Abstract:
This disclosure proposes an assembly structure for building probe cards to test square integrated circuit chips. The test probe card assembly structure has one or more wings located at 90° angles to each other upon which probes are laid in a parallel manner for attachment to a probe card. This allows 10 construction of the probe card so that probes touch contacts directly. The probe tips do not touch the contacts at an angle &thgr;, called the fan out angle. The probes also do not differ in their inclination angles &bgr;. As a result, the force at which the many probe tips touch the contacts is relatively constant throughout. In addition, the probe tips are less likely to scrub past the surface of the contact onto the insulation surface of the chip and in doing so damage it. The test probe card assembly structure also contains an epoxy groove, which controls epoxy flow so that the position of the probes stays aligned in the correct plane. The epoxy groove also prevents variance in beam length. An alternative embodiment of the present invention can make probe cards for simultaneously testing multiple chips and includes a probe card for testing multiple chips.
Abstract:
A probe card for testing integrated circuits which maintains rigidity and probe alignment at elevated temperatures. The probe card has a number of probes radially oriented on an insulating plate with a nonuniform radial distribution. The probes extend through an insulating ring. The nonuniform radial distribution of probes has gaps which allows for bolt or attachment to attach a rigid plate to the insulating ring. The insulating plate can be made of printed circuit board material, the insulating ring can be made of epoxy. The rigid plate can be made of stainless steel or any other material that maintains rigidity at elevated temperatures. Preferably, the insulating plate also has a stiffener ring located opposite the insulating ring on the top side. The bolts extend through the stiffener ring. The insulating plate has vias which allow the probes to be electrically connected to test electronics located above a top side of the insulating plate. The rigid plate maintains the rigidity of the apparatus and provides heat shielding for the insulating ring and insulating plate. Alternatively, the rigid plate is located above the insulating plate and bolted to the stiffener ring.
Abstract:
This invention presents a method and a mechanism for contacting a set of vertical probes of a circuit testing mechanism with a set of pads or bumps of a circuit under test. The vertical probes have a circular cross section, a tip portion of length L1 and a beam portion of length L2, such that the beam portion extends at a right angle to the tip portion. The tip portion is guided through a guide hole to the pads of the circuit under test and the beam portion secured by its end. In this geometry the contact force between the probe and the pad is described by the relation: ##EQU1## where D.sub.v is a vertical deflection of the probe, I is an area moment of inertia of the probe about its axis, and E is a Young's modulus of the probe. The tip length L1 and beam length L2 are selected for each of the vertical probes in such a way the contact force F in this relation is kept constant thus ensuring that the contact force F between the vertical probes and pads remains substantially equal.
Abstract:
The present invention is a probe having a distal end made of one material, a tip and a portion disposed between the distal end and the tip that is a different second material. The probe is laser machined manufactured using a nanosecond or picosecond laser.
Abstract:
Probes suitable for use with densely packed fine-pitch 2-D contact arrays are provided by use of an electrically insulating guide plate in connection with vertical probes, where the vertical probes have probe flexures that are either vertically folded sections, or coils having a horizontal axis. Preferably, the probes are configured such that the probe flexures are inside the guide plate holes, and the parts of the probes extending past the guide plate are relatively rigid. This configuration alleviates problems associate with probe shorting, because the probe flexures are enclosed by the guide plate holes, and are therefore unable to come into contact with flexures from other probes during probing.
Abstract:
A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a square front, a round back and a flat middle section. The conductive pad is of generally convex shape having a granular non-conductive surface of debris and moves to engage the skate, whereby an overdrive motion is applied to the pad causing the skate to move across and scrub non-conductive debris from the pad displacing the debris along the skate and around the skate round back end to a position on the skate that is away from the pad.
Abstract:
An improved knee probe for probing electrical devices and circuits is provided. The improved knee probe has a reduced thickness section to alter the mechanical behavior of the probe when contact is made. The reduced thickness section of the probe makes it easier to deflect the probe vertically when contact is made. This increased ease of vertical deflection tends to reduce the horizontal contact force component responsible for the scrub motion, thereby decreasing scrub length. Here “thickness” is the probe thickness in the deflection plane of the probe (i.e., the plane in which the probe knee lies). The reduced thickness probe section provides increased design flexibility for controlling scrub motion, especially in combination with other probe parameters affecting the scrub motion.
Abstract:
The present invention is a probe array for testing an electrical device under test comprising one or more ground/power probes and one or more signal probes and optionally a gas flow apparatus.
Abstract:
Method and apparatus using a retention arrangement for probes used for electrical testing of a device under test (DUT). The apparatus has a number of probes each of which has a connect end for applying a test signal, a retaining portion, at least one arm portion and a contact tip for making an electrical contact with the DUT. A retention arrangement has a tip holder for holding each of the probes by its contacting tip and a plate with openings for holding each of the probes below the retaining portion. The retaining portion of each of the probes is potted in a potting region defined above the plate with the aid of a potting agent. The apparatus can be used with space transformers, a variety of probes of different geometries and scrub motion characteristics and is well-suited for use in probe card apparatus under tight pitch and small tolerance requirements.