Optical refractive index-modifying polymer composition, hologram recording material and method of controlling refractive index
    41.
    发明申请
    Optical refractive index-modifying polymer composition, hologram recording material and method of controlling refractive index 失效
    光学折射率改性聚合物组合物,全息记录材料和折射率控制方法

    公开(公告)号:US20070128523A1

    公开(公告)日:2007-06-07

    申请号:US10587842

    申请日:2006-01-06

    IPC分类号: G03H1/04

    摘要: The present invention provides an optical refractive index-modifying polymer composition which can efficiently modulate (change) refractive index upon light irradiation, and exhibits such high storage stability that the once modulated refractive index does not substantially change anymore upon time elapse, and the optical refractive index-modifying polymer composition comprises as a main component a polymer (A) which is a polymer of monomers including an acrylic vinyl monomer represented by the following formula (1): CH2═C(R1)—C(═O)O—R2═CH2   (1) wherein R1 represents a hydrogen atom or a methyl group, R2 represents a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms, and the molecule may contain a hetero atom or a halogen atom, as an essential component and contains a remaining radical-polymerizable side-chain vinyl group in the molecule, wherein the composition comprises a thermally curable polymer (B) in an amount of 5 to 60 parts by weight per 100 parts by weight of the polymer (A).

    摘要翻译: 本发明提供一种光折射率改性聚合物组合物,其能够在光照射时有效地调节(变化)折射率,并且表现出如此高的储存稳定性,使得一次调制的折射率在时间经过后基本上不再改变,并且光学折射率 指数改性聚合物组合物包含作为主要成分的聚合物(A),其是包含由下式(1)表示的丙烯酸类乙烯基单体的单体的聚合物:<?在线式描述=“在线配方” 末端=“铅”→CH 2 -C(R 1)C(-O)OR 2 -CH 2 (1)<?in-line-formula description =“In-line formula”end =“tail”?>其中R 1表示氢原子或甲基, SUP> 2表示具有1至20个碳原子的饱和或不饱和烃基,并且该分子可以含有杂原子或卤素原子作为必需成分,并且含有残基 该分子中可自由基聚合的侧链乙烯基,其中该组合物包含每100重量份聚合物(A)5至60重量份的热固性聚合物(B)。

    Resist removing method, and curable pressure-sensitive adhesive,
adhesive sheets and apparatus used for the method
    42.
    发明授权
    Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method 失效
    抗蚀剂除去方法和可固化的压敏粘合剂,用于该方法的粘合片和设备

    公开(公告)号:US5466325A

    公开(公告)日:1995-11-14

    申请号:US288988

    申请日:1994-08-11

    摘要: A method for removing a resist pattern formed on a semiconductor wafer, and a curable pressure-sensitive adhesive, adhesive sheets and an apparatus used for the method. The resist-removing method comprising adhering an adhesive tape on an upper surface of a resist pattern formed on an article and peeling off the resist pattern together with the adhesive tape; the curable pressure-sensitive adhesive constituting the adhesive tape, comprising a pressure-sensitive adhesive polymer containing a non-volatile compound having at least one unsaturated double bond in the molecule and having a good affinity with a resist material to be removed; the adhesive sheet comprising a film substrate having formed thereon the curable pressure-sensitive adhesive; and the resist-removing apparatus comprising a means for press-adhering the adhesive tape, a tape-peeling means, and a substrate-washing means.

    摘要翻译: 一种用于去除形成在半导体晶片上的抗蚀剂图案的方法,以及用于该方法的可固化压敏粘合剂,粘合片和设备。 抗蚀剂去除方法包括将粘合带粘附在形成在制品上的抗蚀剂图案的上表面上并与粘合带一起剥离抗蚀剂图案; 构成粘合带的可固化压敏粘合剂包括在分子中含有至少一个不饱和双键的非挥发性化合物并且与要去除的抗蚀剂材料具有良好亲和性的压敏粘合剂聚合物; 所述粘合片包括其上形成有所述可固化压敏粘合剂的膜基材; 并且抗蚀剂去除装置包括用于压粘粘合带的装置,带剥离装置和基板清洗装置。

    Heat-resistant vibration-damping pressure-sensitive adhesive
composition, process for producing the same and vibration-damping
adhesive tape or sheet using the composition
    43.
    发明授权
    Heat-resistant vibration-damping pressure-sensitive adhesive composition, process for producing the same and vibration-damping adhesive tape or sheet using the composition 失效
    耐热振动阻尼压敏粘合剂组合物,其制造方法和使用该组合物的减震胶带或片材

    公开(公告)号:US5279896A

    公开(公告)日:1994-01-18

    申请号:US973697

    申请日:1992-11-09

    摘要: A vibration-damping pressure-sensitive adhesive composition containing a crosslinked structure of a copolymer comprising (A) from 75 to 92% by weight of a main monomer comprising an alkyl (meth)acrylate containing from 8 to 12 carbon atoms in the alkyl moiety thereof and (B) from 8 to 25% by weight of a carboxyl-containing monomer whose homopolymer has a glass transition temperature of 50.degree. C. or more, said crosslinked structure having a solvent-insoluble content of 80% by weight or more and a weight loss of 3% by weight or less on heating at 120.degree. C. for 240 hours, and said composition having a T-peel strength of 400 g/20 mm-width or more from a SUS plate and a loss factor of 0.05 or more at 60.degree. C. in the vicinity of 1 kHz as determined by a half-value width method. The composition exhibits satisfactory heat resistance against long-term use in high temperatures as well as satisfactory adhesion to various parts at room temperature.

    摘要翻译: 一种包含共聚物交联结构的减振压敏粘合剂组合物,其包含(A)75-92重量%的包含其烷基部分中含有8至12个碳原子的(甲基)丙烯酸烷基酯的主单体 和(B)8〜25重量%的均聚物的玻璃化转变温度为50℃以上的含羧基单体,所述交联结构的溶剂不溶成分为80重量%以上, 在120℃下加热240小时时重量减轻3重量%以下,所述组合物从SUS板的T剥离强度为400g / 20mm以上,损耗系数为0.05或 在半值宽度法确定的1kHz附近的60摄氏度以上。 该组合物在高温下表现出令人满意的长期使用耐热性以及在室温下对各种部件的令人满意的粘合性。