公开(公告)号：US20180049627A1

公开(公告)日：2018-02-22

申请号：US15794039

申请日：2017-10-26

Applicant: OLYMPUS CORPORATION

Inventor： Satoru ADACHI ,  Noriyuki FUJIMORI ,  Takatoshi IGARASHI

IPC: A61B1/05 ,  G02B23/24 ,  G02B23/26 ,  H04N5/30

CPC classification number: A61B1/05 ,  A61B1/00114 ,  A61B1/00188 ,  A61B1/051 ,  G02B23/2407 ,  G02B23/2423 ,  G02B23/2469 ,  G02B23/2484 ,  G02B23/26 ,  G03B17/02 ,  H01L27/14634 ,  H04N5/30 ,  H04N5/379 ,  H04N2005/2255

Abstract: An imaging unit includes: an image sensor configured to generate an image signal by receiving light and performing photoelectric conversion; and a relay member including a plurality of silicon substrates laminated on a back surface side of the image sensor opposite to a light receiving surface of the image sensor, planar type electronic devices being formed on the silicon substrates, and relay the image sensor and a signal cable that transmits the image signal. The relay member includes a multilayer wiring layer laminated on an outermost surface of the silicon substrate, and the multilayer wiring layer includes, on an outermost surface, a material allowing the signal cable to be connected.

公开(公告)号：US20170322411A1

公开(公告)日：2017-11-09

申请号：US15654133

申请日：2017-07-19

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI

IPC: G02B23/24 ,  A61B1/05 ,  A61B1/00 ,  H04N5/374 ,  A61B1/005

CPC classification number: G02B23/2484 ,  A61B1/00 ,  A61B1/00188 ,  A61B1/0051 ,  A61B1/051 ,  H04N5/374

Abstract: An image pickup apparatus includes an optical unit in which a plurality of lenses have relative positions fixed by a transparent resin that fills spaces among the plurality of lenses, and an image pickup substrate in which a light receiving section configured to receive light that is caused to be incident from the optical unit is formed on a principal surface, the optical unit being bonded to the principal surface via an adhesive, and the optical system includes an objective optical system including a plurality of lenses, and inter-lens distances of the plurality of lenses are defined by a spacer, a diaphragm, or the transparent resin.

公开(公告)号：US20150087088A1

公开(公告)日：2015-03-26

申请号：US14557157

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Takatoshi IGARASHI ,  Kazuhiro YOSHIDA

IPC: H01L25/00 ,  H01L21/78 ,  H01L21/66 ,  H01L27/146

CPC classification number: H01L25/50 ,  H01L21/78 ,  H01L21/786 ,  H01L22/10 ,  H01L22/20 ,  H01L23/3121 ,  H01L27/14618 ,  H01L27/14638 ,  H01L27/14687 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes processes of: cutting an image pickup chip substrate to fabricate a plurality of image pickup chips; bonding the image pickup chips to a glass wafer via a transparent adhesive layer as well as bonding dummy chips to an outer peripheral region of the glass wafer where the image pickup chips are not bonded to fabricate a joined wafer; filling a sealing member between the image pickup chips and the dummy chips; machining the joined wafer to thin a thickness; and cutting the joined wafer.

Abstract translation: 一种图像拾取装置的制造方法，包括以下处理：切割图像拾取芯片基板以制造多个图像拾取芯片; 通过透明粘合剂层将图像拾取芯片接合到玻璃晶片，以及将虚拟芯片接合到不结合图像拾取芯片的玻璃晶片的外周区域以制造接合的晶片; 在图像拾取芯片和虚拟芯片之间填充密封构件; 加工接合的晶片以使厚度变薄; 并切割接合的晶片。

公开(公告)号：US20150087086A1

公开(公告)日：2015-03-26

申请号：US14557021

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA ,  Noriyuki Fujimori ,  Takatoshi IGARASHI

IPC: H01L27/146 ,  H01L21/56 ,  H01L21/768 ,  H01L21/78 ,  H01L21/66

CPC classification number: H01L25/042 ,  H01L21/56 ,  H01L21/76898 ,  H01L21/78 ,  H01L22/10 ,  H01L22/20 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种用于制造图像拾取装置的方法包括：通过切割形成光接收部分和电极焊盘的图像拾取芯片基板来制造多个图像拾取芯片的处理; 通过将图像拾取芯片接合到玻璃晶片来制造接合晶片的工艺; 将多个图像拾取芯片之间的间隙填充到密封构件的处理; 加工接合的晶片以减小厚度的过程; 形成通孔过孔的过程; 形成覆盖图像拾取芯片的绝缘层的工艺; 形成通孔互连的过程; 形成外部连接电极的工艺，每个连接电极连接到每个通孔互连件; 以及切割接合的晶片的过程。

公开(公告)号：US20140179999A1

公开(公告)日：2014-06-26

申请号：US14192148

申请日：2014-02-27

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Noriyuki FUJIMORI ,  Yukiharu MAKINO

IPC: A61B1/04 ,  A61B1/06 ,  A61B1/00

CPC classification number: A61B1/041 ,  A61B1/00016 ,  A61B1/00032 ,  A61B1/0661

Abstract: A capsule endoscope includes a capsule type housing and a circuit board on which a plurality of board sections are arranged in a row, the circuit board being housed inside the housing in a bent state. Connection electrodes for electronic component mounting are not formed on a second principal plane of the circuit board.

Abstract translation: 胶囊型内窥镜包括：胶囊型壳体和电路基板，多个基板部分排列成一列，电路板以弯曲状态容纳在壳体内。 用于电子元件安装的连接电极不形成在电路板的第二主平面上。

公开(公告)号：US20130188030A1

公开(公告)日：2013-07-25

申请号：US13790884

申请日：2013-03-08

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI

IPC: H04N5/225 ,  A61B1/00

CPC classification number: H04N5/2254 ,  A61B1/00064 ,  A61B1/00096 ,  A61B1/051 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lens holder that holds a lens in an inner portion thereof, an image pickup device including a light-receiving section, the image pickup device being positioned at a rear in an optical axis direction L of the lens, a cover glass attached to a facing surface of the image pickup device, and a fitting portion formed in at least an outer circumferential face of the cover glass, the fitting portion allowing a rear end-side part of the lens holder to be fitted thereon are included, and the lens holder and the image pickup device are each formed to have a size allowing the lens holder and the image pickup device to have a same width in a width direction when the rear end-side part is fitted on the fitting portion.

Abstract translation: 在其内部保持透镜的透镜保持器，包括受光部的图像拾取装置，所述图像拾取装置位于所述透镜的光轴方向L的后方，附接到所述透镜的表面 图像拾取装置的表面和形成在盖玻璃的至少外周面中的装配部分，包括允许透镜保持器的后端部安装在其上的装配部分，并且透镜保持器和 图像拾取装置各自形成为当后端侧部分装配在装配部分上时具有允许透镜架和图像拾取装置在宽度方向上具有相同的宽度的尺寸。