公开(公告)号：US07960266B2

公开(公告)日：2011-06-14

申请号：US12791103

申请日：2010-06-01

申请人： James Kai ,  George Matamis ,  Tuan Duc Pham ,  Masaaki Higashitani ,  Takashi Orimoto

发明人： James Kai ,  George Matamis ,  Tuan Duc Pham ,  Masaaki Higashitani ,  Takashi Orimoto

IPC分类号： H01L21/336 ,  H01L21/3205 ,  H01L21/4763

CPC分类号： H01L27/115 ,  H01L27/11521 ,  H01L27/11524

摘要： High density semiconductor devices and methods of fabricating the same are provided. Spacer fabrication techniques are utilized to form circuit elements having reduced feature sizes, which in some instances are smaller than the smallest lithographically resolvable element size of the process being used. Spacers are formed that serve as a mask for etching one or more layers beneath the spacers. An etch stop pad layer having a material composition substantially similar to the spacer material is provided between a dielectric layer and an insulating sacrificial layer such as silicon nitride. When etching the sacrificial layer, the matched pad layer provides an etch stop to avoid damaging and reducing the size of the dielectric layer. The matched material compositions further provide improved adhesion for the spacers, thereby improving the rigidity and integrity of the spacers.

摘要翻译： 提供了高密度半导体器件及其制造方法。 利用间隔制造技术来形成具有减小的特征尺寸的电路元件，其在一些情况下小于正在使用的工艺的最小可光刻可分辨的元件尺寸。 形成隔板，其用作蚀刻间隔物下面的一个或多个层的掩模。 具有与间隔物材料基本相似的材料组成的蚀刻停止垫层设置在电介质层和诸如氮化硅的绝缘牺牲层之间。 当蚀刻牺牲层时，匹配的焊盘层提供蚀刻停止以避免损坏并减小电介质层的尺寸。 匹配的材料组合物还提供了用于间隔物的改进的粘合性，从而提高了间隔物的刚度和完整性。

公开(公告)号：US07732275B2

公开(公告)日：2010-06-08

申请号：US11692961

申请日：2007-03-29

申请人： Takashi Orimoto ,  George Matamis ,  Henry Chien ,  James Kai

发明人： Takashi Orimoto ,  George Matamis ,  Henry Chien ,  James Kai

IPC分类号： H01L21/8247

CPC分类号： H01L27/115 ,  H01L27/11521 ,  H01L27/11524

摘要： A string of nonvolatile memory cells connected in series includes fixed charges located between floating gates and the underlying substrate surface. Such a fixed charge affects distribution of charge carriers in an underlying portion of the substrate and thus affects threshold voltage of a device. A fixed charge layer may extend over source/drain regions also.

摘要翻译： 一串串联的非易失性存储单元包括位于浮置栅极和下面的衬底表面之间的固定电荷。 这样的固定电荷会影响衬底的下层部分中电荷载流子的分布，从而影响器件的阈值电压。 固定电荷层也可以在源极/漏极区域上延伸。

公开(公告)号：US07704832B2

公开(公告)日：2010-04-27

申请号：US12058512

申请日：2008-03-28

申请人： James Kai ,  Tuan Pham ,  Masaaki Higashitani ,  George Matamis ,  Takashi Orimoto

发明人： James Kai ,  Tuan Pham ,  Masaaki Higashitani ,  George Matamis ,  Takashi Orimoto

IPC分类号： H01L21/8247

CPC分类号： H01L27/11529 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11526 ,  H01L27/11536 ,  H01L27/11539

摘要： Non-volatile memory and integrated memory and peripheral circuitry fabrication processes are provided. Sets of charge storage regions, such as NAND strings including multiple non-volatile storage elements, are formed over a semiconductor substrate using a layer of charge storage material such as a first layer of polysilicon. An intermediate dielectric layer is provided over the charge storage regions. A layer of conductive material such as a second layer of polysilicon is deposited over the substrate and etched to form the control gates for the charge storage regions and the gate regions of the select transistors for the sets of storage elements. The first layer of polysilicon is removed from a portion of the substrate, facilitating fabrication of the select transistor gate regions from only the second layer of polysilicon. Peripheral circuitry formation is also incorporated into the fabrication process to form the gate regions for devices such as high voltage and logic transistors. The gate regions of these devices can be formed from the layer forming the control gates of the memory array.

