公开(公告)号：US20220342466A1

公开(公告)日：2022-10-27

申请号：US17857868

申请日：2022-07-05

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20 ,  G06N20/00 ,  G05B19/042

Abstract: A cooling system for a datacenter is disclosed. An evaporative cooling subsystem provides blown air for cooling the datacenter and a repurposable refrigerant cooling subsystem controls moisture of the blown air in a first configuration and independently cools the datacenter in a second configuration.

公开(公告)号：US20220338374A1

公开(公告)日：2022-10-20

申请号：US17235047

申请日：2021-04-20

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06F1/20

Abstract: Configurations for cooling systems are disclosed. In at least one embodiment, a fluid manifold is positioned to couple directly to one or more liquid-cooled server connections to form a connection when the liquid-cooled server is in an installed position within a server rack.

公开(公告)号：US20220236779A1

公开(公告)日：2022-07-28

申请号：US17155918

申请日：2021-01-22

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20 ,  H05K7/20 ,  G06N3/08

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-liquid heat exchanger associated with a rear door of a rack exchanges heat between a primary coolant associated with a chilling facility and a secondary coolant or fluid associated with a computing device of the rack.

公开(公告)号：US20220174847A1

公开(公告)日：2022-06-02

申请号：US17107138

申请日：2020-11-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an alternate cooling loop with its own fluid source and a liquid-to-liquid heat exchanger is used to provide cooling for the at least one computing component alternatively from a secondary cooling loop that is associated with a primary cooling loop and a chilling facility.

公开(公告)号：US20220095476A1

公开(公告)日：2022-03-24

申请号：US17028744

申请日：2020-09-22

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate has an opening and a cavity so that the cold plate can be hermetically sealed around at least one computing component at the cavity and so that the cold plate can comprise fluid to immerse at least a portion of the at least one computing component.

公开(公告)号：US20220071063A1

公开(公告)日：2022-03-03

申请号：US17010658

申请日：2020-09-02

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: A datacenter liquid cooling system is disclosed. At least two liquid distribution units (LDUs) are enabled to concurrently serve coolant to at least one server tray in a first configuration, and the at least two LDUs are enabled for replacement of a first one of the at least two LDUs in a second configuration, in which a second one of the at least two LDUs is enabled to serve the coolant to the at least one server tray.

公开(公告)号：US20210267096A1

公开(公告)日：2021-08-26

申请号：US16798214

申请日：2020-02-21

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  H05K7/14

Abstract: A datacenter cooling system is disclosed. The system includes a first cooling loop with a heat exchanger to exchange heat with a second cooling loop. The second cooling loop includes a cooling distribution unit (CDU) to exchange heat between the second cooling loop and a primary cooling loop.

公开(公告)号：US12200909B2

公开(公告)日：2025-01-14

申请号：US17061320

申请日：2020-10-01

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a fluid reservoir in a form-factor of at least one rack is provided, the fluid reservoir to store fluid, the fluid to be passed to a cold plate or an immersive-cooled server, and the fluid to be cooled by a secondary cooling loop or an air-cooling system.

公开(公告)号：US12174602B2

公开(公告)日：2024-12-24

申请号：US16984650

申请日：2020-08-04

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G05B19/042 ,  G01K3/00 ,  G01K13/02 ,  G06N3/08 ,  H05K7/20

Abstract: A thermal load system for testing a datacenter liquid cooling system is disclosed. The system includes a server box having at least one thermal feature associated with at least one cooling feature and at least one flow controller, where the at least one thermal feature and the at least one flow controller are adjustable to cause cooling stress on the datacenter liquid cooling system.

公开(公告)号：US12127374B2

公开(公告)日：2024-10-22

申请号：US17845839

申请日：2022-06-21

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/00 ,  G06N3/04 ,  G06N3/08 ,  H05K7/20

CPC classification number: H05K7/20272 ,  G06N3/04 ,  G06N3/08 ,  H05K7/20254 ,  H05K7/20736

Abstract: Systems and methods for a datacenter cooling system are disclosed. In at least one embodiment, reconfigurable terminations are provided for fluid loops in a datacenter cooling system with individual ones of such reconfigurable terminations are to be configured in a first state to enable non-cooling fluid runs through individual ones of such fluid loops, taken individually and in combination, during commissioning of a datacenter cooling system, and are to be configured in a second state to enable cooling fluid runs to cool at least one cold plate after commissioning of a datacenter cooling system.