COMPOSITE GRID STRUCTURE TO REDUCE CROSSTALK IN BACK SIDE ILLUMINATION IMAGE SENSORS
    43.
    发明申请
    COMPOSITE GRID STRUCTURE TO REDUCE CROSSTALK IN BACK SIDE ILLUMINATION IMAGE SENSORS 有权
    复合网格结构,以减少背面照明图像传感器中的CROSSTALK

    公开(公告)号:US20160276394A1

    公开(公告)日:2016-09-22

    申请号:US14663899

    申请日:2015-03-20

    Abstract: A semiconductor structure for back side illumination (BSI) pixel sensors is provided. Photodiodes are arranged within a semiconductor substrate. A metal grid overlies the semiconductor substrate and is made up of metal grid segments that surround outer perimeters of the photodiodes, respectively, such that first openings within the metal grid overlie the photodiodes, respectively. A low-n grid is made up of low-n grid segments that surround the respective outer perimeters of the photodiodes, respectively, such that second openings within the low-n grid overlie the photodiodes, respectively. Color filters are arranged in the first and second openings of the photodiodes and have a refractive index greater than a refractive index of the low-n grid. A substrate isolation grid extends into the semiconductor substrate and is made up of isolation grid segments that surround outer perimeters of the photodiodes, respectively. A method for manufacturing the BSI pixel sensors is also provided.

    Abstract translation: 提供了用于背面照明(BSI)像素传感器的半导体结构。 光电二极管布置在半导体衬底内。 金属网格覆盖半导体衬底,并且由分别围绕光电二极管的外周的金属栅格段组成,使得金属栅格内的第一开口分别覆盖在光电二极管上。 低n栅格分别由围绕光电二极管的相应外周的低n栅格段组成,使得低n栅格内的第二开口分别覆盖光电二极管。 滤光器布置在光电二极管的第一和第二开口中并且具有大于低n栅格的折射率的折射率。 衬底隔离栅格延伸到半导体衬底中,并且由分别围绕光电二极管外周的隔离栅格段组成。 还提供了用于制造BSI像素传感器的方法。

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