公开(公告)号：US08420762B2

公开(公告)日：2013-04-16

申请号：US12973534

申请日：2010-12-20

申请人： Tsutomu Kashiwagi

发明人： Tsutomu Kashiwagi

IPC分类号： C08G77/12

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08K5/101 ,  C08L83/04 ,  H01L24/29 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00

摘要： The present invention provides a silicone resin composition comprising (A) an organopolysiloxane having at least two alkenyl groups, (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each bonded to a silicon atom, (C) a catalyst comprising a platinum group metal, (D) fine silicone particles, and (E) a (meth)acrylate compound. The present silicone resin composition cures in a short time to form a cured product having excellent adhesion strength with solder resists and copper substrates.

摘要翻译： 本发明提供一种有机硅树脂组合物，其包含（A）具有至少两个烯基的有机聚硅氧烷，（B）具有至少两个与硅原子键合的氢原子的有机氢聚硅氧烷，（C）包含铂族金属的催化剂， （D）精细硅氧烷颗粒和（E）（甲基）丙烯酸酯化合物。 本发明的有机硅树脂组合物在短时间内固化以形成与阻焊剂和铜基材具有优异粘合强度的固化产物。

公开(公告)号：US08088856B2

公开(公告)日：2012-01-03

申请号：US12617919

申请日：2009-11-13

申请人： Toshio Shiobara ,  Tsutomu Kashiwagi ,  Yusuke Taguchi

发明人： Toshio Shiobara ,  Tsutomu Kashiwagi ,  Yusuke Taguchi

IPC分类号： C08L83/00 ,  C08K3/22 ,  C08K3/36 ,  C08K3/18 ,  C08K3/30

CPC分类号： C08G59/306 ,  C08G59/3245 ,  C08G59/42

摘要： A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).

摘要翻译： 产生具有优异的耐热性和耐光性的固化产物的热固化树脂组合物和使用该组合物成型的预成型包装。 热固性树脂组合物包含下列成分（A）〜（E）：（A）在各分子内含有至少一个环氧基的异氰脲酸衍生物，其量为100质量份，（B）有机硅树脂 在各分子内含有至少一个环氧基，其量为10〜1000质量份，（C）酸酐固化剂，其量使得[组分（A）和组分 （C）成分中的（B）/羧基当量]在0.6〜2.2的范围内，（D）固化促进剂的含量为0.05〜5质量份，相对于100质量份 组分（A），（B）和（C）的质量和（E）无机填料的量为每100质量份组分（A），（B ）和（C）。

公开(公告)号：US08017246B2

公开(公告)日：2011-09-13

申请号：US11937425

申请日：2007-11-08

申请人： Yasumasa Morita ,  Nicolaas Joseph Martin van Leth ,  Cheun Jye Yow ,  Wai Choo Chai ,  Kinya Kodama ,  Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Yasumasa Morita ,  Nicolaas Joseph Martin van Leth ,  Cheun Jye Yow ,  Wai Choo Chai ,  Kinya Kodama ,  Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： B32B9/04 ,  C08G77/12 ,  C08G77/04 ,  B05D5/06

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C09D183/04 ,  H01L33/56 ,  Y10T428/31663 ,  C08L83/00

摘要： A silicone resin composition and process for coating a light transmitting surface of an optoelectronic device is disclosed. The process involves applying a silicone resin to the light transmitting surface, and causing the silicone resin to cure to form a light transmitting protective coating on the light transmitting surface, the silicone resin having a sufficiently low proportion of organosiloxanes having molecular weights of up to about 1000, such that the protective coating includes less than about 10% of the organosiloxanes having molecular weights of up to about 1000.

摘要翻译： 公开了一种有机硅树脂组合物和用于涂覆光电子器件的透光表面的方法。 该方法包括将硅树脂施加到透光表面上，并使硅树脂固化以在透光表面上形成透光保护涂层，硅树脂具有足够低比例的分子量高达约 1000，使得保护性涂层包含小于约10％的分子量高达约1000的有机硅氧烷。

公开(公告)号：US20100125116A1

公开(公告)日：2010-05-20

申请号：US12617919

申请日：2009-11-13

申请人： Toshio Shiobara ,  Tsutomu Kashiwagi ,  Yusuke Taguchi

发明人： Toshio Shiobara ,  Tsutomu Kashiwagi ,  Yusuke Taguchi

IPC分类号： C08L83/00 ,  C08K3/22 ,  C08K3/36 ,  C08K3/18 ,  C08K3/30

CPC分类号： C08G59/306 ,  C08G59/3245 ,  C08G59/42

摘要： A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).

