Eyewear display device
    41.
    外观设计

    公开(公告)号:USD1029919S1

    公开(公告)日:2024-06-04

    申请号:US29716675

    申请日:2019-12-11

    Abstract: FIG. 1 is a front, right and top perspective view of an eyewear display device, showing our new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof; and,
    FIG. 8 is a rear, left and bottom perspective view thereof.

    Immersion liquid cooling tank assembly with fan

    公开(公告)号:US12004325B2

    公开(公告)日:2024-06-04

    申请号:US17654115

    申请日:2022-03-09

    CPC classification number: H05K7/203 H05K7/20318 H05K7/20381 H05K7/20818

    Abstract: An immersion liquid cooling tank assembly includes a tank, a condenser, at least one cross-flow fan, an internal wall system, a top cover, and at least one sloping wall. The tank includes a base and at least one sidewall. The base is connected to the sidewall. The condenser is located within the tank. The condenser is adapted to transform vapor into liquid. The cross-flow fan is near the condenser. The cross-flow fan produces an airflow. The internal wall system is located adjacent to the cross-flow fan to assist in directing the airflow from the cross-flow fan. The top cover is located generally opposite to the base. The sloping wall is located between the top cover and the sidewall. The sloping wall provides a closed airflow loop for the airflow produced by the cross-flow fan.

    Wearable device with antenna structure therein

    公开(公告)号:US11996633B2

    公开(公告)日:2024-05-28

    申请号:US17929900

    申请日:2022-09-06

    CPC classification number: H01Q5/378 H01Q1/273 H01Q5/20 H01Q5/371

    Abstract: A wearable device includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, and a fifth radiation element. The first radiation element has a feeding point, and is coupled to a first grounding point on the ground element. A slot region is surrounded by the first radiation element and the ground element. The second radiation element is coupled to a second grounding point on the ground element. The third radiation element is coupled to the second grounding point. The third radiation element and the second radiation element substantially extend in opposite directions. The fourth radiation element and the fifth radiation element are disposed inside the slot region. An antenna structure is formed by the first radiation element, the second radiation element, the third radiation element, the fourth radiation element, and the fifth radiation element.

    ROTATABLE BRACKET MODULE
    44.
    发明公开

    公开(公告)号:US20240172374A1

    公开(公告)日:2024-05-23

    申请号:US18057624

    申请日:2022-11-21

    CPC classification number: H05K5/0069 H05K5/0226

    Abstract: A bracket module and a computing device including the bracket module are disclosed. The bracket module includes a housing structure. The housing structure includes a plurality of slots. Each slot is configured to accept a device inserted therein. The housing structure is configured for attachment in a chassis of the computing device. The bracket module further includes a tray structure. The tray structure includes a fixed end connected to the housing structure and a free end opposite from the fixed end. The tray structure is configured to rotate relative to the housing structure about the fixed end. The bracket module further includes at least one fastener configured to engage the tray structure with the housing structure in an open position.

    Closed-loop liquid cooling system
    45.
    发明授权

    公开(公告)号:US11991867B2

    公开(公告)日:2024-05-21

    申请号:US17445239

    申请日:2021-08-17

    CPC classification number: H05K7/20781 H05K7/20254 H05K7/20272

    Abstract: A closed-loop liquid cooling system includes a liquid coolant conduit, a cold plate, a pump and a heat exchanger. The liquid coolant conduit is in proximity to a heat-generating electrical component. The liquid coolant conduit allows circulation of a liquid coolant to extract heat therefrom. The liquid coolant conduit includes an inner portion that surrounds and contains the liquid coolant, and an outer portion configured to prevent or inhibit leakage of the liquid coolant from the inner portion and also detect any leakage from the inner portion. The cold plate is in thermal communication with the liquid coolant. The pump is configured to transport the liquid coolant in the liquid coolant conduit. The heat exchanger is coupled to the liquid coolant conduit to extract heat therefrom.

    Pole mount, pole mount kit, and pole mount assembly

    公开(公告)号:US11971135B2

    公开(公告)日:2024-04-30

    申请号:US17932617

    申请日:2022-09-15

    CPC classification number: F16M13/022

    Abstract: Pole mounts, pole mount kits, and poly mount assemblies are disclosed. Each kit and assembly includes a pole mount with a mounting bracket including a pair of coupling plates and at least one retaining plate. The pair of coupling plates is coupled to opposite ends of the at least one retaining plate. The at least one retaining plate defines a mounting area between the pair of coupling plates. The pole mount further includes at least two retaining brackets coupled to the at least one retaining plate. Each of the retaining brackets includes a base, opposing side walls extending from the base, and a front wall extending from the base and located between the opposing side walls. The base, the opposing side walls, and the front wall define a retaining area. The front wall defines a cutout region contiguous with the retaining area.

    WEARABLE DEVICE
    48.
    发明公开
    WEARABLE DEVICE 审中-公开

    公开(公告)号:US20240129012A1

    公开(公告)日:2024-04-18

    申请号:US18062039

    申请日:2022-12-06

    CPC classification number: H04B7/068 G06F1/163

    Abstract: A wearable device includes a frame element and a dielectric substrate. The frame element includes a first metal element, a second metal element, and a third metal element. A first gap is provided between the first metal element and the second metal element. A second gap is provided between the second metal element and the third metal element. A third gap is provided between the third metal element and the first metal element. The dielectric substrate is surrounded by the first metal element, the second metal element, and the third metal element. A first antenna element is formed by the first metal element. A second antenna element is formed by the second metal element. A third antenna element is formed by the third metal element.

    FORCE FEEDBACK MODULE
    49.
    发明公开

    公开(公告)号:US20240115938A1

    公开(公告)日:2024-04-11

    申请号:US18147973

    申请日:2022-12-29

    CPC classification number: A63F13/285 A63F13/24

    Abstract: A force feedback module is provided. The force feedback module includes a trigger element, an actuating element, and a transmission assembly disposed between the trigger element and the actuating element. The transmission assembly includes a first transmission element. The first transmission element and the trigger element change between a contact state and a non-contact state. When the first transmission element and the trigger element are in the contact state, a driving force generated by the actuating element is transmitted to the trigger element via the transmission assembly to generate force feedback.

    BIOS performance mode configuration deployment

    公开(公告)号:US11941410B2

    公开(公告)日:2024-03-26

    申请号:US17577752

    申请日:2022-01-18

    CPC classification number: G06F9/4406 G06F3/0482 G06F9/44505 G06F11/3466

    Abstract: Systems and methods for generating, distributing, and using performance mode BIOS configurations are disclosed. Each performance mode BIOS configuration can be a unique set of BIOS setting values that have been established to optimize a particular performance parameter or set of performance parameters, such as boot speed or operating system installation speed. Based on a given hardware configuration and/or set of performance parameters, one or more performance mode BIOS configurations can be packaged and transferred to a memory of a BMC in the form of one or more configuration payloads. The BIOS Setup Utility can display all configuration payloads, such as listed by the type of performance mode (e.g., “Boot Speed Performance Mode” and “OS Installation Performance Mode”), that are available in the BMC memory and allow a user to overwrite the memory containing the current BIOS configuration with a selected configuration payload.

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