摘要翻译： 提供非易失性存储器和集成存储器和外围电路制造工艺。 使用诸如第一多晶硅层的电荷存储材料层在半导体衬底上形成诸如包括多个非易失性存储元件的NAND串的电荷存储区的集合。 中间电介质层设置在电荷存储区域的上方。 将诸如第二多晶硅层的导电材料层沉积在衬底上并被蚀刻以形成用于存储元件组的选择晶体管的电荷存储区域和栅极区域的控制栅极。 从衬底的一部分去除第一层多晶硅，便于仅从第二层多晶硅制造选择晶体管栅极区。 外围电路形成也被并入到制造过程中以形成诸如高电压和逻辑晶体管的器件的栅极区域。 这些器件的栅极区域可以由形成存储器阵列的控制栅极的层形成。

公开(公告)号：US20090261398A1

公开(公告)日：2009-10-22

申请号：US12105242

申请日：2008-04-17

申请人： Henry Chien ,  Takashi Orimoto ,  George Matamis ,  James Kai ,  Vinod R. Purayath

发明人： Henry Chien ,  Takashi Orimoto ,  George Matamis ,  James Kai ,  Vinod R. Purayath

IPC分类号： H01L29/788

CPC分类号： G11C8/10 ,  G11C8/04 ,  G11C11/5621 ,  G11C16/0483 ,  G11C19/00 ,  H01L21/28273 ,  H01L27/11521

摘要： A non-volatile storage system in which a sidewall insulating layer of a floating gate is significantly thinner than a thickness of a bottom insulating layer, and in which raised source/drain regions are provided. During programming or erasing, tunneling occurs predominantly via the sidewall insulating layer and the raised source/drain regions instead of via the bottom insulating layer. The floating gate may have a uniform width or an inverted T shape. The raised source/drain regions may be epitaxially grown from the substrate, and may include a doped region above an undoped region so that the channel length is effectively extended from beneath the floating gate and up into the undoped regions, so that short channel effects are reduced. The ratio of the thicknesses of the sidewall insulating layer to the bottom insulating layer may be about 0.3 to 0.67.

摘要翻译： 一种非易失性存储系统，其中浮动栅极的侧壁绝缘层比底部绝缘层的厚度明显薄，并且其中设置有凸起的源极/漏极区域。 在编程或擦除期间，隧道主要通过侧壁绝缘层和凸起的源极/漏极区域而不是通过底部绝缘层发生。 浮动门可以具有均匀的宽度或倒T形。 凸起的源极/漏极区域可以从衬底外延生长，并且可以包括在未掺杂区域上方的掺杂区域，使得沟道长度从浮置栅极下方有效地延伸并且向上延伸到未掺杂区域，使得短沟道效应为 减少 侧壁绝缘层与底部绝缘层的厚度的比例可以为约0.3至0.67。

公开(公告)号：US20080242006A1

公开(公告)日：2008-10-02

申请号：US11692961

申请日：2007-03-29

申请人： Takashi Orimoto ,  George Matamis ,  Henry Chien ,  James Kai

发明人： Takashi Orimoto ,  George Matamis ,  Henry Chien ,  James Kai

IPC分类号： H01L21/77

CPC分类号： H01L27/115 ,  H01L27/11521 ,  H01L27/11524

摘要： A string of nonvolatile memory cells connected in series includes fixed charges located between floating gates and the underlying substrate surface. Such a fixed charge affects distribution of charge carriers in an underlying portion of the substrate and thus affects threshold voltage of a device. A fixed charge layer may extend over source/drain regions also.

