Substrate holding apparatus, polishing apparatus, and polishing method
    1.
    发明申请
    Substrate holding apparatus, polishing apparatus, and polishing method 有权
    基板保持装置,抛光装置和抛光方法

    公开(公告)号:US20080318499A1

    公开(公告)日:2008-12-25

    申请号:US12222909

    申请日:2008-08-19

    IPC分类号: B24B1/00

    CPC分类号: B24B37/32

    摘要: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译: 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体,以及用于按压研磨面的保持环,保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件,该磁体保持抵靠第一构件。

    SUBSTRATE HOLDING APPARATUS, POLISHING APPARATUS, AND POLISHING METHOD
    2.
    发明申请
    SUBSTRATE HOLDING APPARATUS, POLISHING APPARATUS, AND POLISHING METHOD 有权
    基板保持装置,抛光装置和抛光方法

    公开(公告)号:US20120309277A1

    公开(公告)日:2012-12-06

    申请号:US13587371

    申请日:2012-08-16

    IPC分类号: B24B41/06

    CPC分类号: B24B37/32

    摘要: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译: 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体,以及用于按压研磨面的保持环,保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件,该磁体保持抵靠第一构件。

    Substrate holding apparatus, polishing apparatus, and polishing method
    4.
    发明申请
    Substrate holding apparatus, polishing apparatus, and polishing method 有权
    基板保持装置,抛光装置和抛光方法

    公开(公告)号:US20070232193A1

    公开(公告)日:2007-10-04

    申请号:US11730142

    申请日:2007-03-29

    IPC分类号: B24B51/00

    CPC分类号: B24B37/32

    摘要: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring comprises a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译: 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体,以及用于按压研磨面的保持环,保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件,该磁体保持抵靠第一构件。

    Substrate holding apparatus, polishing apparatus, and polishing method
    5.
    发明授权
    Substrate holding apparatus, polishing apparatus, and polishing method 有权
    基板保持装置,抛光装置和抛光方法

    公开(公告)号:US08485866B2

    公开(公告)日:2013-07-16

    申请号:US13587371

    申请日:2012-08-16

    IPC分类号: B24B29/00 B24B47/02

    CPC分类号: B24B37/32

    摘要: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译: 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体,以及用于按压研磨面的保持环,保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件,该磁体保持抵靠第一构件。

    Substrate holding apparatus, polishing apparatus, and polishing method
    6.
    发明授权
    Substrate holding apparatus, polishing apparatus, and polishing method 有权
    基板保持装置,抛光装置和抛光方法

    公开(公告)号:US08267746B2

    公开(公告)日:2012-09-18

    申请号:US12222909

    申请日:2008-08-19

    IPC分类号: B24B47/02

    CPC分类号: B24B37/32

    摘要: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译: 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体,以及用于按压研磨面的保持环,保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件,该磁体保持抵靠第一构件。

    Substrate holding apparatus, polishing apparatus, and polishing method
    7.
    发明授权
    Substrate holding apparatus, polishing apparatus, and polishing method 有权
    基板保持装置,抛光装置和抛光方法

    公开(公告)号:US07967665B2

    公开(公告)日:2011-06-28

    申请号:US11730142

    申请日:2007-03-29

    IPC分类号: B24B29/00

    CPC分类号: B24B37/32

    摘要: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译: 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体,以及用于按压研磨面的保持环,保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件,该磁体保持抵靠第一构件。

    Polishing apparatus
    9.
    发明授权
    Polishing apparatus 有权
    抛光设备

    公开(公告)号:US08357029B2

    公开(公告)日:2013-01-22

    申请号:US12747225

    申请日:2009-02-09

    IPC分类号: B24B5/00

    CPC分类号: B24B37/30

    摘要: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.

    摘要翻译: 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光面(101a)的抛光台(100),被配置为将基板保持并压靠在抛光表面(101a)上的顶环体(2),以及设置在抛光表面 所述顶环体(2)的外周部分构造成按压所述抛光表面(101a)。 用于在衬底抛光期间接收从衬底施加到保持环(3)的侧向力的支点位于衬底的中心部分的上方。

    POLISHING APPARATUS
    10.
    发明申请
    POLISHING APPARATUS 有权
    抛光装置

    公开(公告)号:US20100273405A1

    公开(公告)日:2010-10-28

    申请号:US12747225

    申请日:2009-02-09

    IPC分类号: B24B7/20 B24B41/06 B24B55/02

    CPC分类号: B24B37/30

    摘要: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.

    摘要翻译: 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光面(101a)的抛光台(100),被配置为将基板保持并压靠在抛光表面(101a)上的顶环体(2),以及设置在抛光表面 所述顶环体(2)的外周部分构造成按压所述抛光表面(101a)。 用于在衬底抛光期间接收从衬底施加到保持环(3)的侧向力的支点位于衬底的中心部分的上方。