicatively coupled with the first die and the second die and configured to convey an electromagnetic signal from the first die to the second die. In embodiments, the electromagnetic signal may have a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：US20200280121A1

公开(公告)日：2020-09-03

申请号：US16369452

申请日：2019-03-29

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Telesphor Kamgaing ,  Gilbert W. Dewey ,  Hyung-Jin Lee

IPC: H01Q1/22 ,  H01L23/00 ,  H01L23/66 ,  H01L25/065 ,  H01L23/552 ,  H01L25/00

Abstract: Embodiments may relate to an semiconductor package. The semiconductor package may include a die coupled with the face of the package substrate. The semiconductor package may further include a waveguide coupled with the face of the package substrate adjacent to the die, wherein the waveguide is to receive an electromagnetic signal from the die and facilitate conveyance of the electromagnetic signal in a direction parallel to the face of the package substrate. Other embodiments may be described or claimed.

公开(公告)号：US20200091128A1

公开(公告)日：2020-03-19

申请号：US16161578

申请日：2018-10-16

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Georgios Dogiamis ,  Shawna M. Liff ,  Zhiguo Qian ,  Johanna M. Swan

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/532 ,  H01L23/66 ,  H01L23/538

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a first die having a first surface and an opposing second surface, wherein the first die is embedded in a first dielectric layer, wherein the first surface of the first die is coupled to the second surface of the package substrate, and wherein the first dielectric layer is between a second dielectric layer and the second surface of the package substrate; a second die having a first surface and an opposing second surface, wherein the second die is embedded in the second dielectric layer, and wherein the first surface of the second die is coupled to the second surface of the package substrate by a conductive pillar; and a shield structure that at least partially surrounds the conductive pillar.