摘要翻译： 一串串联的非易失性存储单元包括位于浮置栅极和下面的衬底表面之间的固定电荷。 这样的固定电荷会影响衬底的下层部分中电荷载流子的分布，从而影响器件的阈值电压。 固定电荷层也可以在源极/漏极区域上延伸。

公开(公告)号：US20080239819A1

公开(公告)日：2008-10-02

申请号：US11692958

申请日：2007-03-29

申请人： Takashi Orimoto ,  George Matamis ,  Henry Chien ,  James Kai

发明人： Takashi Orimoto ,  George Matamis ,  Henry Chien ,  James Kai

IPC分类号： G11C11/34

CPC分类号： H01L27/11521 ,  H01L21/28273 ,  H01L29/42324 ,  H01L29/7881

摘要： A string of nonvolatile memory cells connected in series includes fixed charges located between floating gates and the underlying substrate surface. Such a fixed charge affects distribution of charge carriers in an underlying portion of the substrate and thus affects threshold voltage of a device. A fixed charge layer may extend over source/drain regions also.

摘要翻译： 一串串联的非易失性存储单元包括位于浮置栅极和下面的衬底表面之间的固定电荷。 这样的固定电荷会影响衬底的下层部分中电荷载流子的分布，从而影响器件的阈值电压。 固定电荷层也可以在源极/漏极区域上延伸。

公开(公告)号：US20080171415A1

公开(公告)日：2008-07-17

申请号：US11626784

申请日：2007-01-24

申请人： Henry Chien ,  George Matamis ,  Takashi Orimoto ,  James Kai

发明人： Henry Chien ,  George Matamis ,  Takashi Orimoto ,  James Kai

IPC分类号： H01L21/336

CPC分类号： H01L27/115 ,  H01L27/11521 ,  H01L27/11524

摘要： A string of nonvolatile memory cells are connected together by source/drain regions that include an inversion layer created by fixed charge in an overlying layer. Control gates extend between floating gates so that two control gates couple to a floating gate. A fixed charge layer may be formed by plasma nitridation.

摘要翻译： 一系列非易失性存储单元通过源/漏区连接在一起，其包括在上层中由固定电荷产生的反型层。 控制栅极在浮动栅极之间延伸，使得两个控制栅极耦合到浮动栅极。 可以通过等离子体氮化形成固定电荷层。

公开(公告)号：US20100240182A1

公开(公告)日：2010-09-23

申请号：US12791103

申请日：2010-06-01

申请人： James Kai ,  George Matamis ,  Tuan Duc Pham ,  Masaaki Higashitani ,  Takashi Orimoto

发明人： James Kai ,  George Matamis ,  Tuan Duc Pham ,  Masaaki Higashitani ,  Takashi Orimoto

IPC分类号： H01L21/336

CPC分类号： H01L27/115 ,  H01L27/11521 ,  H01L27/11524

摘要： High density semiconductor devices and methods of fabricating the same are provided. Spacer fabrication techniques are utilized to form circuit elements having reduced feature sizes, which in some instances are smaller than the smallest lithographically resolvable element size of the process being used. Spacers are formed that serve as a mask for etching one or more layers beneath the spacers. An etch stop pad layer having a material composition substantially similar to the spacer material is provided between a dielectric layer and an insulating sacrificial layer such as silicon nitride. When etching the sacrificial layer, the matched pad layer provides an etch stop to avoid damaging and reducing the size of the dielectric layer. The matched material compositions further provide improved adhesion for the spacers, thereby improving the rigidity and integrity of the spacers.

摘要翻译： 提供了高密度半导体器件及其制造方法。 利用间隔制造技术来形成具有减小的特征尺寸的电路元件，其在一些情况下小于正在使用的工艺的最小光刻可分辨元件尺寸。 形成隔板，其用作蚀刻间隔物下面的一个或多个层的掩模。 具有与间隔物材料基本相似的材料组成的蚀刻停止垫层设置在电介质层和诸如氮化硅的绝缘牺牲层之间。 当蚀刻牺牲层时，匹配的焊盘层提供蚀刻停止以避免损坏并减小电介质层的尺寸。 匹配的材料组合物还提供了用于间隔物的改进的粘合性，从而提高了间隔物的刚度和完整性。

