公开(公告)号：US20050078920A1

公开(公告)日：2005-04-14

申请号：US10734146

申请日：2003-12-15

申请人： Yeong Lee ,  Seong Lee ,  Sung Jung ,  Moo Park ,  Suk Hong

发明人： Yeong Lee ,  Seong Lee ,  Sung Jung ,  Moo Park ,  Suk Hong

IPC分类号： G02B6/26 ,  B81B7/02 ,  G02B6/00 ,  G02B6/35 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42 ,  G02B26/08 ,  H04B10/00 ,  H04B10/40 ,  H04B10/50 ,  H04B10/60

CPC分类号： G02B6/3582 ,  G02B6/266 ,  G02B6/3552 ,  G02B6/3594 ,  G02B6/36 ,  G02B6/3887 ,  G02B6/4248

摘要： The present invention relates to a micro optical communication device package. The package of the invention comprises a Micro-Electro-Mechanical System (MEMS) chip for executing an optical communication function. The MEMS chip is mounted on a base. An upper housing having an opened bottom is placed on the base to form an internal space together with the base. The upper housing is sealed with the base to hermetically seal the MEMS chip within the internal space. The MEMS chip is connected an optical fiber, which is extended through the upper housing to form a light path. A boot is fit around the optical fiber and fixed to the upper housing to seal a portion of the upper housing for allowing passage of the optical fiber.

摘要翻译： 本发明涉及一种微型光通信设备封装。 本发明的封装包括用于执行光通信功能的微机电系统（MEMS）芯片。 MEMS芯片安装在基座上。 具有开口底部的上壳体被放置在基座上以与基部一起形成内部空间。 上壳体与基座密封，以将MEMS芯片密封在内部空间内。 MEMS芯片连接有光纤，该光纤通过上壳体延伸以形成光路。 导光罩装在光纤周围并固定在上壳体上，以密封上壳体的一部分，以允许光纤通过。

公开(公告)号：US20050084205A1

公开(公告)日：2005-04-21

申请号：US10822726

申请日：2004-04-13

申请人： Suk Hong ,  Moo Park ,  Yeong Lee

发明人： Suk Hong ,  Moo Park ,  Yeong Lee

IPC分类号： G02B6/00 ,  G02B6/26 ,  G02B6/293 ,  G02B6/34 ,  G02B6/35 ,  H04J14/02 ,  G02B6/42

CPC分类号： G02B6/353 ,  G02B6/266 ,  G02B6/29353 ,  G02B6/29364 ,  G02B6/29389 ,  G02B6/3552 ,  G02B6/356 ,  G02B6/357 ,  G02B6/3594

摘要： Disclosed is a WDM system for demultiplexing mixed optical signals transmitted through one channel from the outside to distribute specific wavelength optical signals into a plurality of channels. The WDM system has a receiving optical fiber for receiving the mixed optical signals. A filter is arranged in an output end of the receiving optical fiber for selectively transmitting a specific optical signal of a wavelength identical with the peak wavelength of the filter but reflecting remaining wavelength optical signals. A transmitting optical fiber outputs the specific wavelength optical signal transmitted through the filter. A shutter member attenuates the specific wavelength optical signal between the filter and the transmitting optical fiber. An actuator drives the shutter member across the propagation of the specific wavelength optical signal transmitted through the filter; and a control unit for controlling the actuation of the actuator. The built-in optical attenuators allow integration of individual components, simplify the structure of the system as well as improve the performance and reliability of the system.

摘要翻译： 公开了一种WDM系统，用于从外部将通过一个信道传输的混合光信号解复用，以将特定波长的光信号分配到多个信道中。 WDM系统具有用于接收混合光信号的接收光纤。 滤波器布置在接收光纤的输出端，用于选择性地发射与滤波器的峰值波长相同的波长的特定光信号，但反射剩余的波长光信号。 发送光纤输出通过滤波器发送的特定波长光信号。 快门部件衰减滤光器和发射光纤之间的特定波长光信号。 致动器驱动快门部件穿过通过过滤器传输的特定波长光信号的传播; 以及用于控制致动器的致动的控制单元。 内置的光衰减器可以集成各个组件，简化系统的结构，并提高系统的性能和可靠性。

