摘要:
Polymer compositions having thermoplastic and elastomeric features are provided. These polymer compositions, which are also characterized by superior compatibility with water-based and solvent-based adhesives, comprise at least one thermoplastic elastomer and at least one maleated ethylene copolymer. The compositions of the invention are useful in articles of manufacture that require flexibility and are fabricated with adhesives, including sporting goods, and particularly athletic shoes.
摘要:
A composition and an article therewith are disclosed wherein the composition comprises or is a blend that comprises, consists essentially of, consists of, or is produced from, about 1 to about 40, or about 5 to about 35, about 10 to about 30, or about 10 to about 20 or 25% of a polyamide and about 60 to about 99, about 65 to about 95, about 70 to about 90, or about 75 or 80 to about 90% of an ionomer, all based on the weight of the blend.
摘要:
This invention relates to crosslinked polymer foam compositions of an ethylene vinyl acetate copolymer, an acid copolymer or ionomer, and a crosslinking agent. Such compositions exhibit enhanced melt strength, as well as lower density and compression set. They are especially useful as midsoles or insoles for footwear.
摘要:
New Ionomer compositions which have improved moldability and improved high temperature behavior are based on ionomer polymerized at normal pressures but lower than normal temperatures. The compositions may be blends with standard ionomer, particularly if the low-temperature-prepared ionomer is prepared at very low temperatures which reduces productivity compared with standard ionomer, or useful alone when prepared at intermediate temperatures.
摘要:
A blend of 5 to 95 percent of an ethylene vinyl alcohol copolymer and 95 to 5 percent of an amorphous polyamide having fewer than about 0.100 equivalents of carboxyl end groups per kilogram of polyamide exhibits improved oxidative and thermal stability. The blend is useful for preparing films and multiple layered structures including thermoformed structures and oriented shrink films.