公开(公告)号：US06683788B2

公开(公告)日：2004-01-27

申请号：US10175944

申请日：2002-06-19

申请人： Tsung-Lung Lee ,  Cheng-Tien Lai ,  Shuai Jiang

发明人： Tsung-Lung Lee ,  Cheng-Tien Lai ,  Shuai Jiang

IPC分类号： H05K720

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： An operating device (10) for detaching a heat sink (40) from a heat-generating electronic device (30) includes a bracket (12) and four handles (14) rotatably connected to the bracket. The bracket includes a pair of first beams (16) and a pair of second beams (18). The second beams perpendicularly connect with the first beams. An opening (21) is thereby defined in a central section of the bracket. A pair of symmetrically opposite pivots (20) extends from each end of each first beam. The handles each include an operating portion (22), and a pressing portion (24) perpendicular to the operating portion. A pair of pivot holes (26) is defined in two junctions of the operating portion and the pressing portion, pivotably receiving corresponding pivots of the bracket.

摘要翻译： 用于从发热电子设备（30）分离散热器（40）的操作装置（10）包括支架（12）和可旋转地连接到支架的四个手柄（14）。 支架包括一对第一梁（16）和一对第二梁（18）。 第二光束与第一光束垂直连接。 因此，在支架的中心部分中限定开口（21）。 一对对称相对的枢轴（20）从每个第一梁的每个端部延伸。 手柄各包括操作部分（22）和垂直于操作部分的按压部分（24）。 一对枢转孔（26）被限定在操作部分和按压部分的两个接合点中，可枢转地接收支架的相应枢轴。

公开(公告)号：US06538891B1

公开(公告)日：2003-03-25

申请号：US10081640

申请日：2002-02-21

申请人： Li He ,  Tsung-Lung Lee ,  Cheng-Tien Lai

发明人： Li He ,  Tsung-Lung Lee ,  Cheng-Tien Lai

IPC分类号： H05K720

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink clip assembly for attaching a heat sink (30) to a CPU (40) mounted to a motherboard (50) includes a rigid shaft (10) and two wire clips (20). The shaft includes a pressing section (12) for pressing the heat sink, two engaging sections (14) at opposite ends of the pressing section, and two stop sections (16) at outmost ends of the engaging sections. A diameter of the engaging sections is less than diameters of the pressing section and the stop sections. Each wire clip has a coiled portion (22), and two spring arms (24) extending from opposite ends of the coiled portion. Each spring arm extends perpendicularly to a central axis of the coiled portion. A hook (26) is formed at a distal end of each spring arm, for engaging with a corresponding through hole (52) of the motherboard. The heat sink is thereby attached to the motherboard.

摘要翻译： 用于将散热器（30）附接到安装到母板（50）的CPU（40）的散热片夹组件包括刚性轴（10）和两个线夹（20）。 所述轴包括用于按压所述散热器的按压部分（12），在所述按压部分的相对端处的两个接合部分（14）和在所述接合部分的最外端的两个停止部分（16）。 接合部的直径小于按压部和止挡部的直径。 每个线夹具有螺旋部分（22）和从螺旋部分的相对端延伸的两个弹簧臂（24）。 每个弹簧臂垂直于螺旋部分的中心轴线延伸。 在每个弹簧臂的远端处形成有钩子（26），用于与主板的对应的通孔（52）接合。 因此散热器附着在主板上。

公开(公告)号：US07959327B2

公开(公告)日：2011-06-14

申请号：US12422300

申请日：2009-04-13

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Chi-Yuan Lai

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Chi-Yuan Lai

IPC分类号： F21V29/00

CPC分类号： F21V29/70 ,  F21V29/004 ,  F21V29/51 ,  F21V29/75 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.

