摘要:
An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoints detection without lowering the polishing performance as well as methods for polishing of a semiconductor wafer using them. The polishing pad of the present invention comprises a substrate 11 for a polishing pad provided with a through hole penetrating from surface to back, a light transmitting part 12 fitted in the through hole, the light transmitting part comprises a water-insoluble matrix material (1,2-polybutadiene) and a water-soluble particle (β-cyclodextrin) dispersed in the water-insoluble matrix material, and the water-soluble particle is less than 5% by volume based on 100% by volume of the total amount of the water-insoluble matrix material and the water-soluble particle. In addition, the laminated body for polishing of the present invention comprises a supporting layer on a backside of the polishing pad. These polishing pad and laminated body for polishing can comprise a fixing layer 13 on a backside.
摘要:
An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the abrasive are contained. A polishing part constituting the polishing body in the invention is produced obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, α-methylstyrenedimer, and t-dodecylmercaptan in an autoclave, making the mixture react for 16 hours at 75° C. to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3 μm and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained. The above-mentioned polishing part may have a crosslinked structure. The polishing body in the invention can be used favorably in a polishing pad and the like, for polishing the surface of a semiconductor wafer or the like.
摘要:
An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoint detection without lowering the polishing performance as well as methods for polishing of a semiconductor wafer using them. The polishing pad of the present invention comprises a substrate 11 for a polishing pad provided with a through hole penetrating from surface to back, a light transmitting part 12 fitted in the through hole, the light transmitting part comprises a water-insoluble matrix material (1,2-polybutadiene) and a water-soluble particle (β-cyclodextrin) dispersed in the water-insoluble matrix material, and the water-soluble particle is less than 5% by volume based on 100% by volume of the total amount of the water-insoluble matrix material and the water-soluble particle. In addition, the laminated body for polishing of the present invention comprises a supporting layer on a backside of the polishing pad. These polishing pad and laminated body for polishing can comprise a fixing layer 13 on a backside.
摘要:
A polishing pad comprising a recessed portion in the non-polishing surface. This polishing pad can prevent the surface to be polished of an object from being scratched.
摘要:
A polishing pad comprising a recessed portion in the non-polishing surface. This polishing pad can prevent the surface to be polished of an object from being scratched.
摘要:
A method of diagnosing nutritious condition of crop in a plant field is disclosed. The method comprises the steps of: locating a camera equipped with a plurality of image elements in a predetermined central depression angle with respect to the plant field; obtaining an amount of reflection light of a crop leaf for each image element by image-taking the field; obtaining an image-taken area for each unit image element by an area function constituted by a conversion variable including a ground clearance, an image element depression angle, the number of image elements and a field angle of the camera; making an area compensation of the amount of reflection light for each image element by the image-taken area; making a depression angle compensation of the amount of reflection light by a depression angle coefficient predetermined for compensating differences of amounts of reflection light correspondingly with image element depression angles; measuring an amount of light incident on the crop leaf; obtaining reflectance from the amount of the reflection light compensated and the measured amount of incident light; obtaining first crop information in a predetermined area based on the reflectance and a first crop related formula predetermined for obtaining crop information from reflectance, and storing the first crop information; and determining a nutritious condition of the crop in the plant field based on the first crop information. Instead of the grand clearance of the camera, a distance of field of view of the camera may well be used.
摘要:
From the crop of a predetermined area in a plant field under exposure to natural light, a reflectivity of the light having relation to crop information such as nitrogen content rate is measured by a camera; the crop information as first crop information is obtained from the first crop related formula established in advance for obtaining the crop information from the reflectivity; light is irradiated on crop leaf blades in the same area as the predetermined area and an amount of the light is measured; the crop information as second crop information is obtained from the second crop related formula established in advance for obtaining the crop information from the amount of the light; differences are calculated from the first crop information and the second crop information; the first crop information is obtained from the unknown crop in the predetermined area within the crop field of the same area; the first crop information is corrected based on the differences; and the nutritious diagnosis of the crop in the field is conducted by the corrected first crop information. In conducting diagnosis of crop by measuring the reflection light amount from the crop, since compensation or correction is performed, no great errors occur caused by differences in the measurement locations and the planting densities, and the diagnosis of the crop is simple and easy and, more over, the precision in the measuring is enhanced.
摘要:
A method for measuring ash content of food stuff is carried out by 1) preparing, with respect to food stuff samples whose ash content values are known, a calibration curve by a non-linear analysis of absorbance values and the known ash content of each sample, the absorbance values being obtained by irradiating light having particular wavelengths containing at least an ultraviolet ray band wavelength, the particular wavelength being specific to organic ingredients well coupled to inorganic ingredients which result in the ash content, and 2) deriving, with respect to a sample whose ash content value is unknown, an ash content value of the sample from absorbance values obtained by irradiating, on the sample, light having the particular wavelengths containing at least the ultraviolet ray band wavelength and from the calibration curve prepared in advance by the non-linear analysis. An apparatus for carrying out the method includes a light source section, a photo detecting section, a storing section for storing the calibration curve, and a calculation section for calculating, with respect to a sample whose ash content value is unknown, the ash content value based on the absorbance values and the calibration curve stored in the storing section. It is possible to speed up the measuring operation and to improve the measuring precision.
摘要:
A wheat flouring system comprises a polishing machine for polishing wheat grains, a humidifying machine for humidifying the grains, a conditioning machine for subjecting the grains to conditioning and a milling machine for milling the grains to produce a flour. The polishing machine, the humidifying machine, the conditioning machine and the milling machine are successively arranged from an upstream side to a downstream side as viewed in a direction of flow of the wheat grains. There is provided an agitating machine for agitating the grains humidified by the humidifying machine, thereby preventing the humidified grains from sticking together into lumps of the grains.
摘要:
In heating a material radiant at high temperatures, such as a steel product, in a heating furnace, the said material is charged into the heating furnace to heat. A discrimination mark is previously drawn on the surface of material to be discriminated on a portion readily watched from outside the furnace. A heat resisting paint sensitive to near ultraviolet rays is used to make the mark. The said material radiant-heated in the heating furnace is discriminated from outside the furnace as being radiant by applying near ultraviolet rays of a high pressure mercury lamp thereto from outside the furnace to provide a sharp contrast between the said material surface and the said discrimination mark for the discrimination of the said mark from outside the furnace.