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53 条记录 (耗时 0.035 秒)

    Driving method of electronic device
    42.
    发明授权
    Driving method of electronic device 有权
    电子设备的驱动方法

    公开(公告)号：US08656230B2

    公开(公告)日：2014-02-18

    申请号：US13167126

    申请日：2011-06-23

    申请人： Yasuyuki Takahashi

    发明人： Yasuyuki Takahashi

    IPC分类号： G11C29/00 ,  H02J7/00 ,  G06F1/00

    CPC分类号： G11C29/785 ,  G11C17/18

    摘要： A method for driving an electronic device stably is provided. The electronic device includes a power supply circuit to which power is fed by power sequentially supplied from a contactless power feeding device, and a plurality of loads to which power is sequentially supplied from the power supply circuit. Further, a method for driving an electronic device stably is provided. The electronic device includes a power supply circuit to which power is fed by power supplied from a contactless power feeding device, and one or more loads to which the power supply circuit repeatedly supplies power. The power supply potential Vdd is restored to more than or equal to 90% of the initial potential Vdd0 within an interval in which the power supply circuit is not connected to a load; then, the next load may be connected to the power supply circuit, and may be driven.

    摘要翻译： 提供一种稳定地驱动电子设备的方法。 电子设备包括：电源电路，通过从非接触供电装置顺次提供的电力供电，多个负载从电源电路依次供电。 此外，提供了一种稳定地驱动电子设备的方法。 电子设备包括电源电路，通过从非接触供电装置供电的电力供给电源，以及一个或多个负载，电源电路重复供电。 在电源电路未连接到负载的间隔内，电源电位Vdd恢复到初始电位Vdd0的90％以上; 那么下一个负载可以连接到电源电路，并且可以被驱动。

    Semiconductor memory device
    43.
    发明授权
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号：US08507907B2

    公开(公告)日：2013-08-13

    申请号：US13015247

    申请日：2011-01-27

    申请人： Yasuyuki Takahashi ,  Toshihiko Saito

    发明人： Yasuyuki Takahashi ,  Toshihiko Saito

    IPC分类号： H01L27/112

    CPC分类号： G11C16/26 ,  G11C16/0433 ,  G11C2216/26 ,  H01L27/112 ,  H01L27/11206 ,  H01L27/1225

    摘要： It is to provide a semiconductor memory device in which high voltage is not needed in writing, a defect is less likely to occur, the writing time is short, and data cannot be rewritten without an increase in cost. The semiconductor memory device includes a memory element which includes a diode-connected first transistor, a second transistor whose gate is connected to one terminal of a source electrode and a drain electrode of the diode-connected first transistor, and a capacitor connected to the one terminal of the source electrode and the drain electrode of the diode-connected first transistor and the gate of the second transistor.

    摘要翻译： 提供一种在写入时不需要高电压的半导体存储器件，不太可能发生缺陷，写入时间短，并且在不增加成本的情况下不能重写数据。 该半导体存储器件包括存储元件，该存储元件包括二极管连接的第一晶体管，第二晶体管的栅极连接到源电极的一个端子和二极管连接的第一晶体管的漏极，以及连接到该二极管的第一晶体管的电容器 二极管连接的第一晶体管的源电极和漏电极以及第二晶体管的栅极。

    Semiconductor device
    44.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08358202B2

    公开(公告)日：2013-01-22

    申请号：US12003113

    申请日：2007-12-20

    申请人： Yasuyuki Takahashi

    发明人： Yasuyuki Takahashi

    IPC分类号： H04Q5/22

    CPC分类号： H04B5/0037

    摘要： It is an object to provide a highly reliable semiconductor device which operates normally even when a communication distance is extremely short. A semiconductor device which transmits/receives data by wireless communication includes a comparison circuit which compares electric power supplied form outside with electric power serving as a reference; a bias circuit portion which outputs a protection signal and a modulation signal in accordance with output of the comparison circuit; and a protection/modulation circuit which performs protection to prevent degradation and breakdown of elements of the semiconductor device and modulation to transmit data, with one circuit.

    摘要翻译： 本发明的目的是提供即使在通信距离非常短的情况下也能正常工作的高可靠性的半导体装置。 通过无线通信发送/接收数据的半导体装置包括比较电路，其将从外部供电的电力与用作基准的电力进行比较; 偏置电路部分，其根据比较电路的输出输出保护信号和调制信号; 以及保护/调制电路，其利用一个电路执行保护以防止半导体器件的元件的劣化和击穿以及用于传输数据的调制。

    Semiconductor device
    45.
    发明申请
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US20080174408A1

    公开(公告)日：2008-07-24

    申请号：US12003113

    申请日：2007-12-20

    申请人： Yasuyuki Takahashi

    发明人： Yasuyuki Takahashi

    IPC分类号： H04Q5/22

    CPC分类号： H04B5/0037

    摘要： It is an object to provide a highly reliable semiconductor device which operates normally even when a communication distance is extremely short. A semiconductor device which transmits/receives data by wireless communication includes a comparison circuit which compares electric power supplied form outside with electric power serving as a reference; a bias circuit portion which outputs a protection signal and a modulation signal in accordance with output of the comparison circuit; and a protection/modulation circuit which performs protection to prevent degradation and breakdown of elements of the semiconductor device and modulation to transmit data, with one circuit.