摘要翻译： 产生具有优异的耐热性和耐光性的固化产物的热固化树脂组合物和使用该组合物成型的预成型包装。 热固性树脂组合物包含下列成分（A）〜（E）：（A）在各分子内含有至少一个环氧基的异氰脲酸衍生物，其量为100质量份，（B）有机硅树脂 在各分子内含有至少一个环氧基，其量为10〜1000质量份，（C）酸酐固化剂，其量使得[组分（A）和组分 （C）成分中的（B）/羧基当量]在0.6〜2.2的范围内，（D）固化促进剂的含量为0.05〜5质量份，相对于100质量份 组分（A），（B）和（C）的质量和（E）无机填料的量为每100质量份组分（A），（B ）和（C）。

公开(公告)号：US20100103507A1

公开(公告)日：2010-04-29

申请号：US12582000

申请日：2009-10-20

申请人： Katsuyuki IMAZAWA ,  Tsutomu Kashiwagi

发明人： Katsuyuki IMAZAWA ,  Tsutomu Kashiwagi

IPC分类号： G02B5/20 ,  G02B5/23

CPC分类号： G02B5/003 ,  C08G77/12 ,  C08G77/20 ,  C08K5/23 ,  C08L83/04 ,  C08L83/00

摘要： A visible light-shielding silicone rubber composition is provided comprising (A) an organopolysiloxane, (B) an organohydrogenpolysiloxane, (C) a platinum catalyst, and (D) an azo dye. The azo dye has a light transmittance≦10% in a wavelength range of up to 650 nm and ≧80% in a wavelength range of at least 750 nm when a solution of the azo dye in ethanol is measured by a spectrophotometer. The composition cures into a film which shields visible light, but transmits IR light and is suited for encapsulation of LED.

摘要翻译： 提供了可见的遮光性硅橡胶组合物，其包含（A）有机聚硅氧烷，（B）有机氢聚硅氧烷，（C）铂催化剂和（D）偶氮染料。 当通过分光光度计测量偶氮染料在乙醇中的溶液时，偶氮染料具有透光率＆nlE;在高达650nm的波长范围内为10％，在至少750nm的波长范围内为≥80％。 该组合物固化成屏蔽可见光的膜，但是透射IR光并且适于封装LED。

公开(公告)号：US20090123764A1

公开(公告)日：2009-05-14

申请号：US11937425

申请日：2007-11-08

申请人： Yasumasa Morita ,  Nicolaas Joseph Martin van Leth ,  Cheun Jye Yow ,  Wai Choo Chai ,  Kinya Kodama ,  Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Yasumasa Morita ,  Nicolaas Joseph Martin van Leth ,  Cheun Jye Yow ,  Wai Choo Chai ,  Kinya Kodama ,  Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： B05D5/06 ,  B32B9/04 ,  C08F220/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C09D183/04 ,  H01L33/56 ,  Y10T428/31663 ,  C08L83/00

摘要： A silicone resin composition and process for coating a light transmitting surface of an optoelectronic device is disclosed. The process involves applying a silicone resin to the light transmitting surface, and causing the silicone resin to cure to form a light transmitting protective coating on the light transmitting surface, the silicone resin having a sufficiently low proportion of organosiloxanes having molecular weights of up to about 1000, such that the protective coating includes less than about 10% of the organosiloxanes having molecular weights of up to about 1000.

摘要翻译： 公开了一种有机硅树脂组合物和用于涂覆光电子器件的透光表面的方法。 该方法包括将硅树脂施加到透光表面上，并使硅树脂固化以在透光表面上形成透光保护涂层，硅树脂具有足够低比例的分子量高达约 1000，使得保护性涂层包含小于约10％的分子量高达约1000的有机硅氧烷。

公开(公告)号：US07521813B2

公开(公告)日：2009-04-21

申请号：US10885670

申请日：2004-07-08

申请人： Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： H01L23/29 ,  C08F283/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  H01L33/56 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

摘要： A silicone rubber composition comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organopolysiloxane of resin structure comprising SiO2 units, R3nR4pSiO0.5 units and R3qR4rSiO0.5 units wherein R3 is vinyl or allyl, R4 is a monovalent hydrocarbon group free of aliphatic unsaturation, n is 2 or 3, p is 0 or 1, n+p=3, q is 0 or 1, r is 2 or 3, q+r=3, (C) an organohydrogenpolysiloxane having at least two SiH groups, and (D) a platinum catalyst cures into a silicone rubber having excellent rubbery and strength properties and little surface tack.