摘要翻译： LED灯包括灯壳体，由金属制成的散热器并安装在灯壳的底侧，多个LED模块和蒸汽室，其底表面连接到散热器的顶表面， 具有其上附接有LED模块的顶表面，工作液体被密封在蒸气室中。 蒸气室在其中限定了一个密封室，工作液体是相变液体，并被密封在密封室中。 多个肋布置在蒸气室中，用于加强蒸气室的完整性，并且肋将密封室分成多个连通空间。

公开(公告)号：US07768784B2

公开(公告)日：2010-08-03

申请号：US12269858

申请日：2008-11-12

申请人： Cheng-Tien Lai ,  Jin-Song Feng

发明人： Cheng-Tien Lai ,  Jin-Song Feng

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

摘要翻译： 散热组件包括散热器，围绕散热器的保持模块以及可枢转地连接到保持模块的一对线夹，以将散热器压靠印刷电路板上的电子部件。 保持模块包括围绕矩形开口的三个壁，散热器通过该壁与电子部件接触。 在三面墙上形成两个倒钩和两个支撑构件。 每个夹具包括保持在一个支撑构件中的枢转部分，将热沉朝向电子部件按压的邻接部分，以及一个锁定在一个倒钩上的锁定部分，连接该邻接部分与枢转部分的连接部分以及由 锁定部分。 每个夹子完全位于散热器的相应侧。

公开(公告)号：US07694718B2

公开(公告)日：2010-04-13

申请号：US11309811

申请日：2006-10-02

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Yi-San Liu

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Yi-San Liu

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： F28D15/0275 ,  F28D15/0233 ,  F28F1/12 ,  F28F3/02 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a first plate having a top portion and a bottom portion, a second plate projecting from the top portion of the first plate, and a plurality of fins thermally contacting the second plate. The second plate has a width larger than that of the first plate. The heat pipe includes a first portion embedded in the bottom portion of the first plate for directly contacting an electronic component to be cooled, and a second portion bent from one end of the first portion. The second portion is located at one side of the first plate, while the first portion of the heat pipe is located at a middle of the first plate.

摘要翻译： 散热器包括具有顶部和底部的第一板，从第一板的顶部突出的第二板和与第二板热接触的多个翅片。 第二板的宽度大于第一板的宽度。 热管包括嵌入在第一板的底部中的第一部分，用于直接接触待冷却的电子部件和从第一部分的一端弯曲的第二部分。 第二部分位于第一板的一侧，而热管的第一部分位于第一板的中间。

公开(公告)号：US07655079B2

公开(公告)日：2010-02-02

申请号：US11309903

申请日：2006-10-26

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： B01D19/00

CPC分类号： B01D19/0052 ,  B04C3/00 ,  B04C2003/006

摘要： A gas-liquid separation apparatus includes an inlet pipe for transferring liquid with gas dissolved therein and a separating pipe for separating the gas from the liquid. The separating pipe has a spiral-shaped guiding member therein. The separating pipe extends from the inlet pipe and is in alignment and communicating with the inlet pipe. An outlet pipe extends from a joint of the inlet pipe and the separating pipe and communicates with the separating pipe, for transferring therein the liquid after the liquid has been degassed by the spiral-shaped guiding member in the separating pipe. A gas storage device communicates with the separating pipe and outside for collecting the gas from the separating pipe and discharging the gas to the outside.

摘要翻译： 气液分离装置包括用于将溶解有气体的液体输送的入口管和用于将气体与液体分离的分离管。 分离管在其中具有螺旋形引导构件。 分离管从入口管延伸并对准并与入口管连通。 出口管从入口管和分离管的接头延伸并与分离管连通，用于在液体已经被分离管中的螺旋状引导构件脱气之后转移到其中。 气体存储装置与分离管和外部连通，用于从分离管收集气体并将气体排出到外部。

公开(公告)号：US07645330B2

公开(公告)日：2010-01-12

申请号：US11309918

申请日：2006-10-27

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： B01D19/00

CPC分类号： B01D19/0057 ,  B01D19/0031 ,  B04C3/00 ,  B04C2003/006

摘要： A gas-liquid separation apparatus includes a container and a separating pipe located in the container. The container includes an annular wall and two lids covering two ends of the wall. The container has a cavity surrounded by the wall and the two lids. An inlet extends through one lid and an outlet extends through the other lid. The separating pipe is disposed in the cavity of the container and in communication with the inlet and the outlet of the container. A plurality of apertures is defined in a body of the separating pipe and in communication with a space inside the separating pipe and the cavity of the container. The liquid with gas dissolved therein enters into the separating pipe via the inlet of the container. The liquid is degassed by the separating pipe. The de-gassed liquid exits the separating pipe via the outlet of the container.