    摘要翻译： 本发明的目的是提供即使在通信距离非常短的情况下也能正常工作的高可靠性的半导体装置。 通过无线通信发送/接收数据的半导体装置包括比较电路，其将从外部供电的电力与用作基准的电力进行比较; 偏置电路部分，其根据比较电路的输出输出保护信号和调制信号; 以及保护/调制电路，其利用一个电路执行保护以防止半导体器件的元件的劣化和击穿以及用于传输数据的调制。

    Flare-prevention optical system, flare-prevention method, and flying height tester
    47.
    发明授权
    Flare-prevention optical system, flare-prevention method, and flying height tester 失效
    防火光学系统，防火方法和飞行高度测试仪

    公开(公告)号：US5638207A

    公开(公告)日：1997-06-10

    申请号：US516468

    申请日：1995-08-17

    申请人： Tadashi Fukuzawa ,  Teiji Hisano ,  Yasuji Ozawa ,  Yasuyuki Takahashi ,  Hiroshi Watabe

    发明人： Tadashi Fukuzawa ,  Teiji Hisano ,  Yasuji Ozawa ,  Yasuyuki Takahashi ,  Hiroshi Watabe

    IPC分类号： G11B5/455 ,  G01B11/14 ,  G02B27/00 ,  G02B27/28 ,  G11B5/60 ,  G11B33/10 ,  G02B21/20 ,  G01J4/00 ,  G02B5/30 ,  G11B13/04

    CPC分类号： G11B5/6005 ,  G02B27/0018 ,  G02B27/28 ,  G11B33/10

    摘要： An optical system is provided in which flare is prevented and, when the light reflected from a reflection component is modulated by a photoelastic phenomenon, the effect of the modulation on the measurement of the intensity of the reflected light can be eliminated, and, further, a flying height tester for a magnetic head is provided using such optical system. A multilambda plate is provided in the flare-prevention optical system for allowing the light reaching a reflection component and the light reflected from the reflection component to pass, and for allowing the phase difference between the ordinary ray and the extraordinary ray to vary by 2.pi. or more depending on the wavelength of light. Since the light passed through the multilambda plate only varies in the peak position and the peak height varies little even if the light has experienced modulation, no error occurs in the spectrum intensity of the light. A depolarizer may be substituted for the multilambda plate.

    摘要翻译： 提供了一种光学系统，其中防止闪光，并且当通过光弹现象调制从反射分量反射的光时，可以消除调制对反射光强度的测量的影响，此外， 使用这种光学系统提供用于磁头的飞行高度测试仪。 在防火光学系统中设置有多射极板，用于允许光到达反射分量，并且从反射分量反射的光通过，并且为了允许普通光线和非凡光线之间的相位差变化2π 或更多取决于光的波长。 由于通过多谱板的光仅在峰值位置变化，并且峰值高度变化很小，即使光经过调制，光的光谱强度也不会发生错误。 去极化器可以代替多极板。

    Apparatus and method for testing the waterproofness of a camera casing
    48.
    发明授权
    Apparatus and method for testing the waterproofness of a camera casing 失效
    用于测试相机外壳防水性的装置和方法

    公开(公告)号：US5241852A

    公开(公告)日：1993-09-07

    申请号：US944843

    申请日：1992-09-14

    申请人： Yasuyuki Takahashi ,  Akihiro Arai

    发明人： Yasuyuki Takahashi ,  Akihiro Arai

    IPC分类号： G01M3/26 ,  G01M3/04 ,  G01M3/10 ,  G01M3/32 ,  G03B17/08

    CPC分类号： G01M3/3209 ,  G01M3/10 ,  G01M3/3236 ,  G03B17/08

    摘要： An apparatus for testing the waterproofness of a casing having divided casing elements which are connected to each other at opposite end surfaces thereof, includes a dummy casing made from liquid rubber material which has been cured, after a connecting end surface of one of the divided casing elements has been inserted therein, to form a recessed groove corresponding to the connecting end surface. A connecting end surface of one of the divided casing elements is then depressed against the recessed groove of the dummy casing to form a sealed assembly. The waterproofness of the casing can then be determined by determining the waterproofness of the assembly.

    摘要翻译： 一种用于测试壳体的防水性的装置，其具有在其相对端面处彼此连接的分隔的壳体元件，包括由液体橡胶材料制成的虚拟外壳，该虚拟外壳在已分离的壳体中的一个的连接端面 元件已经插入其中，以形成对应于连接端表面的凹槽。 然后将一个分开的壳体元件的连接端面压靠在虚拟外壳的凹槽上，以形成密封组件。 然后可以通过确定组件的防水性来确定套管的防水性。