摘要翻译： 一种硅橡胶组合物，其包含（A）含有至少两个脂族不饱和键的有机聚硅氧烷，（B）包含SiO 2单元的树脂结构的有机聚硅氧烷，R3nR4pSiO0.5单元和R3qR4rSiO0.5单元，其中R3是乙烯基或烯丙基，R4是一价 不含脂肪族不饱和键的烃基，n为2或3，p为0或1，n + p = 3，q为0或1，r为2或3，q + r = 3，（C）有机氢聚硅氧烷， 至少两个SiH基团，和（D）铂催化剂固化成具有优异的橡胶强度和强度性能以及很小的表面粘性的硅橡胶。

公开(公告)号：US07498085B2

公开(公告)日：2009-03-03

申请号：US10990959

申请日：2004-11-18

申请人： Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： B32B9/04

CPC分类号： C08L63/00 ,  C08G77/045 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/22 ,  C08L83/04 ,  H01L23/296 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/12044 ,  Y10T428/31511 ,  Y10T428/31663 ,  C08L83/00 ,  C08L2666/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： An epoxy/silicone mixed resin composition comprising (A′) an organosilicon compound containing at least one aliphatic unsaturated monovalent hydrocarbon group and at least one silicon atom-bonded hydroxyl group, (B) an epoxy resin containing at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, and (E) an aluminum-based curing catalyst is used to encapsulate a light-emitting semiconductor member. The light-emitting semiconductor device undergoes little discoloration in a heat test, and has a high emission efficiency, a long life and reduced energy consumption.

摘要翻译： 包含（A'）含有至少一个脂族不饱和一价烃基和至少一个硅原子键合羟基的有机硅化合物的环氧/硅氧烷混合树脂组合物，（B）含有至少一个环氧基的环氧树脂（C ）有机氢聚硅氧烷，（D）铂族金属类催化剂，（E）铝系固化催化剂用于封装发光半导体部件。 发光半导体器件在热测试中几乎不发生变色，并且具有高发光效率，长寿命和降低的能量消耗。

公开(公告)号：US20080249259A1

公开(公告)日：2008-10-09

申请号：US12078689

申请日：2008-04-03

申请人： Tsutomu Kashiwagi

发明人： Tsutomu Kashiwagi

IPC分类号： C08F283/12

CPC分类号： G02B1/041 ,  C08G77/12 ,  C08G77/16 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  C08L83/00

摘要： An addition curable silicone resin composition is provided. The composition includes two types of alkenyl group-containing organopolysiloxanes, and two types of organohydrogenpolysiloxanes, and a platinum group catalyst. The composition is cured to form a hard cured product with excellent flexibility and minimal surface tack, suited to a silicone lens.

摘要翻译： 提供了一种可加成固化的有机硅树脂组合物。 该组合物包含两种类型的含烯基的有机聚硅氧烷，和两种类型的有机氢聚硅氧烷和铂族催化剂。 固化该组合物以形成具有优异柔韧性和最小表面粘性的硬固化产品，其适用于硅胶透镜。

公开(公告)号：US07241823B2

公开(公告)日：2007-07-10

申请号：US10732519

申请日：2003-12-11

申请人： Tsutomu Kashiwagi ,  Shinji Makikawa ,  Toshiyuki Sutou ,  Toshio Shiobara

发明人： Tsutomu Kashiwagi ,  Shinji Makikawa ,  Toshiyuki Sutou ,  Toshio Shiobara

IPC分类号： C08K5/24

CPC分类号： C08L51/085 ,  C08K5/5425 ,  C08L53/00 ,  C08L83/00 ,  C08L83/06 ,  C08L2666/02 ,  C09J151/085 ,  C09J153/00 ,  C09J183/06 ,  C08L83/04

摘要： There are provided a radiation curing silicone rubber composition that is useful for the bonding of substrates, an adhesive silicone elastomer film formed from such a composition, a structural body in which two substrates are bonded via a cured layer formed from the composition, and a method of producing such a structural body. The composition includes: (a) an organohydrogenpolysiloxane containing at least one group selected from the group consisting of acryloyl groups and methacryloyl groups, and at least one hydrosilyl group; (b) a fluid organopolysiloxane with at least two groups which are each selected from the group consisting of acryloyl groups and methacryloyl groups, and with no hydrosilyl groups; (c) a compound selected from the group consisting of alkoxysilanes, partial hydrolysis-condensation products of alkoxysilanes, organosilane-modified isocyanurates and organosiloxane-modified isocyanurates; (d) a radiation sensitizer; and (e) a platinum group metal-based catalyst. The composition is of low elasticity, while also providing excellent heat resistance, adhesion, and workability.

摘要翻译： 提供了一种可用于粘合基材的辐射固化硅橡胶组合物，由这种组合物形成的粘合性硅氧烷弹性体膜，其中两个基板通过由该组合物形成的固化层结合的结构体，以及一种方法 生产这样的结构体。 该组合物包括：（a）含有选自丙烯酰基和甲基丙烯酰基的至少一个基团的有机氢聚硅氧烷和至少一个氢化硅烷基; （b）具有至少两个基团的流体有机聚硅氧烷，其各自选自丙烯酰基和甲基丙烯酰基，且不具有氢化甲硅烷基; （c）选自烷氧基硅烷，烷氧基硅烷的部分水解缩合产物，有机硅烷改性的异氰脲酸酯和有机硅氧烷改性的异氰脲酸酯的化合物; （d）辐射敏化剂; 和（e）铂族金属基催化剂。 该组合物具有低弹性，同时还提供优异的耐热性，粘合性和可加工性。