公开(公告)号：US07795080B2

公开(公告)日：2010-09-14

申请号：US12014689

申请日：2008-01-15

申请人： Takashi Orimoto ,  George Matamis ,  James Kai ,  Tuan Pham ,  Masaaki Higashitani ,  Henry Chien

发明人： Takashi Orimoto ,  George Matamis ,  James Kai ,  Tuan Pham ,  Masaaki Higashitani ,  Henry Chien

IPC分类号： H01L21/82

CPC分类号： H01L27/115 ,  G11C16/0483 ,  H01L27/11521

摘要： Methods of fabricating integrated circuit devices are provided using composite spacer formation processes. A composite spacer structure is used to pattern and etch the layer stack when forming select features of the devices. A composite storage structure includes a first spacer formed from a first layer of spacer material and second and third spacers formed from a second layer of spacer material. The process is suitable for making devices with line and space sizes at less then the minimum resolvable feature size of the photolithographic processes being used. Moreover, equal line and space sizes at less than the minimum feature size are possible. In one embodiment, an array of dual control gate non-volatile flash memory storage elements is formed using composite spacer structures. When forming the active areas of the substrate, with overlying strips of a layer stack and isolation regions therebetween, a composite spacer structure facilitates equal lengths of the strips and isolation regions therebetween.

摘要翻译： 使用复合间隔物形成工艺提供制造集成电路器件的方法。 当形成设备的选择特征时，使用复合间隔物结构来图案化和蚀刻层堆叠。 复合存储结构包括由第一隔离物材料层形成的第一间隔物和由第二隔离物材料层形成的第二和第三间隔物。 该方法适用于制造具有小于所使用的光刻工艺的最小可分辨特征尺寸的线和空间尺寸的装置。 此外，等于线和空间尺寸小于最小特征尺寸是可能的。 在一个实施例中，使用复合间隔结构形成双控制非易失性闪存存储元件阵列。 当形成衬底的活性区域时，具有叠层的叠层和隔离区之间的复合间隔结构有利于条之间的等长长度和隔离区。

公开(公告)号：US07773403B2

公开(公告)日：2010-08-10

申请号：US11623315

申请日：2007-01-15

申请人： James Kai ,  George Matamis ,  Tuan Duc Pham ,  Masaaki Higashitani ,  Takashi Orimoto

发明人： James Kai ,  George Matamis ,  Tuan Duc Pham ,  Masaaki Higashitani ,  Takashi Orimoto

IPC分类号： G11C5/06

CPC分类号： H01L27/115 ,  H01L27/11521 ,  H01L27/11524

摘要： High density semiconductor devices and methods of fabricating the same are provided. Spacer fabrication techniques are utilized to form circuit elements having reduced feature sizes, which in some instances are smaller than the smallest lithographically resolvable element size of the process being used. Spacers are formed that serve as a mask for etching one or more layers beneath the spacers. An etch stop pad layer having a material composition substantially similar to the spacer material is provided between a dielectric layer and an insulating sacrificial layer such as silicon nitride. When etching the sacrificial layer, the matched pad layer provides an etch stop to avoid damaging and reducing the size of the dielectric layer. The matched material compositions further provide improved adhesion for the spacers, thereby improving the rigidity and integrity of the spacers.

摘要翻译： 提供了高密度半导体器件及其制造方法。 利用间隔器制造技术来形成具有减小的特征尺寸的电路元件，其在一些情况下小于正在使用的工艺的最小可光刻解析的元件尺寸。 形成隔板，其用作蚀刻间隔物下面的一个或多个层的掩模。 具有与间隔物材料基本相似的材料组成的蚀刻停止垫层设置在电介质层和诸如氮化硅的绝缘牺牲层之间。 当蚀刻牺牲层时，匹配的焊盘层提供蚀刻停止以避免损坏并减小电介质层的尺寸。 匹配的材料组合物还提供了用于间隔物的改进的粘合性，从而提高了间隔物的刚度和完整性。