公开(公告)号：US5651724A

公开(公告)日：1997-07-29

申请号：US524824

申请日：1995-09-07

申请人： Norio Kimura ,  Takayoshi Kawamoto ,  You Ishii ,  Katsuyuki Aoki ,  Kunio Tateishi ,  Hozumi Yasuda ,  Keisuke Namiki

发明人： Norio Kimura ,  Takayoshi Kawamoto ,  You Ishii ,  Katsuyuki Aoki ,  Kunio Tateishi ,  Hozumi Yasuda ,  Keisuke Namiki

IPC分类号： B24B37/30 ,  B24B7/00

CPC分类号： B24B37/30

摘要： A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ring and is polished by an abrasive cloth on the turntable while the workpiece is being pressed against the turntable by the top ring. While polishing, the workpiece is deformed toward the concave workpiece holding surface of the top ring, and a curvature of the deformed workpiece is controlled by the amount of liquid between the workpiece holding surface and the backside surface of the workpiece.

摘要翻译： 将诸如水的预定量的液体供应到诸如半导体晶片的工件的背面。 这种液体是工件保持液体，并且附接到顶环的凹入的工件保持表面。 工件位于转盘和顶环之间，并通过研磨布在转台上抛光，同时工件被顶环压在转台上。 在抛光时，工件朝着顶环的凹入工件保持面变形，并且变形的工件的曲率由工件保持面与工件的背面之间的液体量控制。

公开(公告)号：US08100739B2

公开(公告)日：2012-01-24

申请号：US12222908

申请日：2008-08-19

申请人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

发明人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

IPC分类号： B24B49/00

CPC分类号： B24B37/32

摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

公开(公告)号：US08070560B2

公开(公告)日：2011-12-06

申请号：US12292677

申请日：2008-11-24

申请人： Hozumi Yasuda ,  Makoto Fukushima ,  Tetsuji Togawa

发明人： Hozumi Yasuda ,  Makoto Fukushima ,  Tetsuji Togawa

IPC分类号： B24B5/00

CPC分类号： B24B37/30

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a polishing head having at least one elastic membrane configured to form a plurality of pressure chambers for being supplied with a pressurized fluid, and a controller configured to control supply of the pressurized fluid to the pressure chambers. The controller controls supply of the pressurized fluid so that the pressurized fluid is supplied first to the pressure chamber located at a central portion of the substrate when the substrate is brought into contact with the polishing surface, and then the pressurized fluid is supplied to the pressure chamber located at a radially outer side of the pressure chamber located at the central portion of the substrate.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光表面的抛光台，具有至少一个弹性膜的抛光头，所述弹性膜被构造成形成用于供应加压流体的多个压力室，以及控制器，其构造成控制加压流体供应到 压力室。 控制器控制加压流体的供给，使得当基板与抛光表面接触时，加压流体首先被供应到位于基板的中心部分处的压力室，然后将加压流体供应到压力 位于位于基板中心部分处的压力室的径向外侧的腔室。

公开(公告)号：USD633452S1

公开(公告)日：2011-03-01

申请号：US29356456

申请日：2010-02-25

申请人： Keisuke Namiki ,  Hozumi Yasuda ,  Osamu Nabeya ,  Makoto Fukushima ,  Shingo Togashi ,  Satoru Yamaki ,  Katsuhide Watanabe

设计人： Keisuke Namiki ,  Hozumi Yasuda ,  Osamu Nabeya ,  Makoto Fukushima ,  Shingo Togashi ,  Satoru Yamaki ,  Katsuhide Watanabe

公开(公告)号：US20080070479A1

公开(公告)日：2008-03-20

申请号：US11665648

申请日：2005-10-31

申请人： Osamu Nabeya ,  Tetsuji Togawa ,  Makoto Fukushima ,  Hozumi Yasuda

发明人： Osamu Nabeya ,  Tetsuji Togawa ,  Makoto Fukushima ,  Hozumi Yasuda

IPC分类号： B24B49/00 ,  B24B51/00 ,  B24B29/00 ,  B24B5/00

CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16

摘要： A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.

摘要翻译： 抛光装置（1）具有抛光垫（22），用于保持半导体晶片（W）的顶环（20），可垂直移动顶环（20）的垂直运动机构（24） 当所述顶环（20）的下表面与所述抛光垫（22）接触时，所述距离测量传感器（46）可操作以检测所述顶环（20）的位置;以及控制器（47），其可操作以 基于由距离测量传感器（46）检测到的位置，计算顶环（20）的最佳位置以对半导体晶片（W）进行抛光。 垂直运动机构（24）包括可操作以将顶环（20）移动到最佳位置的滚珠丝杆机构（30,32,38,42）。

公开(公告)号：US20070232193A1

公开(公告)日：2007-10-04

申请号：US11730142

申请日：2007-03-29

申请人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

发明人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

IPC分类号： B24B51/00

CPC分类号： B24B37/32

摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring comprises a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

公开(公告)号：US07156725B2

公开(公告)日：2007-01-02

申请号：US10481591

申请日：2002-07-10

申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

IPC分类号： B24B29/00 ,  B24B5/00

CPC分类号： B24B37/30 ,  B24B37/32

摘要： There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.

摘要翻译： 提供了一种衬底抛光机，其包括抛光表面和用于保持衬底并使其与抛光表面接触的衬底载体。 基板载体包括载体主体，用于保持待抛光基板的表面朝向抛光表面的基板的基板保持构件。 衬底保持构件以使得衬底保持构件能够朝向和远离抛光表面移动的方式安装在载体主体上。 基板研磨机还包括基板保持部件定位装置，该基板保持部件定位装置设置在基板保持部件的与保持基板相同的一侧。 衬底保持构件定位装置具有限定腔室的柔性构件，并且在引入不可压缩流体时沿朝向抛光表面的方向膨胀。

公开(公告)号：US07083507B2

公开(公告)日：2006-08-01

申请号：US11028629

申请日：2005-01-05

申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

IPC分类号： B24B7/22

CPC分类号： B24B37/30 ,  B24B41/061

摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

公开(公告)号：US20050072527A1

公开(公告)日：2005-04-07

申请号：US10972579

申请日：2004-10-26

申请人： Yoshihiro Gunji ,  Hozumi Yasuda ,  Keisuke Namiki ,  Hiroshi Yoshida

发明人： Yoshihiro Gunji ,  Hozumi Yasuda ,  Keisuke Namiki ,  Hiroshi Yoshida

IPC分类号： H01L21/304 ,  B24B37/30 ,  B24B37/32 ,  C23F1/00

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.

公开(公告)号：US06428403B1

公开(公告)日：2002-08-06

申请号：US09580832

申请日：2000-05-30

申请人： Norio Kimura ,  Hozumi Yasuda

发明人： Norio Kimura ,  Hozumi Yasuda

IPC分类号： B24B722

CPC分类号： B24B37/32 ,  B24B37/30 ,  B24B49/16 ,  B24B53/017

摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and is pressed against the polishing cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force. Relative rotation between the top ring and the presser ring is achieved during polishing.

摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置具有安装在其上表面上的抛光布的转盘和用于保持工件的顶环，并且在第一按压力下将工件压靠在抛光布上以抛光 工件。 顶环具有限定在其中的凹部，用于在其中容纳工件。 压环围绕顶环上下移动地设置，并以可变的第二按压力压在抛光布上。 第一和第二按压力彼此独立地变化，并且基于第一按压力来确定第二按压力。 在抛光期间实现顶环和压环之间的相对旋转。