公开(公告)号：US20140320220A1

公开(公告)日：2014-10-30

申请号：US14236587

申请日：2012-11-20

Applicant: Guangdong Dapu Telecom Technology Co., Ltd.

Inventor： Chaosheng Liu

IPC: H03L1/04 ,  H05K3/30

CPC classification number: H03L1/04 ,  H05K3/30 ,  Y10T29/4913

Abstract: The present invention discloses an Oven Controlled Crystal Oscillator and a manufacturing method thereof. The Oven Controlled Crystal Oscillator comprises a thermostatic bath, a heating device, a PCB and a signal generating element, where the signal generating element is used for generating a signal of a certain frequency, the heating device, the PCB and the signal generating element are mounted in the thermostatic bath, the signal generating element is mounted in a groove formed on one side of the PCB, while the heating device is mounted against the other side of the PCB that is opposite to the groove. The signal generating element may be a passive crystal resonator or an active crystal oscillator. The Oven Controlled Crystal Oscillator according to the invention is advantageous for a small volume and a high temperature control precision.

Abstract translation: 本发明公开了一种烤箱控制晶体振荡器及其制造方法。 烤箱控制晶体振荡器包括恒温槽，加热装置，PCB和信号发生元件，其中信号产生元件用于产生特定频率的信号，加热装置，PCB和信号产生元件是 安装在恒温槽中，信号发生元件安装在形成在PCB的一侧上的凹槽中，而加热装置抵靠与凹槽相对的PCB的另一侧安装。 信号发生元件可以是无源晶体谐振器或有源晶体振荡器。 根据本发明的烤箱控制晶体振荡器对于小体积和高温度控制精度是有利的。

公开(公告)号：US20140085015A1

公开(公告)日：2014-03-27

申请号：US14037400

申请日：2013-09-26

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： KAZUO AKAIKE ,  TSUKASA KOBATA ,  SHINICHI SATO

IPC: H03L1/04

CPC classification number: H03L1/04 ,  H03L1/026 ,  H03L1/027 ,  H03L7/18

Abstract: An oscillation device is provided. The oscillation device includes: a main circuit portion, a heating unit, first and second crystal units, first and second oscillator circuits, a frequency difference detector, a first addition unit, an integration circuit unit, a circuit unit configured to control an electric power to be supplied to the heating unit, a compensation value obtaining unit, and a second addition unit. The compensation value obtaining unit is configured to obtain a frequency compensation value for compensating an output frequency of the main circuit portion based on an integrated value output from the integration circuit unit, and based on a change in the clock signal due to a difference between the temperature of the atmosphere and the temperature setting value of the heating unit. The second addition unit is configured to add the frequency compensation value to a frequency setting value.

Abstract translation: 提供振荡装置。 振荡装置包括：主电路部分，加热单元，第一和第二晶体单元，第一和第二振荡器电路，频率差检测器，第一加法单元，积分电路单元，被配置为控制电力的电路单元 被提供给加热单元，补偿值获取单元和第二加法单元。 补偿值获取单元被配置为基于从积分电路单元输出的积分值来获得用于补偿主电路部分的输出频率的频率补偿值，并且基于由于时钟信号之间的差异而导致的时钟信号的变化 气氛的温度和加热单元的温度设定值。 第二加法单元被配置为将频率补偿值添加到频率设定值。

公开(公告)号：US20130300510A1

公开(公告)日：2013-11-14

申请号：US13874683

申请日：2013-05-01

Applicant: SEIKO EPSON CORPORATION

Inventor： Tomohiro TAMURA ,  Yoshiyuki MAKI ,  Noriaki TANAKA

IPC: H03L1/02

CPC classification number: H03L1/02 ,  G04F5/145 ,  G04G3/04 ,  G04R20/02 ,  H03L1/04 ,  H03L7/099

Abstract: An oscillating device includes an atomic oscillator, an oven controlled crystal oscillator, a correcting unit configured to correct an output signal of the oven controlled crystal oscillator on the basis of an output signal of the atomic oscillator, a housing configured to house the atomic oscillator and the oven controlled crystal oscillator, and a temperature adjusting unit configured to adjust the temperature in the housing to a predetermined temperature.