摘要翻译： 气液分离装置包括容器和位于容器中的分离管。 容器包括一个环形壁和两个覆盖壁的两端的盖子。 容器具有由壁和两个盖子包围的空腔。 入口延伸穿过一个盖子，出口延伸穿过另一个盖子。 分离管设置在容器的空腔中并与容器的入口和出口连通。 多个孔限定在分离管的主体中并与分离管和容器的空腔内的空间连通。 溶解有气体的液体经由容器的入口进入分离管。 液体被分离管脱气。 脱气液体通过容器的出口离开分离管。

公开(公告)号：US07565925B2

公开(公告)日：2009-07-28

申请号：US11166966

申请日：2005-06-24

申请人： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Zhi-Bin Tan

发明人： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Zhi-Bin Tan

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink (10) and at least a serpent heat pipe (22). The heat sink (10) comprises a base (12) contacting with an electrical component, a heat dissipation fins group (14) secured to the base (12) and a cover (16) attached to a top of the heat dissipation fins group (14). The heat dissipating fins group (14) defines a notch (148) at one side thereof. Two end portions of the heat pipe (22) are respectively connected to the base (12) and the cover (16), and a middle portion of the heat pipe (22) is accommodated in the notch (148).

摘要翻译： 散热装置包括散热器（10）和至少一个蛇形热管（22）。 散热器（10）包括与电气部件接触的基座（12），固定到基座（12）的散热翅片组（14）和附接到散热翅片组的顶部的盖（16） 14）。 散热翅片组（14）在其一侧限定了凹口（148）。 热管（22）的两个端部分别连接到基座（12）和盖（16）上，并且热管（22）的中间部分容纳在凹口（148）中。

公开(公告)号：US07543630B2

公开(公告)日：2009-06-09

申请号：US11430504

申请日：2006-05-08

申请人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

发明人： Cheng-Tien Lai ,  Tsung-Lung Lee ,  Shenghua Wang

IPC分类号： F28D15/04

CPC分类号： F28D15/0233 ,  F28D15/04

摘要： A heat pipe includes an outer pipe (10), an inner pipe (20), and a hermetic cap (30). The outer pipe has an evaporating end (12) and a condensing end (14). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap (40) is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

公开(公告)号：US07537047B2

公开(公告)日：2009-05-26

申请号：US11308426

申请日：2006-03-23

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooling heat sink includes a base (10), a heat exchanger (30), a housing (20), an inlet (26) and an outlet (27). The heat exchanger (30) has a hollow (33) formed therein, and is thermally coupled to the base (10). The housing (20) has a chamber (24) formed therein, and is placed over the base (10). The chamber (24) is separated by the heat exchanger (30) into a first sub-chamber (241) and a second sub-chamber (242). The first sub-chamber (241) is in fluid communication with the second sub-chamber (242) through a plurality of microchannels (32) radially formed within the heat exchanger (30). The inlet (26) is fluidly connected to the first sub-chamber (241) so as to impinge liquid coolant to a top surface of the base (10).

摘要翻译： 液体冷却散热器包括基座（10），热交换器（30），壳体（20），入口（26）和出口（27）。 热交换器（30）具有形成在其中的中空部（33），并且热耦合到基座（10）。 壳体（20）具有形成在其中的室（24），并且放置在基座（10）上。 室（24）由热交换器（30）分离成第一子室（241）和第二子室（242）。 第一子室241通过在热交换器30内径向形成的多个微通道32与第二子室242流体连通。 入口（26）流体地连接到第一子室（241），以便将液体冷却剂冲击到基座（10）的顶表面。