公开(公告)号：US20060076666A1

公开(公告)日：2006-04-13

申请号：US11180979

申请日：2005-07-12

申请人： Yeong Lee ,  Suk Hong

发明人： Yeong Lee ,  Suk Hong

IPC分类号： H01L23/24

CPC分类号： B81C1/00269 ,  B81C2203/019 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A micro-electro-mechanical system (MEMS) package having a hydrophobic layer is disclosed. The MEMS package includes: a base substrate, with an MEMS element provided on a surface of the base substrate; a lid, spaced apart from the MEMS element provided on the base substrate and covering the MEMS element; a side sealing member provided on a side surface of the base substrate and the surface of the lid, thus hermetically sealing the MEMS element from an external environment; and a hydrophobic layer which covers the part of the side sealing member that is exposed to the external environment, thus removing the hydrophilia from the side sealing member.

摘要翻译： 公开了一种具有疏水层的微机电系统（MEMS）封装。 MEMS封装包括：基底基板，其具有设置在基底基板的表面上的MEMS元件; 与设置在基底基板上并覆盖MEMS元件的MEMS元件间隔开的盖; 侧密封构件，设置在基底基板的侧面和盖的表面上，从而将MEMS元件从外部环境密封; 以及覆盖侧面密封构件暴露于外部环境的部分的疏水层，从而从侧面密封构件除去亲水性。

公开(公告)号：US20060198000A1

公开(公告)日：2006-09-07

申请号：US11347187

申请日：2006-02-03

申请人： Heung Park ,  Yeong Lee ,  Suk Hong ,  Chang Park ,  Ohk Lim

发明人： Heung Park ,  Yeong Lee ,  Suk Hong ,  Chang Park ,  Ohk Lim

IPC分类号： G03H1/10

CPC分类号： G02B26/0833 ,  G03H2225/24 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05553 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2924/1461 ,  H01L2924/00014

摘要： Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.

摘要翻译： 本文公开了一种使用倒装芯片安装技术的光调制器模块封装，其中使用倒装芯片安装技术将光调制器装置气密地安装。 光调制器装置被保护免受外部环境的影响，容易将电信号传输到外部，并且希望保持光调制器件的光学特性。

公开(公告)号：US20060081951A1

公开(公告)日：2006-04-20

申请号：US11180302

申请日：2005-07-12

申请人： Suk Hong ,  Dong Park ,  Yeong Lee

发明人： Suk Hong ,  Dong Park ,  Yeong Lee

IPC分类号： H01L29/82

CPC分类号： B81C1/00293 ,  B81B2203/0384 ,  B81C2203/019 ,  H01L24/81

摘要： A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an MEMS element provided on the base substrate, joining a lid glass to the metal layer, and providing a side double-sealing member on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment. The MEMS package includes a base substrate, with an MEMS element provided on a surface of the base substrate; a lid glass joined to the base substrate such that the lid glass covers the MEMS element and transmits incident light; a dam sealing member provided on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment; and a second sealing member deposited on an upper surface of the dam sealing member such that the second sealing member is provided on the surface of the base substrate and the side surface of the lid glass, thus secondarily hermetically sealing the MEMS element from the external environment.

摘要翻译： 公开了一种具有侧面双密封构件的微机电系统（MEMS）封装以及MEMS封装的制造方法。 MEMS封装通过图案化在基底基板上形成金属层而形成，使得金属层围绕设置在基底基板上的MEMS元件，将盖玻璃接合到金属层，并在其上提供侧面双重密封构件 基底基板的表面和盖玻璃的侧表面，从而将MEMS元件从外部环境气密地密封。 MEMS封装包括基底基板，其中MEMS元件设置在基底基板的表面上; 连接到基底基板上的盖玻璃使得盖玻璃覆盖MEMS元件并透射入射光; 设置在基底基板的表面和盖玻璃的侧面的坝密封构件，从而将MEMS元件从外部环境气密地密封; 以及第二密封构件，其沉积在所述坝密封构件的上表面上，使得所述第二密封构件设置在所述基底基板的表面和所述盖玻璃的侧表面上，从而二次将所述MEMS元件与所述外部环境密封 。