Abstract translation: 振荡装置包括原子振荡器，烤箱控制的晶体振荡器，校正单元，被配置为基于原子振荡器的输出信号来校正烤箱控制的晶体振荡器的输出信号;壳体，被配置为容纳原子振荡器;以及 烤箱控制的晶体振荡器和温度调节单元，其被配置为将壳体中的温度调节到预定温度。

公开(公告)号：US08558629B2

公开(公告)日：2013-10-15

申请号：US13309579

申请日：2011-12-02

Applicant: Fumio Asamura ,  Takehito Ishii

Inventor： Fumio Asamura ,  Takehito Ishii

IPC: H03B5/32

CPC classification number: H03L1/04

Abstract: A temperature-controlled crystal oscillating unit and oscillator are provided, which can stabilize an output frequency thereof, have firmness against shock of falling etc., and are suitable for miniaturization and mass production. A crystal blank for the temperature-controlled crystal oscillating unit is formed by an inner region which is an oscillating plate; an outer region which surrounds the periphery of the inner region; and a connection portion which connects the inner region with the outer region. Electrodes are formed on two surfaces of the inner region, and a heater and a temperature sensor are disposed to surround the periphery of the electrode on one surface of the inner region where the electrode is formed thereon. The electrodes, the heater and the temperature sensor are respectively connected with terminals on the outer region by leads. A contact area between the temperature sensor and a crystal is increased.

Abstract translation: 提供了温度控制的晶体振荡单元和振荡器，其可以稳定其输出频率，具有抵抗下降等的冲击的坚固性，并且适合于小型化和批量生产。 用于温度控制的晶体振荡单元的晶体坯体由作为振荡板的内部区域形成; 围绕所述内部区域的周边的外部区域; 以及将内部区域与外部区域连接的连接部。 电极形成在内部区域的两个表面上，并且加热器和温度传感器设置成围绕形成电极的内部区域的一个表面上的电极的周边。 电极，加热器和温度传感器分别通过引线与外部区域的端子连接。 温度传感器和晶体之间的接触面积增大。

公开(公告)号：US20130214869A1

公开(公告)日：2013-08-22

申请号：US13770668

申请日：2013-02-19

Applicant: Renesas Electronics Corporation

Inventor： Tomokazu MATSUZAKI ,  Kazutoshi SAKO

IPC: G05F1/567 ,  H02M3/156 ,  H03L1/04

CPC classification number: G05F1/567 ,  H02M3/156 ,  H03K3/011 ,  H03K3/02315 ,  H03L1/022 ,  H03L1/04

Abstract: A semiconductor device includes: a resistance R whose resistance value varies in response to a substrate temperature variation; a resistance corrector that is coupled in series with the resistance R and switches its resistance value by a preset resistance step width to suppress a resistance value variation of the resistance R; a first voltage generator for generating a first voltage that varies in response to the substrate temperature; a second voltage generator for generating second voltages Vf1 to Vfn−1 for specifying the first voltage at a point when a switching operation of the resistance value of the resistance corrector is performed; and a resistance switch unit for switching the resistance value of the resistance corrector by comparing the first voltage and the second voltages Vf1 to Vfn−1.

