摘要:
Disclosed is a system for fabricating a liquid crystal display using liquid crystal dropping and a method of fabricating a liquid crystal display using the same. The present invention includes a liquid crystal forming line dropping liquid crystals on the first substrate, a sealant forming line forming the sealant on the second substrate, and a bonding and hardening line bonding the two substrates to each other and hardening the sealant, printing a sealant, bonding the substrates each other, and hardening the sealant and an inspection process line of cutting the bonded substrates into panel units and grinding and inspecting the unit panels. And, the GAP process line includes And, the present invention includes the processes of dropping LC on a first substrate using a dispenser, forming a main UV hardening sealant on a second substrate, bonding the first and second substrates to each other in a vacuum state, UV-hardening the main UV hardening sealant, cutting the bonded substrates into cell units, grinding the cut substrates, and inspecting the grinded substrates finally.
摘要:
The present invention relates to a fixing structure of a side shield for glasses wherein a side shield installed in glasses legs, comprising a through hole formed in inner upper and lower portions of a rear end of a side shield surrounding the glasses legs, and a fixture having an elastic piece in the interior of the same and a hook part in the upper and lower sides of a front end wherein said fixture is inserted through an opening of the side shield, and the hook part of the fixture is engaged to the though hole, and the elastic piece of the fixture is elastically closely contacted with the glasses legs. In the present invention, the size of the fixture is large, and the hook part of the fixture is inserted into the through hole formed in the side shield. Therefore, anyone can easily insert the fixture for thereby achieving a convenient assembling work, and the side shield is easily fixed to the glasses legs.
摘要:
There is provided a speech coding/decoding apparatus and method, in which the input speech signals are classified into several classes in accordance with characteristics of the input speech signals and the input speech signals are coded using frame sizes, quantizer structures, and bit assignment methods corresponding to the determined classes, or in which the frame sizes can be adjusted in accordance with network conditions or codec type of a counter part. Therefore, by optimally adjusting the frame size, the quantizer structure, and the bit assignment method in accordance with the characteristics of input speech, it is possible to improve the performance of the speech coding apparatus, and by adjusting the frame size in accordance with the speech codec type of a counter part, it is also possible to reduce the total end-to-end delay.
摘要:
The present invention provides a device isolation method of a semiconductor memory device and flash memory device fabricating method using the same, which can prevent a bridge occurrence between cells. The present invention includes forming a nitride layer pattern defining a trench forming area on a semiconductor substrate, forming a spacer on a sidewall of the nitride layer pattern, forming a trench in the semiconductor layer by removing a portion of the semiconductor layer using the nitride layer pattern and the spacer as an etch mask, forming a device isolation layer filling up the trench, removing the nitride layer pattern and the spacer to complete the device isolation layer, forming a conductor layer over the substrate including the device isolation layer, planarizing the conductor layer and the device isolation layer to lie in a same plane, and forming an insulating layer over the substrate.
摘要:
The present invention provides a method of fabricating a flash memory device, by which a coupling ratio is raised in a manner of shortening an interval between floating gates using a spacer and by which a bridge generation is avoided between control and floating gates. The present invention includes forming a trench isolation layer defining an active area of a semiconductor substrate, forming a tunnel oxide layer on the active area, forming a first conductor layer for a floating gate over the substrate, forming an insulating layer pattern on the first conductor layer with a prescribed layer having high etch selectivity with the trench isolation layer to expose a portion of the first conductor layer, forming a spacer on a sidewall of the insulating layer pattern, forming a first conductor layer pattern exposing a portion of the trench isolation layer by removing the exposed portion of the first conductor layer using the spacer as an etch mask, removing the insulating layer pattern and the spacer, forming a gate-to-gate insulating layer over the substrate, and forming a second conductor layer on the gate-to-gate insulating layer.
摘要:
The present invention provides a method of fabricating a flash memory device, in which floating gates in neighbor cells are separated from each other without using photolithography, which enhances electrical characteristics of the device, and which facilitates a cell size reduction. The present invention includes forming a mask defining a trench forming area on a semiconductor substrate, forming a trench in the semiconductor layer by removing a portion of the semiconductor layer using the mask, forming a device isolation layer filling up the trench to maintain an effective isolation layer thickness exceeding a predefined thickness, removing the mask, forming a conductor layer over the substrate including the device isolation layer, planarizing the conductor layer and the device isolation layer to lie in a same plane, and forming an insulating layer over the substrate including the conductor patterns.
摘要:
A method for cutting a liquid crystal display panel includes providing first and second mother substrates, forming a scribing line on the first and second mother substrates, removing a portion of a seal line being overlapped with the scribing line, the seal line formed on one of the first and second mother substrates, and dividing the first and second mother substrates into a plurality of unit liquid crystal display panels along the scribing line.
摘要:
The present invention relates to a micro optical communication device package. The package of the invention comprises a Micro-Electro-Mechanical System (MEMS) chip for executing an optical communication function. The MEMS chip is mounted on a base. An upper housing having an opened bottom is placed on the base to form an internal space together with the base. The upper housing is sealed with the base to hermetically seal the MEMS chip within the internal space. The MEMS chip is connected an optical fiber, which is extended through the upper housing to form a light path. A boot is fit around the optical fiber and fixed to the upper housing to seal a portion of the upper housing for allowing passage of the optical fiber.
摘要:
In order to provide a method for preventing the channel length from being shortened as well as reducing the SAS resistance, the semiconductor device according to the present invention is manufactured by continuously forming linear trench lines on a semiconductor substrate, forming gate oxide lines on the semiconductor substrate between the trench lines, forming gate lines on the trench lines and the gate oxide lines, the gate lines being substantially perpendicular to the trench lines, etching the gate oxide lines and trench lines positioned between the gate lines, forming self aligned sources (SASs) by implanting impurity ions into the etched region, forming spacers on sidewalls of the gate lines, and implanting the impurity ions in the SAS region using the spacers as a mask.
摘要:
The present invention is provided to manufacture a slot antenna having slots formed on both sides, that is, a top and a bottom of a dielectric substrate, wherein electric fields in the slots are generated in the utmost same direction. According to this structure, it is possible to realize a compact and lightweight slot antenna having higher gain and radiation efficiency characteristics in comparison with the conventional meandered slot antenna.