中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

49 records (took 0.019 seconds)

    Sealed optoelectronic components and associated optical devices
    42.
    发明授权
    Sealed optoelectronic components and associated optical devices 有权

    公开(公告)号：US11735889B1

    公开(公告)日：2023-08-22

    申请号：US17672936

    申请日：2022-02-16

    Applicant: Mellanox Technologies, Ltd.

    Inventor： Anders Larsson ,  Dimitrios Kalavrouziotis ,  Attila Fulop ,  Filip Leonard Hjort ,  Elad Mentovich

    IPC: H04B10/50 ,  H01S5/183 ,  H01S5/022 ,  H04B10/40

    CPC classification number: H01S5/183 ,  H01S5/022 ,  H04B10/40 ,  H04B10/503

    Abstract: Apparatuses, systems, and associated methods are described that provide an optical device with sealed optoelectronic component(s) without impacting effective optical performance of the optical device. An example optical device includes a substrate that defines a first surface and a second surface opposite the first surface. The optical device further includes an optoelectronic component supported by the first surface of the substrate where the optoelectronic component operates with optical signals. The optical device further includes a conformal coating applied to the first surface of the substrate such that at least a portion of the conformal coating is disposed on the optoelectronic component. The conformal coating substantially seals the optoelectronic component from an external environment of the optical device without impacting effective optical performance of the optical device. A thickness of the conformal coating may be determined based upon one or more operating parameters of the optoelectronic component.

    Voltage controlled electro-optical serializer/deserializer (SERDES)
    44.
    发明申请
    Voltage controlled electro-optical serializer/deserializer (SERDES) 有权

    公开(公告)号：US20220337321A1

    公开(公告)日：2022-10-20

    申请号：US17764540

    申请日：2019-11-14

    Applicant: MELLANOX TECHNOLOGIES, LTD.

    Inventor： Nikos Argyris ,  Yoav Rozenberg ,  Dimitrios Kalavrouziotis ,  Elad Mentovich

    IPC: H04B10/50 ,  H04B10/564 ,  H04B10/2575

    Abstract: An optoelectronic transmitter (10) includes an electro-optic modulator (12), digital driving circuitry (14), and feedback circuitry (30). The electro-optic modulator is configured to modulate an optical signal in response to an electrical drive signal. The digital driving circuitry is coupled to the electro-optical modulator and is configured to generate the electrical drive signal. The feedback circuitry is configured to measure a quantity indicative of a power level of the modulated optical signal produced by the electro-optic modulator, and to adapt a supply voltage to the digital driving circuitry in response to the measured quantity.

    Heat removal from silicon photonics chip using a recessed side-by-side thermal dissipation layout
    47.
    发明申请
    Heat removal from silicon photonics chip using a recessed side-by-side thermal dissipation layout 有权

    公开(公告)号：US20220061148A1

    公开(公告)日：2022-02-24

    申请号：US17517693

    申请日：2021-11-03

    Applicant: MELLANOX TECHNOLOGIES, LTD.

    Inventor： Elad Mentovich ,  Anna Sandomirsky ,  Dimitrios Kalavrouziotis

    IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30

    Abstract: A semiconductor device assembly (10) includes a multi-layer printed circuit board (PCB—40), a thermoelectric cooler (TEC—30), a chip (22), and packaged integrated circuitry (IC—26). The multi-layer PCB includes a lateral heat conducting path (60) formed in a recessed area (44) of the PCB. The TEC and the chip are disposed on the PCB, side-by-side to one another over the lateral heat conducting path. The TEC is configured to evacuate heat from the chip via the lateral heat conducting path, and to dissipate the evacuated heat via a first end of a heat sink (33) in thermal contact with the TEC. The packaged IC is disposed on an un-recessed area of the PCB, wherein the packaged IC is configured to dissipate heat via a second end of the heat sink that is in thermal contact with the packaged IC.

    High-density Optical Communications Using Multi-core Fiber
    48.
    发明申请
    High-density Optical Communications Using Multi-core Fiber 有权

    公开(公告)号：US20210311273A1

    公开(公告)日：2021-10-07

    申请号：US17315312

    申请日：2021-05-09

    Applicant: MELLANOX TECHNOLOGIES, LTD.

    Inventor： Dimitrios Kalavrouziotis ,  Donald Becker ,  Boaz Atias ,  Paraskevas Bakopoulos ,  Elad Mentovich

    IPC: G02B6/43 ,  H04B10/25 ,  G02B6/42 ,  G02B6/44

    Abstract: A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect includes multiple fiber cores for routing the plurality of optical communication signals between the MCF and the panel. The MCF has a first end at which the multiple fiber cores are coupled to the MCM, and a second end at which the multiple fiber cores are connected to the optical-to-optical connector on the panel.

Patent Agency Ranking