公开(公告)号：US20070263068A1

公开(公告)日：2007-11-15

申请号：US11399366

申请日：2006-04-07

申请人： Suk Hong

发明人： Suk Hong

IPC分类号： H04N7/14

CPC分类号： B60R11/0211 ,  B60R2011/0075 ,  B60R2011/0094 ,  B60R2011/027

摘要： A mobile audio-video receiver with an external memory receptacle includes a base containing circuitry and components for functions of the mobile audio-video receiver, a front panel mounted on a front surface of the base, a display screen on the front panel, function buttons on the front panel for controlling the functions of the mobile audio-video receiver, and the external memory receptacle positioned in a side surface of the base such that an externally accessible internal memory can be inserted into the base behind the front panel.

摘要翻译： 具有外部存储器插座的移动音频 - 视频接收器包括：基座，包括用于移动音频 - 视频接收器功能的电路和组件;安装在基座的前表面上的前面板，前面板上的显示屏幕，功能按钮 在前面板上用于控制移动音频 - 视频接收器的功能，以及位于基座的侧表面中的外部存储器插座，使得外部可访问的内部存储器可以插入到前面板后面的基座中。

公开(公告)号：US20060044214A1

公开(公告)日：2006-03-02

申请号：US10924842

申请日：2004-08-25

申请人： Suk Hong

发明人： Suk Hong

IPC分类号： G09G5/00

CPC分类号： B64D11/0015 ,  B60R11/0235 ,  B60R2011/0017 ,  G06F3/0227 ,  G06F3/04886 ,  H04N5/765 ,  H04N5/775 ,  H04N21/4316 ,  H04N21/47 ,  H04N21/485

摘要： A touch panel video display system includes: a touch panel video display screen positioned in a rear surface of the portion of the seat such that a passenger behind the seat can view the touch panel video display screen; and an audio video junction controller connected to the touch panel video display screen for connecting one of a plurality of audio video devices to the video display screen in response to a device control input from the touch panel video display screen and for controlling audio from the plurality of audio video devices in response to an audio control input from the touch panel video display screen, wherein one of the plurality of audio video devices is a media player connected to the audio video junction controller such that playback operations of the media player are controlled by an operation input from the touch panel video display screen.

摘要翻译： 一种触摸面板视频显示系统，包括：位于所述座椅的所述部分的后表面中的触摸面板视频显示屏幕，使得所述座椅后面的乘客可以观看所述触摸面板视频显示屏幕; 以及音频视频接口控制器，其连接到触摸面板视频显示屏幕，用于响应于来自触摸面板视频显示屏幕的设备控制输入而将多个音频视频设备中的一个连接到视频显示屏幕并且用于控制来自多个 响应于来自触摸面板视频显示屏幕的音频控制输入的多个音频视频设备，其中多个音频视频设备之一是连接到音频视频接口控制器的媒体播放器，使得媒体播放器的播放操作由 来自触摸屏视频显示屏的操作输入。

公开(公告)号：US20060278863A1

公开(公告)日：2006-12-14

申请号：US11445650

申请日：2006-06-02

申请人： Heon Chang ,  Suk Hong ,  Hae Park

发明人： Heon Chang ,  Suk Hong ,  Hae Park

IPC分类号： H01L29/04

CPC分类号： H01L21/743 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/1675

摘要： Disclosed are a phase change RAM device and a method for fabricating a phase change RAM device, which can efficiently lower intensity of current required for changing a phase of a phase change layer. The method includes the steps of providing a semiconductor substrate formed with an insulating interlayer including a tungsten plug, forming a first oxide layer on the semiconductor substrate, forming a pad-type bottom electrode, which makes contact with the tungsten plug, in the first oxide layer, forming a second oxide layer on the first oxide layer including the bottom electrode, and forming a porous polystyrene pattern on the second oxide layer such that a predetermined portion of the second oxide layer corresponding to a center portion of the bottom electrode is covered with the porous polystyrene pattern.

