公开(公告)号：US08232845B2

公开(公告)日：2012-07-31

申请号：US12891039

申请日：2010-09-27

Applicant: Richard C. Ruby ,  Martha K. Small

Inventor： Richard C. Ruby ,  Martha K. Small

IPC: H03B1/00

CPC classification number: H03H9/1014 ,  H01L23/10 ,  H01L2924/0002 ,  H03H9/0538 ,  H03L1/04 ,  H01L2924/00

Abstract: A device includes: a base substrate having a bonding pad and a peripheral pad, the peripheral pad encompassing the bonding pad; an acoustic resonator on the base substrate; a cap substrate having a bonding pad seal and a peripheral pad seal, the bonding pad seal bonding around the perimeter of the bonding pad and the peripheral pad seal bonding with the peripheral pad to define a hermetically sealed volume between the cap substrate and the base substrate, the cap substrate having a through hole therein over the bonding pad providing access for a connection to the bonding pad; a low-resistivity material layer region disposed on a portion of a surface of the cap substrate disposed inside the hermetically sealed volume, the material layer region being isolated from the bonding pad seal; and electronic circuitry disposed in the material layer region and electrical connected with the acoustic resonator.

Abstract translation: 一种器件包括：具有接合焊盘和外围焊盘的基底衬底，所述外围焊盘包围所述接合焊盘; 在基底基板上的声共振器; 具有接合焊盘密封件和外围焊盘密封件的盖衬底，所述接合焊盘密封件围绕所述接合焊盘的周边结合，并且所述外围焊盘密封件与所述外围焊盘接合，以限定所述盖基板和所述基板之间的气密密封体积 所述盖基板在所述焊盘上方具有通孔，所述通孔提供用于与所述焊盘的连接的通路; 所述低电阻率材料层区域设置在所述盖衬底的设置在所述密封体内的表面的一部分上，所述材料层区域与所述焊盘密封件隔离; 以及设置在材料层区域中并与声谐振器电连接的电子电路。

公开(公告)号：US09479139B2

公开(公告)日：2016-10-25

申请号：US12769791

申请日：2010-04-29

Applicant: Richard C. Ruby ,  Wei Pang ,  Qiang Zou ,  Donald Lee

Inventor： Richard C. Ruby ,  Wei Pang ,  Qiang Zou ,  Donald Lee

IPC: H01L41/08 ,  H03H9/13 ,  H03H3/04 ,  H03H9/02 ,  H03H9/17

CPC classification number: H03H9/131 ,  H03H3/04 ,  H03H9/02102 ,  H03H9/173 ,  H03H9/175

Abstract: An acoustic resonator device includes a composite first electrode on a substrate, a piezoelectric layer on the composite electrode, and a second electrode on the piezoelectric layer. The first electrode includes a buried temperature compensating layer having a positive temperature coefficient. The piezoelectric layer has a negative temperature coefficient, and thus the positive temperature coefficient of the temperature compensating layer offsets at least a portion of the negative temperature coefficient of the piezoelectric layer.

公开(公告)号：US09154103B2

公开(公告)日：2015-10-06

申请号：US13361724

申请日：2012-01-30

Applicant: Richard C. Ruby

Inventor： Richard C. Ruby

IPC: H03H9/54 ,  H03H3/02 ,  H03H9/08 ,  H03H9/02

CPC classification number: H03H9/172 ,  H03H3/02 ,  H03H9/02102 ,  H03H9/08 ,  H03H9/54

Abstract: An acoustic resonator device includes an annular acoustic resonator, a heater coil and a heat sensor. The annular acoustic resonator is positioned over a trench formed in a substrate of the acoustic resonator device. The heater coil is disposed around a perimeter of the annular acoustic resonator, the heater coil including a resistor configured to receive a heater current. The heat sensor is configured to adjust the heater current in response to a temperature of the heater coil.

