Abstract:
Apparatuses and methods for refreshing memory cells of a semiconductor device are described. An example apparatus includes: a memory cell array including a plurality of memory groups each having a plurality of memory cells, the memory groups being selected by mutually different addresses; a first control circuit periodically executing a refresh operation on the memory groups in response to a first refresh command; and a second control circuit setting a cycle of executing the refresh operation by the first control circuit. The second control circuit sets the cycle to a first cycle until executing the refresh operation to all the memory groups after receiving the first refresh command, and the second control circuit sets the cycle to a second cycle that is longer than the first cycle after executing the refresh operation to all the memory groups.
Abstract:
A device includes a first data terminal, a second data terminal, a first switching buffer coupled between a data node and the first data terminal and a second switching buffer coupled between the data node and the second data terminal. The first switching buffer and the second switching buffer are arranged such that a distance between the first switching buffer and the second data terminal is shorter than a distance between the second switching buffer and the second data terminal and that a distance between the first switching buffer and the first data terminal is shorter than a distance between the second switching buffer and the first data terminal.
Abstract:
A device includes an output circuit, a DLL (Delay Locked Loop) circuit including a first delay line receiving a first clock signal and outputting, in response to receiving the clock signal, a second clock signal supplied to the output circuit, and an ODT (On Die Termination) circuit receiving an ODT activation signal and outputting, in response to receiving the ODT activation signal, an ODT output signal supplied to the output circuit to set the output circuit in a resistance termination state, and the ODT circuit including a second delay line configured to be set by the DLL circuit in an equivalent delay amount that is equivalent to a delay amount of the first delay line, the ODT output signal being, in a first time-period during which the ODT activation signal is in an active state, generated by being conveyed via the second delay line in which the equivalent delay amount has been set.
Abstract:
Disclosed herein is a semiconductor device that includes: a memory cell array including a plurality of memory groups each having a plurality of memory cells, the memory groups being selected by mutually different addresses; a first control circuit periodically executing a refresh operation on the memory groups in response to a first refresh command; and a second control circuit setting a cycle of executing the refresh operation by the first control circuit. The second control circuit sets the cycle to a first cycle until executing the refresh operation to all the memory groups after receiving the first refresh command, and the second control circuit sets the cycle to a second cycle that is longer than the first cycle after executing the refresh operation to all the memory groups.