摘要翻译： 公开了一种相变RAM装置和制造相变RAM装置的方法，其可以有效地降低改变相变层的相位所需的电流强度。 该方法包括以下步骤：提供形成有包含钨插塞的绝缘中间层的半导体衬底，在半导体衬底上形成第一氧化物层，在第一氧化物中形成与钨插头接触的焊盘型底电极 层，在包括底电极的第一氧化物层上形成第二氧化物层，并且在第二氧化物层上形成多孔聚苯乙烯图案，使得与底电极的中心部分相对应的第二氧化物层的预定部分被覆盖 多孔聚苯乙烯图案。

公开(公告)号：US20060266991A1

公开(公告)日：2006-11-30

申请号：US11247318

申请日：2005-10-11

申请人： Heon Chang ,  Suk Hong ,  Hae Park

发明人： Heon Chang ,  Suk Hong ,  Hae Park

IPC分类号： H01L47/00

CPC分类号： H01L45/06 ,  H01L45/1233 ,  H01L45/126 ,  H01L45/144

摘要： Disclosed is a phase change memory device having a uniformly decreased writing current necessary for phase change of a phase change layer and a method for manufacturing the same. The phase change memory device includes a semiconductor substrate having a lower pattern; a first oxide layer formed on the semiconductor substrate to cover the lower pattern; a bottom electrode contact formed as a plug shape within the first oxide layer; a nano-size insulation layer formed on the first oxide layer including the bottom electrode contact; a phase change layer formed on the nano-size insulation layer; a top electrode formed on the phase change layer; a second oxide layer formed on the overall surface of the resulting substrate to cover a phase change cell having the bottom electrode contact, the nano-size insulation layer, the phase change layer, and the top electrode laminated successively; and a metal wiring formed within the second oxide layer to contact the top electrode. The nano-size insulation layer is made of any one chosen from a group including silicon oxide (SiO2), aluminum oxide (Al2O3), hafnium oxide (HfO2), and zirconium oxide (ZrO2) or from a group including silicon nitride (SiN) and aluminum nitride (AlN).

摘要翻译： 公开了相变层的相位变化所需的写入电流均匀降低的相变存储器件及其制造方法。 相变存储器件包括具有较低图案的半导体衬底; 形成在所述半导体衬底上以覆盖所述下部图案的第一氧化物层; 在第一氧化物层内形成为塞子形状的底部电极接触; 形成在包括所述底部电极接触部的所述第一氧化物层上的纳米尺寸绝缘层; 形成在纳米尺寸绝缘层上的相变层; 形成在所述相变层上的顶部电极; 形成在所得基板的整个表面上的第二氧化物层，以覆盖具有底部电极接触的相变单元，纳米尺寸绝缘层，相变层和顶部电极; 以及形成在所述第二氧化物层内以接触所述顶部电极的金属布线。 纳米尺寸绝缘层由选自氧化硅（SiO 2），氧化铝（Al 2 O 3 O 3），氧化铝 >），氧化铪（HfO 2 O 2）和氧化锆（ZrO 2/2），或者包括氮化硅（SiN）和氮化铝（AlN）的组中。

公开(公告)号：US20060278899A1

公开(公告)日：2006-12-14

申请号：US11445651

申请日：2006-06-02

申请人： Heon Chang ,  Suk Hong ,  Hae Park

发明人： Heon Chang ,  Suk Hong ,  Hae Park

IPC分类号： H01L29/768

CPC分类号： H01L45/144 ,  H01L27/2436 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/1675

摘要： A phase change RAM device includes a semiconductor substrate having a phase change cell area and a voltage application area; a first oxide layer, a nitride layer and a second oxide layer sequentially formed on the semiconductor substrate; a first plug formed in the first oxide layer, the nitride layer and the second oxide layer of the phase change cell area; a second plug formed in the first oxide layer and the nitride layer of the voltage application area; a conductive line formed in the second oxide layer; a third oxide layer formed on the second oxide layer; a lower electrode shaped like a plug, the lower electrode being formed so as to directly make contact with the first plug; and a phase change layer and an upper electrode sequentially formed on the lower electrode in a pattern form.