Abstract translation: 声谐振器装置包括环形声谐振器，加热器线圈和热传感器。 环形声谐振器位于形成在声谐振器装置的衬底中的沟槽之上。 加热器线圈围绕环形声谐振器的周边设置，加热器线圈包括被配置为接收加热器电流的电阻器。 热传感器被配置为响应于加热器线圈的温度来调节加热器电流。

公开(公告)号：US07714684B2

公开(公告)日：2010-05-11

申请号：US12115666

申请日：2008-05-06

Applicant: Richard C. Ruby ,  Ronald S. Fazzio ,  Hongjun Feng ,  Paul D. Bradley

Inventor： Richard C. Ruby ,  Ronald S. Fazzio ,  Hongjun Feng ,  Paul D. Bradley

IPC: H03H9/13 ,  H03H9/15 ,  H03H9/54

CPC classification number: H03H9/02086 ,  H03H3/02 ,  H03H9/02149 ,  H03H9/13 ,  H03H9/132 ,  H03H9/173 ,  H03H2003/0428

Abstract: Disclosed is an acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and an alternating frame region. The first electrode is adjacent the substrate, and the first electrode has an outer perimeter. The piezoelectric layer is adjacent the first electrode. The second electrode is adjacent the piezoelectric layer and the second electrode has an outer perimeter. The alternating frame region is on one of the first and second electrodes.

Abstract translation: 公开了一种包括基板，第一电极，压电材料层，第二电极和交替框架区域的声共振器。 第一电极与衬底相邻，并且第一电极具有外周边。 压电层与第一电极相邻。 第二电极邻近压电层，第二电极具有外周。 交替的框架区域在第一和第二电极之一上。

公开(公告)号：US20090079514A1

公开(公告)日：2009-03-26

申请号：US11860107

申请日：2007-09-24

Applicant: Tiberiu Jamneala ,  Martha Small ,  Richard C. Ruby

Inventor： Tiberiu Jamneala ,  Martha Small ,  Richard C. Ruby

IPC: H03H9/70 ,  H03H9/58

CPC classification number: H03H9/60 ,  H03H9/584 ,  H03H9/585 ,  H03H9/587 ,  H03H9/589

Abstract: A hybrid acoustic resonator filter and a communication device with a hybrid acoustic resonator filter is described.

Abstract translation: 描述了一种混合声学谐振滤波器和具有混合声谐振滤波器的通信装置。

公开(公告)号：US06874211B2

公开(公告)日：2005-04-05

申请号：US09799205

申请日：2001-03-05

Applicant: Paul D. Bradley ,  John D. Larson, III ,  Richard C. Ruby

Inventor： Paul D. Bradley ,  John D. Larson, III ,  Richard C. Ruby

IPC: H01L41/22 ,  H03H3/04 ,  H03H9/17 ,  H03H9/56 ,  H04R17/00 ,  H01B13/00 ,  H03H9/00

CPC classification number: H03H9/564 ,  H03H3/04 ,  H03H2003/0428 ,  H03H2003/0471 ,  Y10T29/42

Abstract: A method for fabricating a resonator, and in particular, a thin film bulk acoustic resonator (FBAR), and a resonator embodying the method are disclosed. An FBAR is fabricated on a substrate by reducing mass from a top electrode layer. For a substrate having multiple resonators, mass is reduced from only selected resonator to provide resonators having different resonance frequencies on the same substrate.

Abstract translation: 公开了一种用于制造谐振器，特别是薄膜体声波谐振器（FBAR）的方法和体现该方法的谐振器。 通过减少从顶部电极层的质量而在衬底上制造FBAR。 对于具有多个谐振器的衬底，仅从所选择的谐振器减小质量，以在同一衬底上提供具有不同谐振频率的谐振器。

公开(公告)号：US06483229B2

公开(公告)日：2002-11-19

申请号：US09799149

申请日：2001-03-05

Applicant: John D. Larson, III ,  Paul D. Bradley ,  Richard C. Ruby

Inventor： John D. Larson, III ,  Paul D. Bradley ,  Richard C. Ruby

IPC: H01L4104

CPC classification number: H03H9/564 ,  H03H3/04 ,  H03H2003/0428 ,  H03H2003/0471

Abstract: A method for fabricating a resonator, and in particular, a thin film bulk acoustic resonator (FBAR), and a resonator embodying the method are disclosed. An FBAR is fabricated on a substrate by mass loading piezoelectric (PZ) layer between two electrodes. For a substrate having multiple resonators, only selected resonator is mass loaded to provide resonators having different resonance frequencies on the same substrate.

