公开(公告)号：US20200274514A1

公开(公告)日：2020-08-27

申请号：US16284831

申请日：2019-02-25

Applicant: Texas Instruments Incorporated

Inventor： Ting-Ta Yen ,  Brian Goodlin ,  Ricky Alan Jackson ,  Nicholas Stephen Dellas

IPC: H03H9/02 ,  G06F17/50 ,  H03H3/02 ,  H03H9/13 ,  H03H9/17

Abstract: A micromechanical system (MEMS) acoustic wave resonator is formed on a base substrate. A piezoelectric member is mounted on the base substrate. The piezoelectric member has a first electrode covering a first surface of the piezoelectric member and a second electrode covering a second surface of the piezoelectric member opposite the first electrode, the second electrode being bounded by a perimeter edge. A first guard ring is positioned on the second electrode spaced apart from the perimeter edge of the second electrode.

公开(公告)号：US10686425B2

公开(公告)日：2020-06-16

申请号：US15639552

申请日：2017-06-30

Applicant: Texas Instruments Incorporated

Inventor： Ting-Ta Yen

IPC: H01L41/09 ,  H03H9/02 ,  H03H3/02 ,  H03H9/17

Abstract: Bulk acoustic wave (BAW) resonators having convex surfaces, and methods of forming the same are disclosed. An example BAW resonator includes a first electrode, a piezoelectric layer formed on the first electrode, the piezoelectric layer having a convex surface, and a second electrode formed on the convex surface. An example integrated circuit (IC) package includes a BAW resonator disposed in the IC package, the BAW resonator including a piezoelectric layer having a convex surface.

公开(公告)号：US10651817B2

公开(公告)日：2020-05-12

申请号：US15857906

申请日：2017-12-29

Applicant: Texas Instruments Incorporated

Inventor： Ting-Ta Yen ,  Brian Goodlin ,  Ricky Alan Jackson ,  Nicholas Stephen Dellas

IPC: H03H9/02 ,  B81C1/00 ,  B81B7/00 ,  H03H3/007 ,  H03H9/17 ,  H03H9/05 ,  H03H9/10 ,  H03H9/09

Abstract: In described examples of a micromechanical system (MEMS), a rigid cantilevered platform is formed on a base substrate. The cantilevered platform is anchored to the base substrate by only a single anchor point. A MEMS resonator is formed on the cantilevered platform.

公开(公告)号：US20200043828A1

公开(公告)日：2020-02-06

申请号：US16055395

申请日：2018-08-06

Applicant: Texas Instruments Incorporated

Inventor： Peter Smeys ,  Ting-Ta Yen ,  Barry Jon Male ,  Paul Merle Emerson

IPC: H01L23/433 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

Abstract: Described examples include microelectronic devices and integrated circuits with an active first circuit in a first segment of a first wafer, a second circuit in a second segment of the first wafer, and second and third wafers bonded to different surfaces of the first wafer to provide first and second cavities with surfaces spaced from the first segment. An opening extends through the first wafer between the first and second cavities to separate portions of the first and second segments and to form a sealed cavity that surrounds the first segment. A bridge segment of the first wafer supports the first segment in the sealed cavity and includes one or more conductive structures to electrically connect the first and second circuits.

公开(公告)号：US20190207581A1

公开(公告)日：2019-07-04

申请号：US15857906

申请日：2017-12-29

Applicant: Texas Instruments Incorporated

Inventor： Ting-Ta Yen ,  Brian Goodlin ,  Ricky Alan Jackson ,  Nicholas Stephen Dellas

IPC: H03H9/02 ,  B81C1/00 ,  B81B7/00 ,  H03H3/007

CPC classification number: H03H9/02433 ,  B81B7/0016 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/0015 ,  B81C2203/0785 ,  H03H3/0073 ,  H03H9/02133 ,  H03H2009/0248

Abstract: In described examples of a micromechanical system (MEMS), a rigid cantilevered platform is formed on a base substrate. The cantilevered platform is anchored to the base substrate by only a single anchor point. A MEMS resonator is formed on the cantilevered platform.

公开(公告)号：US20190007020A1

公开(公告)日：2019-01-03

申请号：US15639552

申请日：2017-06-30

Applicant: Texas Instruments Incorporated

Inventor： Ting-Ta Yen

IPC: H03H9/02 ,  H03H9/17

CPC classification number: H03H9/0211 ,  H03H3/02 ,  H03H9/02015 ,  H03H9/02047 ,  H03H9/02157 ,  H03H9/172 ,  H03H2003/021 ,  H03H2003/025

Abstract: Bulk acoustic wave (BAW) resonators having convex surfaces, and methods of forming the same are disclosed. An example BAW resonator includes a first electrode, a piezoelectric layer formed on the first electrode, the piezoelectric layer having a convex surface, and a second electrode formed on the convex surface. An example integrated circuit (IC) package includes a BAW resonator disposed in the IC package, the BAW resonator including a piezoelectric layer having a convex surface.