公开(公告)号：US20250038148A1

公开(公告)日：2025-01-30

申请号：US18403418

申请日：2024-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Chih Chen ,  Jhih-Yu Wang ,  Po-Han Wang ,  Yu-Hsiang Hu ,  Hung-Jui Kuo

IPC: H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/522 ,  H01L25/00 ,  H10B80/00

Abstract: A method includes forming a metal post over a first redistribution structure; attaching a first device die to the first redistribution structure, the first device die comprising a through via embedded in a semiconductor substrate; encapsulating the metal post and the first device die in an encapsulant, a first top surface of the encapsulant being level with a second top surface of the semiconductor substrate; recessing the second top surface to expose the through via; forming a dielectric isolation layer around the through via; forming a dielectric layer over the dielectric isolation layer; etching the dielectric layer to form a first opening and a second opening in the dielectric layer; forming a first metal via in the first opening and a second metal via in the second opening; and forming a second redistribution structure over the dielectric layer.

公开(公告)号：US11121006B2

公开(公告)日：2021-09-14

申请号：US16734421

申请日：2020-01-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Po-Han Wang ,  Hung-Jui Kuo ,  Yu-Hsiang Hu

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/367 ,  H01L23/04 ,  H01L25/00 ,  H01L21/48 ,  H01L25/065 ,  H01L23/498

Abstract: A semiconductor package and a manufacturing method of a semiconductor package are provided. The semiconductor package includes a device die, a redistribution structure, a heat dissipation module and a molding compound. The redistribution structure is disposed at a front side of the device die. The heat dissipation module includes a thermal interfacial layer and a metal lid. The thermal interfacial layer is in direct contact with a back side of the device die, and located between the device die and the metal lid. The molding compound is disposed between the redistribution structure and the heat dissipation module, and has a body portion and an extended portion. The device die is located in the extended portion. The body portion laterally surrounds the extended portion. The extended portion is thicker than the body portion.

公开(公告)号：US10854569B2

公开(公告)日：2020-12-01

申请号：US16714824

申请日：2019-12-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Chih Chen ,  Hung-Jui Kuo ,  Yu-Hsiang Hu ,  Sih-Hao Liao ,  Po-Han Wang

IPC: H01L23/00 ,  H01L25/04 ,  H01L25/11 ,  H01L25/07 ,  H01L25/075 ,  H01L25/065 ,  H01L23/538

Abstract: A package structure including at least one semiconductor die, an insulating encapsulant, an insulating layer, conductive pillars, a dummy pillar, a first seed layer and a redistribution layer is provided. The semiconductor die has a first surface and a second surface opposite to the first surface. The insulating encapsulant is encapsulating the semiconductor die. The insulating layer is disposed on the first surface of the semiconductor die and on the insulating encapsulant. The conductive pillars are located on the semiconductor die. The dummy pillar is located on the insulating encapsulant. The first seed layer is embedded in the insulating layer, wherein the first seed layer is located in between the conductive pillars and the semiconductor die, and located in between the dummy pillar and the insulating encapsulant. The redistribution layer is disposed over the insulating layer and is electrically connected to the semiconductor die through the conductive pillars.

公开(公告)号：US20200075447A1

公开(公告)日：2020-03-05

申请号：US16675227

申请日：2019-11-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Po-Han Wang ,  Hung-Jui Kuo ,  Yu-Hsiang Hu

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/3105

Abstract: A method of manufacturing a package structure includes the following processes. An adhesive layer is formed on a carrier. A die is attached to the carrier through the adhesive layer. A protection layer is formed to at least cover a sidewall and a portion of a top surface of the adhesive layer on an edge of the carrier. An encapsulant is formed over the carrier to laterally encapsulate the die. A redistribution layer (RDL) structure is formed on the die and the encapsulant. A connector is formed to electrically connect to the die through the RDL structure. The carrier is released.

公开(公告)号：US10522440B2

公开(公告)日：2019-12-31

申请号：US15846232

申请日：2017-12-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Po-Han Wang ,  Hung-Jui Kuo ,  Yu-Hsiang Hu

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/3105

Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes a die, a first encapsulant, a second encapsulant, a protection layer, a RDL structure and a connector. The first encapsulant is aside a first sidewall of the die, at least encapsulating a portion of the first sidewall of the die. The second encapsulant is aside a second sidewall of the die, encapsulating the second sidewall of the die. The protection layer is aside the first sidewall of the die and on the first encapsulant. The RDL structure is on a first surface of the die. The connector is electrically connected to the die through the RDL structure.

公开(公告)号：US10510706B2

公开(公告)日：2019-12-17

申请号：US16449448

申请日：2019-06-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Chih Chen ,  Hung-Jui Kuo ,  Yu-Hsiang Hu ,  Sih-Hao Liao ,  Po-Han Wang

IPC: H01L23/00 ,  H01L25/075 ,  H01L25/11 ,  H01L25/04 ,  H01L23/538 ,  H01L25/07 ,  H01L25/065

Abstract: A package structure including at least one semiconductor die, an insulating encapsulant, an insulating layer, conductive pillars, a dummy pillar, a first seed layer and a redistribution layer is provided. The semiconductor die have a first surface and a second surface opposite to the first surface. The insulating encapsulant is encapsulating the semiconductor die. The insulating layer is disposed on the first surface of the semiconductor die and on the insulating encapsulant. The conductive pillars are located on the semiconductor die. The dummy pillar is located on the insulating encapsulant. The first seed layer is embedded in the insulating layer, wherein the first seed layer is located in between the conductive pillars and the semiconductor die, and located in between the dummy pillar and the insulating encapsulant. The redistribution layer is disposed over the insulating layer and is electrically connected to the semiconductor die through the conductive pillars.

公开(公告)号：US20190312004A1

公开(公告)日：2019-10-10

申请号：US16449448

申请日：2019-06-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Chih Chen ,  Hung-Jui Kuo ,  Yu-Hsiang Hu ,  Sih-Hao Liao ,  Po-Han Wang

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/075 ,  H01L25/11 ,  H01L25/04 ,  H01L23/538 ,  H01L25/07

Abstract: A package structure including at least one semiconductor die, an insulating encapsulant, an insulating layer, conductive pillars, a dummy pillar, a first seed layer and a redistribution layer is provided. The semiconductor die have a first surface and a second surface opposite to the first surface. The insulating encapsulant is encapsulating the semiconductor die. The insulating layer is disposed on the first surface of the semiconductor die and on the insulating encapsulant. The conductive pillars are located on the semiconductor die. The dummy pillar is located on the insulating encapsulant. The first seed layer is embedded in the insulating layer, wherein the first seed layer is located in between the conductive pillars and the semiconductor die, and located in between the dummy pillar and the insulating encapsulant. The redistribution layer is disposed over the insulating layer and is electrically connected to the semiconductor die through the conductive pillars.