Deposition Apparatus and Methods
    42.
    发明申请

    公开(公告)号:US20190352768A1

    公开(公告)日:2019-11-21

    申请号:US16527250

    申请日:2019-07-31

    Abstract: A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns; a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.

    SYSTEMS AND METHODS FOR REMOVING OVERSPRAY
    47.
    发明申请
    SYSTEMS AND METHODS FOR REMOVING OVERSPRAY 审中-公开
    用于移除OSPSPRAY的系统和方法

    公开(公告)号:US20150197840A1

    公开(公告)日:2015-07-16

    申请号:US14575395

    申请日:2014-12-18

    CPC classification number: C23C4/18 C23C4/134

    Abstract: Systems and methods are disclosed for removing overspray from a substrate. A coating material may be plasma sprayed on a substrate utilizing Suspension Plasma Spray or Solution Precursor Plasma Spray. The plasma spray may deposit loosely adhered overspray on the substrate. A pressurized gas may be directed at the overspray to remove the overspray from the component.

    Abstract translation: 公开了用于从基板去除过喷的系统和方法。 可以使用悬浮等离子体喷雾或溶液前体等离子体喷雾将涂料等离子体喷涂在基材上。 等离子体喷涂可能会在基板上沉积松散粘附的过喷。 加压气体可以指向过喷,以从组件去除过喷。

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