公开(公告)号：US06469597B2

公开(公告)日：2002-10-22

申请号：US09799204

申请日：2001-03-05

Applicant: Richard C. Ruby ,  Paul D. Bradley ,  John D. Larson, III

Inventor： Richard C. Ruby ,  Paul D. Bradley ,  John D. Larson, III

IPC: H03H956

CPC classification number: H03H9/564 ,  H03H3/04 ,  H03H2003/0428 ,  H03H2003/0471 ,  Y10T29/42

Abstract: A method for fabricating a resonator, and in particular, a thin film bulk acoustic resonator (FBAR), and a resonator embodying the method are disclosed. An FBAR is fabricated on a substrate by introducing a mass loading electrode to a bottom electrode layer. For a substrate having multiple resonators, mass loading bottom electrode is introduced for only selected resonator to provide resonators having different resonance frequencies on the same substrate.

Abstract translation: 公开了一种用于制造谐振器，特别是薄膜体声波谐振器（FBAR）的方法和体现该方法的谐振器。 通过向底部电极层引入质量负载电极，在基板上制造FBAR。 对于具有多个谐振器的基板，仅为所选择的谐振器引入质量负载底部电极，以在同一基板上提供具有不同谐振频率的谐振器。

公开(公告)号：US06384697B1

公开(公告)日：2002-05-07

申请号：US09566868

申请日：2000-05-08

Applicant: Richard C. Ruby

Inventor： Richard C. Ruby

IPC: H03H900

CPC classification number: H03H9/587 ,  H03H3/02 ,  H03H3/04 ,  H03H9/173 ,  H03H9/585

Abstract: A filter formed of acoustic resonators, where each resonator has its own cavity and a bottom electrode that spans the entirety of the cavity, so that the bottom electrode has an unsupported interior region surrounded by supported peripheral regions. In the preferred embodiment, the cavity is formed by etching a depression into the substrate, filling the depression with a sacrificial material, depositing the piezoelectric and electrode layers that define an FBAR or SBAR, and then removing the sacrificial material from the depression. Also in the preferred embodiment, the sacrificial material is removed via release holes that are limited to the periphery of the depression. Preferably, the bottom electrode is the only electrode that spans the cavity, thereby limiting the formation of parasitic FBARs or SBARs. In one embodiment, the bottom electrode includes a serpentine edge that leaves a portion of one side of the cavity free of overlap by the bottom electrode, so that a top electrode may overlap this portion. Thus, the top and bottom electrodes can overlap the same side without sandwiching the piezoelectric layer outside of the unsupported interior region.

Abstract translation: 由声谐振器形成的滤波器，其中每个谐振器具有其自身的空腔和跨越整个空腔的底部电极，使得底部电极具有被支撑的周边区域包围的无支撑的内部区域。 在优选实施例中，通过将凹陷蚀刻到基板中，用牺牲材料填充凹陷，沉积限定FBAR或SBAR的压电层和电极层，然后从凹陷中去除牺牲材料来形成空腔。 同样在优选实施例中，通过限制在凹陷周边的释放孔去除牺牲材料。 优选地，底部电极是跨越空腔的唯一电极，从而限制寄生FBAR或SBAR的形成。 在一个实施例中，底部电极包括使空腔的一侧的一部分离开由底部电极重叠的蛇形边缘，使得顶部电极可能与该部分重叠。 因此，顶部和底部电极可以重叠在同一侧，而不将压电层夹在未支撑的内部区域之外。

公开(公告)号：US5071826A

公开(公告)日：1991-12-10

申请号：US423511

申请日：1989-10-13

Applicant: John T. Anderson ,  V. K. Nagesh ,  Richard C. Ruby

Inventor： John T. Anderson ,  V. K. Nagesh ,  Richard C. Ruby

IPC: C01G3/00 ,  C04B35/45 ,  H01L39/24

CPC classification number: H01L39/2419 ,  C01G3/006 ,  C04B35/45 ,  H01L39/2429 ,  C01P2004/61 ,  C01P2004/80 ,  Y10S505/734 ,  Y10S505/785 ,  Y10T428/12354

Abstract: A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.

Abstract translation: 一种制造金属/陶瓷超导体厚膜结构的方法，包括以下步骤：制备银/超导体油墨，将油墨施加到基材上，蒸发油墨粘合剂，分解残留物中的银化合物以涂覆超导体颗粒，烧结涂覆 超导体晶粒，并通过银涂层对超导体晶粒进行氧化。 所产生的颗粒间银增加了超导体的临界电流和机械强度。