Abstract translation: 半导体器件包括：电阻R，其电阻值响应于衬底温度变化而变化; 电阻校正器，其与电阻R串联耦合，并将其电阻值切换预设电阻步长以抑制电阻R的电阻值变化; 用于产生响应于衬底温度变化的第一电压的第一电压发生器; 第二电压发生器，用于产生第二电压Vf1至Vfn-1，用于在执行电阻校正器的电阻值的开关操作时指定第一电压; 以及电阻开关单元，用于通过比较第一电压和第二电压Vf1至Vfn-1来切换电阻校正器的电阻值。

公开(公告)号：US08294526B2

公开(公告)日：2012-10-23

申请号：US12571774

申请日：2009-10-01

Applicant: James L. Stolpman

Inventor： James L. Stolpman

IPC: H03L1/04

CPC classification number: H03L1/04

Abstract: An oscillator assembly includes a substrate having a top surface, a bottom surface, and a plurality of side surfaces. At least one of the side surfaces has at least one castellation which is covered with conductive material and includes a lower end spaced from the bottom surface of the substrate. The space is defined by an elongate groove in the side surface which is devoid of conductive material and extends between the lower end of the castellation and the bottom surface of the substrate to eliminate the risk of a short circuit with any of the connection pads on a customer's motherboard. The oscillator assembly further incorporates an oscillator circuit in which a current limiting resistor is located in series between the power supply and the heater control circuit.

Abstract translation: 振荡器组件包括具有顶表面，底表面和多个侧表面的基底。 侧表面中的至少一个具有至少一个被导电材料覆盖的城堡，并且包括与基底的底表面间隔开的下端。 该空间由侧表面中的细长凹槽限定，其不具有导电材料，并且在该基座的下端与基底的底表面之间延伸，以消除与一个连接垫上的任何连接垫短路的风险 客户主板。 振荡器组件还包括振荡器电路，其中限流电阻串联在电源和加热器控制电路之间。

公开(公告)号：US08248173B2

公开(公告)日：2012-08-21

申请号：US12768501

申请日：2010-04-27

Applicant: Stanley R. Shanfield ,  Thomas A. Langdo ,  Marc S. Weinberg ,  Albert C. Imhoff

Inventor： Stanley R. Shanfield ,  Thomas A. Langdo ,  Marc S. Weinberg ,  Albert C. Imhoff

IPC: H03B1/00 ,  H03B5/32 ,  H01L35/04 ,  H01L35/32

CPC classification number: H03L1/04 ,  H01L35/325

Abstract: A thermoelectric device transfers heat away from or toward an object using the Peltier effect. In some embodiments, the length of at least one thermoelectric element is at least ten times greater than a combined average cross-sectional dimension, orthogonal to the length, of two thermoelectric elements.

Abstract translation: 热电装置使用珀耳帖效应将热量从物体或朝向物体传递。 在一些实施例中，至少一个热电元件的长度是与两个热电元件的长度正交的组合平均截面尺寸的至少十倍。

公开(公告)号：US08232845B2

公开(公告)日：2012-07-31

申请号：US12891039

申请日：2010-09-27

Applicant: Richard C. Ruby ,  Martha K. Small

Inventor： Richard C. Ruby ,  Martha K. Small

IPC: H03B1/00

CPC classification number: H03H9/1014 ,  H01L23/10 ,  H01L2924/0002 ,  H03H9/0538 ,  H03L1/04 ,  H01L2924/00

Abstract: A device includes: a base substrate having a bonding pad and a peripheral pad, the peripheral pad encompassing the bonding pad; an acoustic resonator on the base substrate; a cap substrate having a bonding pad seal and a peripheral pad seal, the bonding pad seal bonding around the perimeter of the bonding pad and the peripheral pad seal bonding with the peripheral pad to define a hermetically sealed volume between the cap substrate and the base substrate, the cap substrate having a through hole therein over the bonding pad providing access for a connection to the bonding pad; a low-resistivity material layer region disposed on a portion of a surface of the cap substrate disposed inside the hermetically sealed volume, the material layer region being isolated from the bonding pad seal; and electronic circuitry disposed in the material layer region and electrical connected with the acoustic resonator.

Abstract translation: 一种器件包括：具有接合焊盘和外围焊盘的基底衬底，所述外围焊盘包围所述接合焊盘; 在基底基板上的声共振器; 具有接合焊盘密封件和外围焊盘密封件的盖衬底，所述接合焊盘密封件围绕所述接合焊盘的周边结合，并且所述外围焊盘密封件与所述外围焊盘接合，以限定所述盖基板和所述基板之间的气密密封体积 所述盖基板在所述焊盘上方具有通孔，所述通孔提供用于与所述焊盘的连接的通路; 所述低电阻率材料层区域设置在所述盖衬底的设置在所述密封体内的表面的一部分上，所述材料层区域与所述焊盘密封件隔离; 以及设置在材料层区域中并与声谐振器电连接的电子电路。

公开(公告)号：US20110273238A1

公开(公告)日：2011-11-10

申请号：US13144425

申请日：2009-10-26

Applicant: Chaosheng Liu

Inventor： Chaosheng Liu

IPC: H03L1/04

CPC classification number: H03L1/04

Abstract: An oven controlled crystal oscillator includes a thermostatic bath, an inner circuit board, an outer circuit board, a heating element, and a temperature sensor. The inner circuit board is positioned inside the thermostatic bath and electrically connected with the outer circuit board via a pin, and the inner circuit board has a crystal oscillation circuit. The outer circuit board has a temperature control circuit and a power supply circuit electrically connecting with the temperature control circuit. The heating element and the temperature sensor electrically connect with the outer circuit board. A though slot is formed through the outer circuit board, and the thermostatic bath is inserted into the though slot. By inserting the thermostatic bath into the though slot of the outer circuit board, the height and the weight of the oven controlled crystal oscillator are reduced, the electric connection performance is enhanced, and thus the stability of the output frequency of the oven controlled crystal oscillator is improved.

Abstract translation: 炉控晶体振荡器包括恒温槽，内电路板，外电路板，加热元件和温度传感器。 内部电路板位于恒温槽的内部，经由引脚与外部电路板电连接，内部电路板具有晶体振荡电路。 外部电路板具有与温度控制电路电连接的温度控制电路和电源电路。 加热元件和温度传感器与外部电路板电连接。 通过外部电路板形成通孔，并且将恒温槽插入到通孔中。 通过将恒温槽插入到外部电路板的通孔中，降低了控制晶体振荡器的高度和重量，提高了电连接性能，从而稳定了控制晶体振荡器的输出频率 改进了

公开(公告)号：US08022777B2

公开(公告)日：2011-09-20

申请号：US12380313

申请日：2009-02-26

Applicant: James L. Stolpman ,  Jeffrey A. McCracken

Inventor： James L. Stolpman ,  Jeffrey A. McCracken

IPC: H03L1/04

CPC classification number: H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K1/181 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2203/165

Abstract: An oscillator assembly including an oscillator seated on a pad of thermally conductive material formed on the surface of a printed circuit board and covered by a lid defining an oven for the oscillator. In one embodiment, a plurality of heaters are located on different sides of the oscillator and at least partially seated on the pad for evenly transferring heat to the pad and the oscillator. In one embodiment, the oscillator is a temperature compensated crystal oscillator and an integrated amplifier controller circuit on the printed circuit board integrates at least one operational amplifier for controlling the heater(s) and one or more transistors for providing heat to the oven. A canopy seated on the pad and covering the oscillator can be used for transferring heat more evenly to the oscillator. A cavity in the bottom of the printed circuit board defines an insulative air pocket.

Abstract translation: 一种振荡器组件，包括位于印刷电路板的表面上形成并由限定用于振荡器的烘箱的盖子覆盖的导热材料垫上的振荡器。 在一个实施例中，多个加热器位于振荡器的不同侧，并且至少部分地位于该垫上，以将热量均匀地传递到该垫和该振荡器。 在一个实施例中，振荡器是温度补偿晶体振荡器，并且印刷电路板上的集成放大器控制器电路集成了至少一个用于控制加热器的运算放大器和用于向烘箱提供热量的一个或多个晶体管。 位于垫上并覆盖振荡器的顶盖可用于将热量更均匀地传递到振荡器。 印刷电路板底部的空腔限定了绝缘气囊。